MC860ENCZQ50D4R2

The MC860ENCZQ50D4R2 is an NXP Semiconductors MPC8xx-series microprocessor (PowerQUICC family) featuring a 32-bit core running at 50 MHz. Designed for embedded and communications-focused systems, the device integrates core processing, a communications processor module (CPM), and flexible memory and peripheral support to address industrial and networking applications.

This industrial-qualified device offers a 3.3 V I/O interface, support for DRAM controllers, I2C connectivity and multiple Ethernet channels, packaged in a 357‑pin PBGA (25×25 mm) surface-mount package and rated for operation from -40°C to 95°C.

Key Features

• Core and Architecture 32‑bit MPC8xx core operating at 50 MHz; includes memory management units (MMUs) and instruction and data caches as described for the MPC860 family.
• Communications Processing Integrated Communications Processor Module (CPM) for offloading communications tasks; DSP/communications co-processor capabilities noted in the device specifications.
• Memory and Storage Support DRAM controller support is provided, enabling use with a variety of DRAM types referenced in the family hardware specification.
• Networking Ethernet capability listed as 10Mbps (4), suitable for multi-port Ethernet implementations in embedded and communications systems.
• Peripheral Interfaces Additional interfaces include I2C; the MPC860 family documentation also references integrated PCMCIA socket controller support (up to two sockets) and a real-time clock.
• Power and I/O 3.3 V I/O voltage for compatibility with common embedded interfaces.
• Package and Mounting 357‑pin PBGA (25×25 mm) / 357‑BBGA package, surface mount.
• Industrial Temperature Range Qualified for industrial operation from -40°C to 95°C.
• Compliance RoHS‑compliant.

Typical Applications

• Communication and Networking Equipment Use the integrated CPM and multi‑port Ethernet capability for embedded routers, switches, and network control appliances.
• Industrial Automation Industrial‑qualified temperature range and DRAM support make the device suitable for controllers, protocol gateways, and field instrumentation.
• Embedded Control Systems The 32‑bit core with MMU and caches supports real‑time control, system management, and secure embedded applications.
• Peripheral and Interface Controllers Built‑in I2C and CPM offload are useful for designs requiring serial sensor interfacing or dedicated communications channels.

Unique Advantages

• Integrated Communications Offload: CPM and communications co‑processor capabilities reduce host CPU overhead for network and serial tasks.
• Flexible Memory Support: DRAM controller support allows designers to select appropriate memory types for performance and cost tradeoffs.
• Industrial Ready: Rated for -40°C to 95°C and listed as industrial qualification, supporting deployments in demanding environments.
• Compact Surface‑Mount Package: 357‑pin PBGA (25×25 mm) provides a high‑density footprint for space‑constrained embedded designs.
• Standard 3.3 V I/O: Simplifies integration with common peripheral devices and power domains.
• RoHS Compliant: Complies with RoHS requirements for environmentally conscious manufacturing.

Why Choose MC860ENCZQ50D4R2?

The MC860ENCZQ50D4R2 positions itself as a compact, industrial‑qualified microprocessor solution for embedded communications and control applications. With a 32‑bit PowerQUICC‑family core, integrated CPM, DRAM controller support, and I2C, it brings a balance of integration and flexibility for systems that require dedicated communications handling and reliable operation across wide temperature ranges.

This device is suited for engineers designing networking appliances, industrial controllers, and embedded systems that benefit from a hardened, well‑documented architecture and the ecosystem support of the MPC860 family.

Request a quote or submit a purchase request for the MC860ENCZQ50D4R2 to begin procurement and get pricing and availability details tailored to your project requirements.