Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MC8610PX1066JBMC8610PX1066JBNXP SemiconductorsIC MPU MPC86XX 1.066GHZ 783BGAMicroprocessors783-FCPBGA (29x29)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.066GHz
Mounting Type:
Surface Mount
780
MC8610TPX1066JBMC8610TPX1066JBNXP SemiconductorsIC MPU MPC86XX 1.066GHZ 783BGAMicroprocessors783-FCPBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.066GHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Display & Interface Controllers:
DIU, LCD
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
377
MC8610TPX800GBMC8610TPX800GBNXP SemiconductorsIC MPU MPC86XX 800MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Display & Interface Controllers:
DIU, LCD
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
1,336
MC8610VT800GBMC8610VT800GBNXP SemiconductorsIC MPU MPC86XX 800MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Mounting Type:
Surface Mount
1,008
MC8640DHJ1067NEN/AMC8640DHJ1067NENXP SemiconductorsIC MPU MPC86XX 1.067GHZ 1023BGAMicroprocessors1023-FCCBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.067GHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
1023-BCBGA, FCBGA
Supplier Device Package:
1023-FCCBGA (33×33)
250
MC8640DHX1000HEN/AMC8640DHX1000HENXP SemiconductorsIC MPU MPC86XX 1.0GHZ 1023FCCBGAMicroprocessors1023-FCCBGA (33x33)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Mounting Type:
Surface Mount
1,032
MC8640DHX1067NEN/AMC8640DHX1067NENXP SemiconductorsIC MPU MPC86XX 1.067GHZ 1023BGAMicroprocessors1023-FCCBGA (33x33)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.067GHz
Mounting Type:
Surface Mount
765
MC8640DHX1250HEN/AMC8640DHX1250HENXP SemiconductorsIC MPU MPC86XX 1.25GHZ 1023BGAMicroprocessors1023-FCCBGA (33x33)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.25GHz
Mounting Type:
Surface Mount
1,219
MC8640DTHJ1067NEMC8640DTHJ1067NENXP SemiconductorsIC MPU MPC86XX 1.067GHZ 1023BGAMicroprocessors1023-FCCBGA (33x33)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.067GHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
1023-BCBGA, FCBGA
Supplier Device Package:
1023-FCCBGA (33×33)
118
MC8640DTHJ1250HEN/AMC8640DTHJ1250HENXP SemiconductorsIC MPU MPC86XX 1.25GHZ 1023BGAMicroprocessors1023-FCCBGA (33x33)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.25GHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
1023-BCBGA, FCBGA
Supplier Device Package:
1023-FCCBGA (33×33)
1,012
MC8640DTHX1000HEN/AMC8640DTHX1000HENXP SemiconductorsIC MPU MPC86XX 1.0GHZ 1023FCCBGAMicroprocessors1023-FCCBGA (33x33)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Mounting Type:
Surface Mount
694
MC8640DTHX1067NCMC8640DTHX1067NCNXP SemiconductorsIC MPU MPC86XX 1.067GHZ 1023BGAMicroprocessors1023-FCCBGA (33x33)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.067GHz
Mounting Type:
Surface Mount
1,650
MC8640DTHX1067NEN/AMC8640DTHX1067NENXP SemiconductorsIC MPU MPC86XX 1.067GHZ 1023BGAMicroprocessors1023-FCCBGA (33x33)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.067GHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
1023-BBGA, FCBGA
Supplier Device Package:
1023-FCCBGA (33×33)
1,063
MC8640DTHX1250HEN/AMC8640DTHX1250HENXP SemiconductorsIC MPU MPC86XX 1.25GHZ 1023BGAMicroprocessors1023-FCCBGA (33x33)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.25GHz
Mounting Type:
Surface Mount
1,829
MC8640DTVJ1000HEN/AMC8640DTVJ1000HENXP SemiconductorsIC MPU MPC86XX 1.0GHZ 1023FCCBGAMicroprocessors1023-FCCBGA (33x33)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
1023-BCBGA, FCCBGA
Supplier Device Package:
1023-FCCBGA (33×33)
226
MC8640DTVJ1067NEMC8640DTVJ1067NENXP SemiconductorsIC MPU MPC86XX 1.067GHZ 1023BGAMicroprocessors1023-FCCBGA (33x33)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.067GHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
1023-BCBGA, FCCBGA
Supplier Device Package:
1023-FCCBGA (33×33)
659
MC8640DTVJ1250HEN/AMC8640DTVJ1250HENXP SemiconductorsIC MPU MPC86XX 1.25GHZ 1023BGAMicroprocessors1023-FCCBGA (33x33)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.25GHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
1023-BCBGA, FCCBGA
Supplier Device Package:
1023-FCCBGA (33×33)
355
MC8640DTVU1000HEN/AMC8640DTVU1000HENXP SemiconductorsIC MPU MPC86XX 1.0GHZ 1023FCCBGAMicroprocessors1023-FCCBGA (33x33)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Mounting Type:
Surface Mount
11
MC8640DTVU1067NEN/AMC8640DTVU1067NENXP SemiconductorsIC MPU MPC86XX 1.067GHZ 1023BGAMicroprocessors1023-FCCBGA (33x33)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.067GHz
Mounting Type:
Surface Mount
1,809
MC8640DTVU1250HEN/AMC8640DTVU1250HENXP SemiconductorsIC MPU MPC86XX 1.25GHZ 1023BGAMicroprocessors1023-FCCBGA (33x33)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.25GHz
Mounting Type:
Surface Mount
860

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