Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MC8640DVJ1000HEN/AMC8640DVJ1000HENXP SemiconductorsIC MPU MPC86XX 1.0GHZ 1023FCCBGAMicroprocessors1023-FCCBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
1023-BCBGA, FCCBGA
Supplier Device Package:
1023-FCCBGA (33×33)
678
MC8640DVJ1067NEN/AMC8640DVJ1067NENXP SemiconductorsIC MPU MPC86XX 1.067GHZ 1023BGAMicroprocessors1023-FCCBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.067GHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
1023-BCBGA, FCCBGA
Supplier Device Package:
1023-FCCBGA (33×33)
1,469
MC8640DVJ1250HEN/AMC8640DVJ1250HENXP SemiconductorsIC MPU MPC86XX 1.25GHZ 1023BGAMicroprocessors1023-FCCBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.25GHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
1023-BCBGA, FCCBGA
Supplier Device Package:
1023-FCCBGA (33×33)
450
MC8640DVU1250HEN/AMC8640DVU1250HENXP SemiconductorsIC MPU MPC86XX 1.25GHZ 1023BGAMicroprocessors1023-FCCBGA (33x33)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.25GHz
Mounting Type:
Surface Mount
1,651
MC8640HJ1067NEN/AMC8640HJ1067NENXP SemiconductorsIC MPU MPC86XX 1.067GHZ 994BGAMicroprocessors994-FCCBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.067GHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
994-BCBGA, FCCBGA
Supplier Device Package:
994-FCCBGA (33×33)
1,365
MC8640HJ1250HEN/AMC8640HJ1250HENXP SemiconductorsIC MPU MPC86XX 1.25GHZ 994FCCBGAMicroprocessors994-FCCBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.25GHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
994-BCBGA, FCCBGA
Supplier Device Package:
994-FCCBGA (33×33)
513
MC8640HX1067NEN/AMC8640HX1067NENXP SemiconductorsIC MPU MPC86XX 1.067GHZ 994BGAMicroprocessors994-FCCBGA (33x33)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.067GHz
Mounting Type:
Surface Mount
1,990
MC8640HX1250HEN/AMC8640HX1250HENXP SemiconductorsIC MPU MPC86XX 1.25GHZ 994FCCBGAMicroprocessors994-FCCBGA (33x33)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.25GHz
Mounting Type:
Surface Mount
277
MC8640THJ1067NEN/AMC8640THJ1067NENXP SemiconductorsIC MPU MPC86XX 1.067GHZ 994BGAMicroprocessors994-FCCBGA (33x33)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.067GHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
994-BCBGA, FCCBGA
Supplier Device Package:
994-FCCBGA (33×33)
1,166
MC8640THJ1250HEN/AMC8640THJ1250HENXP SemiconductorsIC MPU MPC86XX 1.25GHZ 994FCCBGAMicroprocessors994-FCCBGA (33x33)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.25GHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
994-BCBGA, FCCBGA
Supplier Device Package:
994-FCCBGA (33×33)
572
MC8640THX1067NEN/AMC8640THX1067NENXP SemiconductorsIC MPU MPC86XX 1.067GHZ 994BGAMicroprocessors994-FCCBGA (33x33)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.067GHz
Mounting Type:
Surface Mount
460
MC8640THX1250HEN/AMC8640THX1250HENXP SemiconductorsIC MPU MPC86XX 1.25GHZ 994FCCBGAMicroprocessors994-FCCBGA (33x33)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.25GHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
994-BCBGA, FCCBGA
Supplier Device Package:
994-FCCBGA (33×33)
914
MC8640TVJ1067NEN/AMC8640TVJ1067NENXP SemiconductorsIC MPU MPC86XX 1.0GHZ 994FCCBGAMicroprocessors994-FCCBGA (33x33)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
994-BCBGA, FCCBGA
Supplier Device Package:
994-FCCBGA (33×33)
415
MC8640TVJ1250HEN/AMC8640TVJ1250HENXP SemiconductorsIC MPU MPC86XX 1.25GHZ 994FCCBGAMicroprocessors994-FCCBGA (33x33)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.25GHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
994-BCBGA, FCCBGA
Supplier Device Package:
994-FCCBGA (33×33)
1,287
MC8640TVU1067NEN/AMC8640TVU1067NENXP SemiconductorsIC MPU MPC86XX 1.067GHZ 994BGAMicroprocessors994-FCCBGA (33x33)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.067GHz
Mounting Type:
Surface Mount
622
MC8640TVU1250HEN/AMC8640TVU1250HENXP SemiconductorsIC MPU MPC86XX 1.25GHZ 994FCCBGAMicroprocessors994-FCCBGA (33x33)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.25GHz
Mounting Type:
Surface Mount
684
MC8640VJ1000HEN/AMC8640VJ1000HENXP SemiconductorsIC MPU MPC86XX 1.0GHZ 994FCCBGAMicroprocessors994-FCCBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
994-BCBGA, FCCBGA
Supplier Device Package:
994-FCCBGA (33×33)
167
MC8640VJ1067NEN/AMC8640VJ1067NENXP SemiconductorsIC MPU MPC86XX 1.067GHZ 994BGAMicroprocessors994-FCCBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.067GHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
994-BCBGA, FCCBGA
Supplier Device Package:
994-FCCBGA (33×33)
582
MC8640VU1000HEN/AMC8640VU1000HENXP SemiconductorsIC MPU MPC86XX 1.0GHZ 994FCCBGAMicroprocessors994-FCCBGA (33x33)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Mounting Type:
Surface Mount
1,598
MC8640VU1067NEN/AMC8640VU1067NENXP SemiconductorsIC MPU MPC86XX 1.067GHZ 994BGAMicroprocessors994-FCCBGA (33x33)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.067GHz
Mounting Type:
Surface Mount
37

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