MC860SRCVR50D4R2

The MC860SRCVR50D4R2 is a single‑core 32‑bit microprocessor in the MC860 series from NXP Semiconductors, operating at 50 MHz and supplied in a 357‑pin PBGA (25×25) package. Designed as a PowerQUICC family communications controller, the device integrates a Power Architecture™ CPU core with on‑chip communications peripherals targeted at embedded and networking systems.

With integrated communications features, a flexible memory controller, and industrial temperature qualification, this device is suited for embedded applications that require integrated interface support and reliable operation across wide temperature ranges.

Key Features

• Core Single MPC8xx 32‑bit core running at 50 MHz for deterministic embedded processing.
• Communications & Co‑processors Includes CPM (communications processor module) and communications‑focused co‑processor capabilities for offloading protocol tasks.
• Memory Integrated DRAM controller supporting a range of memory types for system flexibility.
• Ethernet Supports 10 Mbps Ethernet interfaces (4), enabling multi‑port network connectivity.
• Interfaces Additional on‑chip interfaces include HDLC/SDLC and support for serial communications commonly used in networking and control applications.
• Package & Mounting 357‑PBGA (25×25) package, surface‑mount, suitable for compact embedded board designs.
• Supply & IO 3.3 V I/O supply voltage as specified.
• Operating Temperature Industrial temperature range: −40 °C to 95 °C for deployment in demanding environments.
• Environmental Compliance RoHS compliant to support regulatory and manufacturing requirements.

Typical Applications

• Embedded Networking Equipment Multi‑port 10 Mbps Ethernet support and CPM offload make it suitable for routers, switches, and gateway controllers.
• Communications Systems Integrated communications peripherals and HDLC/SDLC interfaces support protocol handling and serial link management.
• Industrial Control Industrial temperature qualification and robust packaging enable use in automation controllers and field equipment.
• Legacy Interface Systems On‑chip communications modules support integration with established serial and networked systems.

Unique Advantages

• Integrated Communications Subsystem: CPM and communications co‑processor capabilities reduce external component count and simplify design for protocol‑heavy applications.
• Multi‑port Ethernet Capability: Built‑in support for four 10 Mbps Ethernet interfaces enables compact multi‑port network designs without additional PHYs.
• Flexible Memory Support: DRAM controller on chip allows use of a variety of memory types to match system performance and cost targets.
• Industrial Temperature Range: −40 °C to 95 °C operation supports deployment in harsh and temperature‑sensitive environments.
• Compact PBGA Package: 357‑pin PBGA (25×25) surface‑mount package provides high pin count in a space‑efficient footprint for dense board layouts.
• Regulatory Readiness: RoHS compliance eases integration into modern manufacturing flows and environmental requirements.

Why Choose MC860SRCVR50D4R2?

The MC860SRCVR50D4R2 positions itself as a focused solution for embedded communications and networking designs that require an integrated, single‑chip controller with deterministic 32‑bit processing and dedicated communications hardware. Its combined CPM, multi‑port Ethernet capability, and flexible memory controller make it suitable for systems where protocol handling and reliable field operation are priorities.

Backed by the MC860 PowerQUICC family documentation from NXP Semiconductors and offered with industrial temperature qualification and RoHS compliance, this device supports long‑life embedded applications that demand consistent performance, integration, and regulatory alignment.

Request a quote or submit a procurement inquiry today to learn about availability and lead times for MC860SRCVR50D4R2.