MC7457VG1000NC

IC MPU MPC74XX 1.0GHZ 483FCCBGA
Part Description

PowerPC G4 Microprocessor IC MPC74xx 1 Core, 32-Bit 1.0GHz 483-FCCBGA (29x29)

Quantity 1,088 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMC7457
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; SIMDCore ProcessorPowerPC G4Device Package483-FCCBGA (29x29)
ECCN3A991A2Graphics AccelerationNoHTS Code8542.31.0001
Moisture Sensitivity Level1 (Unlimited)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 105°C (TA)Package / Case483-BCBGA, FCCBGA
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSpeed1.0GHz
Supplier Device Package483-FCCBGA (29×29)Voltage – I/O1.5V, 1.8V, 2.5V

Overview of MC7457VG1000NC – IC MPU MPC74XX 1.0GHz 483-FCCBGA

The MC7457VG1000NC is a PowerPC G4 32-bit microprocessor IC operating at 1.0 GHz in a 483-FCCBGA (29×29) surface-mount package. It implements a superscalar PowerPC architecture with a double-precision floating-point unit and a SIMD multimedia unit, making it suitable for networking and computing systems applications.

On-die integration includes a 512-Kbyte L2 cache and an internal L3 tag and controller that supports a glueless backside L3 cache. The device is qualified for consumer applications and is RoHS compliant, with an operating temperature range of 0 °C to 105 °C.

Key Features

  • Core Architecture: PowerPC G4 single-core, 32-bit microprocessor with double-precision floating-point support and a SIMD multimedia unit for media- and signal-oriented processing.
  • Clock Speed: 1 GHz operating frequency for consistent performance in embedded computing workloads.
  • Superscalar Execution: High-performance superscalar design with multiple-instruction fetch and dispatch capabilities to improve instruction throughput.
  • On-Die Cache Subsystem: 512-Kbyte L2 cache plus an internal L3 tag and controller; supports a glueless backside L3 cache via external SRAM.
  • L3 Interface Flexibility: L3 interface supports 1, 2, or 4 Mbytes of external SRAM; when 4 Mbytes are used, up to 2 Mbytes may be configured as cache with the remainder available as private memory.
  • System Bus Support: Memory storage subsystem supports the MPX bus protocol and a subset of the 60x bus protocol for main memory and system resource access.
  • Package & Mounting: 483-FCCBGA (29×29) package, surface-mount construction for high-density board designs.
  • Qualification & Compliance: Consumer qualification and RoHS compliant, suitable for a range of commercial embedded products.
  • Operating Temperature: Rated for 0 °C to 105 °C for deployment in many consumer and computing environments.
  • Graphics Acceleration: No integrated graphics acceleration; focused on CPU, FPU, and multimedia SIMD capabilities.

Typical Applications

  • Networking Equipment: Ideal for embedded routers, switches, and network appliances where PowerPC G4 processing and L2/L3 cache support enable efficient packet handling and protocol processing.
  • Embedded Computing Systems: Fits consumer-focused computing appliances requiring a high-performance 32-bit RISC core with floating-point and SIMD multimedia acceleration.
  • High-Performance Consumer Devices: Suitable for consumer electronics that leverage on-die L2 cache and external L3 cache configurations to balance performance and memory flexibility.
  • Storage and Control Subsystems: Appropriate for controller designs that need deterministic processing, cache hierarchy, and standardized bus protocol support.

Unique Advantages

  • Integrated Cache Hierarchy: On-die 512-Kbyte L2 plus internal L3 tag/controller reduces external memory overhead and simplifies system cache architecture.
  • Flexible L3 Support: Glueless backside L3 cache interface with support for 1/2/4 Mbyte external SRAM options enables configurable cache/private memory trade-offs.
  • Superscalar Design: Multi-instruction fetch and dispatch improve instruction-level parallelism for compute-intensive embedded workloads.
  • Multimedia Acceleration: SIMD multimedia unit accelerates media and signal-processing tasks without relying on discrete coprocessors.
  • Compact BGA Package: 483-FCCBGA (29×29) surface-mount package supports dense PCB layouts common in embedded and consumer products.
  • Regulatory and Environmental Readiness: RoHS compliance addresses environmental regulation needs for consumer market products.

Why Choose MC7457VG1000NC?

The MC7457VG1000NC delivers a balanced combination of PowerPC G4 performance, integrated cache hierarchy, and multimedia acceleration in a compact 483-FCCBGA package. Its superscalar core, 512-Kbyte L2, and L3 controller with glueless external cache support make it well suited for designers building networking and computing systems where deterministic processing and memory flexibility matter.

Targeted at consumer-qualified embedded designs, this device provides a scalable platform for applications that require a robust 32-bit RISC core, floating-point capability, and SIMD multimedia support, while meeting RoHS environmental requirements.

Request a quote or submit an inquiry to get pricing and availability for the MC7457VG1000NC. Our team can provide lead-time information and help evaluate this PowerPC G4 microprocessor for your design requirements.

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