MC68302PV33C

The MC68302PV33C is an embedded microprocessor IC from NXP Semiconductors based on the M68000 core. It provides a single 8/16-bit core running at 33 MHz with integrated communications and memory-controller functionality tailored for embedded applications.

Designed for embedded system integration, the device combines on-chip communications/RISC CPM co-processor capability and DRAM controller support with a 144-LQFP (20×20) surface-mount package, offering a compact solution for systems operating at 5 V and within a 0 °C to 70 °C temperature range.

Key Features

• Core Single M68000 core offering 8/16-bit bus operation at a clock rate of 33 MHz, suitable for embedded control and processing tasks.
• Co-processors Integrated communications/RISC CPM co-processor resources to offload communications tasks and improve system-level integration.
• Memory Controller On-chip DRAM controller support to simplify memory interfacing and reduce external component count.
• Power and I/O 5 V I/O signaling, enabling compatibility with 5 V embedded systems.
• Package and Mounting 144-LQFP supplier device package (20×20) in a surface-mount form factor for compact PCB layouts and high-density assembly.
• Timing Characterization Device timing is characterized for 33 MHz operation; detailed timing parameters (clock, AS/DS, DTACK, BG/BR behavior) are documented in the product datasheet.
• Operating Range and Compliance Rated for operation from 0 °C to 70 °C and RoHS compliant.

Typical Applications

• Embedded Control Systems Single-core M68000 architecture and 33 MHz operation for general-purpose control and processing tasks in embedded products.
• Communications Equipment On-chip communications/RISC CPM co-processor capability supports protocol handling and communications-focused processing.
• Memory-Driven Embedded Designs Integrated DRAM controller simplifies interfacing to external memory for applications that require managed system memory.

Unique Advantages

• Integrated Communications and Processing: Built-in communications/RISC CPM co-processor reduces the need for separate communication controllers and lowers BOM complexity.
• On-Chip DRAM Support: DRAM controller integration streamlines memory subsystem design and eases board-level implementation.
• Compact Surface-Mount Package: 144-LQFP (20×20) package supports high-density PCB layouts and straightforward surface-mount assembly.
• Documented Timing for 33 MHz Operation: Timing parameters for 33 MHz operation are provided in the datasheet, enabling predictable system timing and integration.
• RoHS Compliant: Meets RoHS requirements for environmentally conscious designs.
• Standard Operating Range: 0 °C to 70 °C rating aligns with common commercial embedded environments.

Why Choose MC68302PV33C?

The MC68302PV33C positions itself as a compact, integrated microprocessor solution for embedded systems that require a single M68000 core at 33 MHz with on-chip communications and memory controller capabilities. Its 144-LQFP surface-mount package, 5 V I/O, and RoHS compliance make it suitable for commercial embedded designs where board space, integration, and regulatory compliance matter.

Engineers and procurement teams looking for a documented, integrated MPU option with communications co-processor resources and DRAM interfacing will find the MC68302PV33C aligns with designs that value reduced external component count and clear timing characterization for 33 MHz operation. Technical details and timing parameters are available in the product documentation to support design and validation.

Request a quote or submit an inquiry to receive pricing and availability for the MC68302PV33C and to discuss how it fits into your embedded design requirements.