MC68302FC25C

The MC68302FC25C is a single‑core microprocessor IC based on the M68000 architecture, operating at 25 MHz with an 8/16‑bit bus. Designed as an embedded MPU with integrated communications and memory controller functionality, it targets embedded designs that require a compact, surface‑mount processor solution.

Key value comes from on‑chip integration — including a communications/RISC CPM co‑processor and DRAM controller — plus a 132‑pin PQFP (46×46 mm) package and standard 5 V I/O, enabling straightforward board‑level integration in commercial temperature environments.

Key Features

• Core — M68000 single core providing established 68000 architecture processing in an embedded MPU form factor.
• Clock Speed — 25 MHz nominal operating frequency suitable for mid‑range embedded control and communications tasks.
• Bus Width — 8/16‑bit bus architecture allowing flexible data path configurations for mixed‑width peripherals and memory.
• Co‑processor and Communications — Integrated communications co‑processor (RISC CPM) and DSP/communications capability to offload protocol and data‑movement tasks.
• Memory Controller — On‑chip DRAM controller for direct interfacing to external dynamic RAM devices.
• Power and I/O — Standard 5 V I/O signaling for compatibility with legacy and contemporary system I/O levels.
• Package and Mounting — 132‑pin PQFP (46×46 mm) with bumpered BQFP option; surface‑mount mounting type for compact PCB implementation.
• Interfaces — Additional GCI interface provided for system connectivity and control functions.
• Operating Temperature — Commercial temperature range of 0 °C to 70 °C for general embedded applications.
• Regulatory — RoHS compliant.
• System‑level Timing Details — Detailed timing specifications (clock, AS/DS, BG/BR, DTACK, etc.) are documented in the MC68302 series datasheet to assist with system timing integration and validation.

Typical Applications

• Embedded Control — Use as the main MPU in embedded systems that require a M68000 core with integrated memory control and standard 5 V I/O.
• Communications Subsystems — Utilize the on‑chip CPM/RISC communications functionality for protocol handling and data movement in communications modules.
• Memory‑Centric Designs — Designs that need an integrated DRAM controller for external dynamic RAM interfacing benefit from the MC68302FC25C’s memory support.

Unique Advantages

• Integrated Communications Co‑processor: Reduces external component count by providing on‑chip CPM/RISC communications capability for protocol offload.
• On‑chip DRAM Controller: Simplifies memory subsystem design by providing native DRAM control without separate controller ICs.
• Standard 5 V I/O: Ensures compatibility with a wide range of legacy and current peripheral devices and external interfaces.
• Compact Surface‑Mount Package: 132‑pin PQFP (46×46 mm) allows high pin‑count integration in a space‑efficient, manufacturable form factor.
• Commercial Temperature Rating: Rated 0 °C to 70 °C to match typical commercial embedded deployments.
• RoHS Compliance: Meets lead‑free environmental requirements for modern production processes.

Why Choose MC68302FC25C?

The MC68302FC25C pairs a proven M68000 core with integrated communications and memory controller functionality to deliver a compact, integration‑focused MPU for embedded designs. Its 25 MHz operating point, 8/16‑bit bus, and 5 V I/O make it suitable for systems that need a balance of processor capability and on‑chip peripheral integration.

Manufactured under the MC68302 series by NXP Semiconductors, this device is appropriate for designers seeking a single‑chip solution that reduces external components and provides detailed timing information in the series datasheet to aid system integration and verification.

Request a quote or submit an inquiry to get pricing and availability for the MC68302FC25C and to discuss how it fits your design requirements.