MC68302EH25CR2

The MC68302EH25CR2 is a microprocessor IC based on the M68000 core, configured as a single core with an 8/16-bit bus and a 25 MHz clock. It is supplied in a 132-pin PQFP package and is intended for embedded microprocessor applications.

This device integrates communications and RISC CPM co-processor capabilities and includes DRAM controller functionality, making it suitable for embedded designs that require on-chip communications support and memory interfacing while operating from a 5 V I/O domain.

Key Features

• Core  M68000 core architecture with 1 core and an 8/16-bit bus width running at 25 MHz.
• Co-processors and Integration  Includes communications and RISC CPM co-processor support and on-chip DRAM controller functionality to simplify system design.
• Voltage and I/O  5 V I/O voltage compatibility for traditional embedded system interfaces.
• Package and Mounting  Supplier device package: 132‑PQFP (46×46); package case listed as 132‑BQFP bumpered. Surface-mount mounting type for board-level assembly.
• Interfaces  Additional interface specified: GCI, enabling targeted connectivity options within embedded systems.
• Operating Range  Commercial temperature rating from 0 °C to 70 °C.
• Regulatory  RoHS compliant.
• Documented Timing  Series timing and control bus parameters are provided in the MC68302 timing documentation for detailed system-level integration and timing analysis.

Typical Applications

• Embedded Communication Controllers  Leverage the on-chip communications and RISC CPM co-processor capabilities to implement protocol handling and data path control.
• DRAM‑based Embedded Systems  Use the integrated DRAM controller to simplify memory interfacing in systems that require external dynamic RAM.
• General Embedded Control  The M68000 core and 8/16-bit bus make this device suitable for control and supervision tasks in compact embedded designs.
• Commercial Electronics  With a 0 °C to 70 °C operating range and surface-mount PQFP packaging, the part fits a variety of commercial embedded product designs.

Unique Advantages

• Integrated Co-Processing: Communications and RISC CPM co-processor support reduce external component count for communication-heavy designs.
• Memory Interface Ready: Built-in DRAM controller streamlines memory subsystem design and board layout.
• Standard 5 V I/O: Simplifies interface compatibility with legacy 5 V embedded peripherals and subsystems.
• Compact Surface-Mount Package: 132‑pin PQFP (46×46) package supports high-density board designs while remaining solderable via standard SMT processes.
• RoHS Compliant: Meets RoHS environmental requirements for lead-free assembly processes.
• Series Documentation: Detailed timing and control specifications for the MC68302 series are available to support accurate system timing and integration.

Why Choose MC68302EH25CR2?

The MC68302EH25CR2 combines the M68000 core with integrated communications and RISC CPM co-processor support plus DRAM controller functionality in a single 132‑pin PQFP surface-mount package. This combination of features supports embedded designs that need on-chip communications processing and simplified memory interfacing while operating on a 5 V I/O domain.

Manufactured by NXP Semiconductors and provided as part of the MC68302 series, this device is suited for commercial embedded applications where integration, documented timing, and RoHS compliance are important selection criteria.

Request a quote or submit an RFQ for MC68302EH25CR2 to begin procurement or to get pricing and availability information tailored to your project needs.