MC68302EH25CB1

The MC68302EH25CB1 is an embedded microprocessor module based on the M68000 core family with a single 8/16-bit core operating at 25 MHz. Designed for embedded systems, this device integrates communications-oriented co-processing and memory controller functionality to support system-level integration.

Suited to applications that require on-chip DRAM control and communications processing, the device combines a 5 V I/O signaling environment with documented timing characteristics for the MC68302 series to support predictable bus and peripheral interfacing.

Key Features

• Core  M68000 core architecture with a single 8/16-bit core providing legacy M68000 compatibility for embedded designs.
• Clock Speed  25 MHz operating frequency for the part as specified.
• Power I/O  5 V I/O signaling as specified under Voltage Io.
• Co-processors  Integrated Communications and RISC CPM co-processor options referenced in the part specifications to support communications tasks.
• Memory Support  On-chip DRAM controller capability noted in the specifications to simplify external memory interfacing.
• Interfaces  Additional interface listed as GCI along with other series-level bus and timing definitions documented in the datasheet.
• Package and Mounting  Supplied in a 132-PQFP (46×46) package; package case listed as 132-BQFP bumpered and intended for surface-mount assembly.
• Operating Temperature  Rated for operation from 0 °C to 70 °C.
• Environmental Compliance  RoHS compliant per the product data.
• Documented Timing (Series)  Detailed timing parameters for the MC68302 series—including cycle period, clock pulse widths and bus timing at series reference frequencies—are provided in the device documentation.

Typical Applications

• Embedded Communications Modules  Integrates communications and RISC CPM co-processing to handle protocol and link-layer tasks within embedded equipment.
• Memory-Integrated Systems  On-chip DRAM controller support simplifies designs that require external DRAM for program or data storage.
• Legacy M68000-Based Designs  Provides an M68000 core and 8/16-bit bus compatibility for systems retaining M68000 family architectures.
• Surface-Mount PCB Implementations  The 132-PQFP (46×46) package and surface-mount mounting type suit compact board layouts and automated assembly.

Unique Advantages

• Integrated M68000 Core and Co-Processing: Combines the M68000 core with communications and RISC CPM co-processor functionality to reduce external component count.
• On-Chip DRAM Controller: Built-in DRAM controller support streamlines memory subsystem design and integration.
• Documented Series Timing: Series-level timing specifications (provided for reference frequencies) help engineers design predictable bus interactions and timing-sensitive interfaces.
• Standard 5 V I/O: 5 V I/O compatibility eases integration with existing 5 V embedded systems and peripheral devices.
• RoHS Compliant: Meets RoHS requirements to support lead-free manufacturing workflows.
• Surface-Mount PQFP Package: 132-pin PQFP (46×46) form factor with bumpered case facilitates compact PCB designs and automated assembly.

Why Choose MC68302EH25CB1?

The MC68302EH25CB1 positions a legacy M68000 core within an integrated embedded module that includes communications co-processing and DRAM controller support. Its documented series timing parameters and 5 V I/O make it suitable for designs that require predictable bus timing and compatibility with established 5 V systems.

This part is appropriate for engineers building embedded communications or memory-integrated systems who value component integration, documented timing references, and a surface-mount 132-pin PQFP package for compact board layouts. RoHS compliance adds alignment with lead-free production requirements.

Request a quote or submit an inquiry to receive pricing, availability, and ordering information for the MC68302EH25CB1.