MC860ENCVR50D4R2

The MC860ENCVR50D4R2 is a single‑core, 32‑bit MPC8xx microprocessor running at 50 MHz in a 357‑PBGA (25x25) surface‑mount package. It implements Power Architecture technology with integrated communications functionality, making it suitable for embedded communications and industrial control applications.

Designed for integration of memory and peripheral controllers, the device includes CPM communications support, DRAM controller capability, multiple Ethernet interfaces, and common serial/I2C peripherals. The part is qualified for industrial temperature operation from -40 °C to 95 °C and uses 3.3 V I/O.

Key Features

• Core and Architecture MPC8xx single 32‑bit core built on Power Architecture technology with support for MMUs and instruction/data caches as described in the MPC860 family documentation.
• Performance 50 MHz core clock speed suitable for embedded communications and control tasks.
• Communications Co‑processor (CPM) Integrated communications processor module (CPM) for handling communications functions and offloading protocol tasks.
• Memory and Controllers On‑chip support for DRAM memory controllers, enabling flexible system memory configurations.
• Ethernet Connectivity Four 10 Mbps Ethernet interfaces for wired network integration and multi‑port connectivity.
• Peripheral Interfaces I2C interface plus other serial/peripheral connectivity options supported by the MPC860 family.
• Power and I/O 3.3 V I/O voltage standard for common embedded systems.
• Package and Mounting 357‑PBGA (25x25) supplier device package, surface mount for compact board designs.
• Industrial Qualification and Temperature Range Industrial qualification with operating temperature range from -40 °C to 95 °C for demanding environments.

Typical Applications

• Industrial Networking Equipment Use in embedded controllers for factory and industrial networks where multiple Ethernet ports and rugged temperature range are required.
• Communications and Telecom Controllers Integration into communication systems that benefit from an on‑chip CPM and Power Architecture core for protocol handling.
• Embedded Control Systems Deployment in control appliances and instrumentation that require DRAM support and standard 3.3 V I/O.
• Protocol Gateways and Interface Nodes Suitable for devices that aggregate or bridge multiple serial and Ethernet interfaces in embedded networks.

Unique Advantages

• Integrated Communications Subsystem: CPM integration reduces external peripheral requirements and simplifies board design for communication‑centric applications.
• Multiple Ethernet Ports: Four 10 Mbps Ethernet interfaces provide native multi‑port connectivity without external switch logic.
• Industrial Temperature Rating: Operation from -40 °C to 95 °C supports deployment in harsh and temperature‑sensitive environments.
• DRAM Controller Support: On‑chip DRAM controller enables flexible memory configurations for buffering and data handling.
• Compact Surface‑Mount Package: 357‑PBGA (25x25) packaging offers a high‑density option for space‑constrained embedded designs.

Why Choose MC860ENCVR50D4R2?

The MC860ENCVR50D4R2 combines a Power Architecture MPC8xx core with an integrated communications processor and multiple Ethernet interfaces to deliver a focused solution for embedded communications and industrial control designs. Its DRAM controller, 3.3 V I/O, and industrial temperature qualification make it a practical choice where reliability and peripheral integration are priorities.

This device is well suited to engineers building networked embedded systems that need a compact, integrated processor with detailed hardware documentation and family support from the MPC860 product line.

Request a quote or submit an inquiry to receive pricing and availability information for the MC860ENCVR50D4R2. Our team can provide a formal quote or help with technical ordering details.