MC8610TPX1066JB
| Part Description |
PowerPC e600 Microprocessor IC MPC86xx 1 Core, 32-Bit 1.066GHz 783-FCPBGA (29x29) |
|---|---|
| Quantity | 800 Available (as of October 7, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MC8610 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Core Processor | PowerPC e600 | Device Package | 783-FCPBGA (29x29) | Display & Interface Controllers | DIU, LCD | ||
|---|---|---|---|---|---|---|---|
| ECCN | 3A991A2 | Graphics Acceleration | No | HTS Code | 8542.31.0001 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 105°C (TA) | Package / Case | 783-BBGA, FCBGA | ||
| RAM Controllers | DDR, DDR2 | REACH Compliance | REACH Unaffected | RoHS Compliance | RoHS non-compliant | ||
| Speed | 1.066GHz | Supplier Device Package | 783-FCPBGA (29×29) | Voltage – I/O | 1.8V, 2.5V, 3.3V |
Overview of MC8610TPX1066JB – IC MPU MPC86XX 1.066GHZ 783BGA
The MC8610TPX1066JB is a high-performance embedded microprocessor based on the PowerPC e600 core, delivering a 1.066 GHz operating frequency in a single 32‑bit core configuration. It is designed for industrial-grade embedded applications that require integrated memory controllers, extensive I/O and subsystem integration, and extended operating temperature support.
This device combines on-chip cache, memory controller support for DDR/DDR2, multiple high-speed I/O options and system management features to address embedded and industrial system designs that demand processing performance with broad peripheral integration.
Key Features
- Core and Cache PowerPC e600 32‑bit core at 1.066 GHz with separate 32‑Kbyte instruction and 32‑Kbyte data L1 caches and an integrated 256‑Kbyte eight‑way set‑associative L2 cache with ECC.
- Memory Subsystem Integrated DDR/DDR2 memory controller supporting 64‑ or 32‑bit data paths (72‑bit with ECC), up to 533 MHz DDR2 data rate and up to 400 MHz DDR data rate, and up to 16 Gbytes of addressable memory.
- I/O and Peripheral Interfaces Dual PCI Express controllers (PCIe 1.0a) with support for multiple link widths, a 32‑bit PCI interface (33/66 MHz), dual I2C controllers, serial peripheral interface, DUART and AC97 support for audio connectivity.
- Display and Graphics Integrated display interface unit (DIU) supporting parallel TTL with maximum resolution of 1280 × 1024 at 60 Hz and up to 24‑bit color depth for display or HMI implementations.
- System and Performance Management MPX coherency module, address translation and mapping units (ATMUs), device performance monitor with multiple counters, watchdog timer and power/thermal management features.
- DMA and Timers Dual integrated four‑channel DMA controllers accessible by local and remote masters, plus multiple high‑resolution timers and dual global timer modules.
- Connectivity and Expansion Enhanced local bus controller (eLBC) operating up to 133 MHz with eight chip selects and dual PCI Express controllers offering scalable I/O bandwidth.
- Package and Environmental 783‑pin flip‑chip plastic ball grid array (783‑FCPBGA, 29 × 29 mm) surface‑mount package; industrial qualification with operating temperature from −40 °C to 105 °C and RoHS compliance.
Typical Applications
- Industrial Embedded Systems Suitable for industrial controllers and embedded appliances that require extended temperature support and integrated memory and I/O subsystems.
- Human‑Machine Interfaces (HMI) Integrated display interface and graphics capabilities enable use in color display panels and operator interfaces up to 1280 × 1024 resolution.
- High‑Throughput I/O and Networking Equipment Dual PCIe controllers and a 32‑bit PCI interface provide scalable I/O bandwidth for communications and data‑plane applications.
- Memory‑Intensive Embedded Storage and Control DDR/DDR2 memory controller with ECC support and up to 16 Gbytes addressing capacity supports systems that require large memory footprints and data integrity.
Unique Advantages
- Integrated Memory and ECC On‑chip DDR/DDR2 controller and 72‑bit ECC support reduce external memory complexity and improve system data integrity.
- On‑Chip Cache Hierarchy Dedicated L1 instruction/data caches and a 256‑Kbyte L2 cache with ECC deliver predictable on‑chip performance and error detection.
- Scalable High‑Speed I/O Dual PCIe controllers and a 32‑bit PCI interface enable scalable expansion and high‑bandwidth peripheral connectivity without added bridging components.
- Display Integration Built‑in display interface simplifies HMI designs by providing parallel TTL connectivity at common resolutions and color depths.
- Industrial Temperature Range Rated for −40 °C to 105 °C operation to meet the thermal demands of industrial deployments.
- Comprehensive System Management On‑chip performance monitoring, timers, DMA channels and watchdog support system visibility, determinism and reliability.
Why Choose MC8610TPX1066JB?
The MC8610TPX1066JB balances processing performance and system integration for embedded and industrial designs. With a PowerPC e600 core at 1.066 GHz, robust on‑chip caches with ECC, and an integrated DDR/DDR2 memory controller, it simplifies system architecture while preserving performance headroom for demanding embedded workloads.
Its extensive I/O set—including dual PCIe controllers, 32‑bit PCI, multiple serial interfaces and a display interface—makes it well suited to designs that require both compute and connectivity. The industrial temperature rating and RoHS compliance support deployment in industrial environments while helping manage regulatory and reliability considerations.
Request a quote or contact sales to submit a quote for MC8610TPX1066JB and evaluate its fit for your next embedded or industrial design.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
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