MC7457RX867NC

IC MPU MPC74XX 867MHZ 483FCCBGA
Part Description

PowerPC G4 Microprocessor IC MPC74xx 1 Core, 32-Bit 867MHz 483-FCCBGA (29x29)

Quantity 652 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMC7457
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; SIMDCore ProcessorPowerPC G4Device Package483-FCCBGA (29x29)
ECCN3A991A2Graphics AccelerationNoHTS Code8542.31.0001
Moisture Sensitivity Level1 (Unlimited)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 105°C (TA)Package / Case483-BCBGA, FCCBGA
REACH ComplianceREACH UnaffectedRoHS ComplianceRoHS non-compliantSpeed867MHz
Supplier Device Package483-FCCBGA (29×29)Voltage – I/O1.5V, 1.8V, 2.5V

Overview of MC7457RX867NC – IC MPU MPC74XX 867MHZ 483FCCBGA

The MC7457RX867NC is a PowerPC G4 microprocessor in the MC7457 series from NXP Semiconductors, implementing the 32-bit PowerPC architecture. This 867 MHz, single-core device is targeted at networking and computing systems applications and combines a high-performance superscalar core with integrated cache support for demanding embedded compute tasks.

Key on-chip integration includes a 512-Kbyte L2 cache and an L3 tag/controller that supports a glueless backside L3 cache interface, enabling higher sustained memory throughput in systems that require external SRAM for expanded cache or private memory.

Key Features

  • Core Architecture  PowerPC G4 32-bit superscalar core implementing the PowerPC architecture with a double-precision floating-point unit and SIMD multimedia unit as described for the MPC7457 family.
  • Performance  867 MHz clock speed providing the processing capacity specified for this part number.
  • On-chip Cache  Integrated 512-Kbyte L2 cache plus an internal L3 tag and controller that supports a glueless backside L3 cache through a dedicated high-bandwidth interface.
  • L3 External SRAM Support  L3 interface supports 1, 2, or 4 Mbytes of external SRAM for L3 cache and/or private memory; for 4 Mbytes of SRAM, up to 2 Mbytes may be used as cache with the remainder available as private memory.
  • Memory/Bus Support  Memory storage subsystem supports the MPX bus protocol and a subset of the 60x bus protocol to main memory and other system resources (per MPC7457 family documentation).
  • Multimedia & DSP  Includes multimedia/SIMD co-processor capabilities for media and signal processing tasks.
  • Package & Mounting  483-FCCBGA (29×29) surface-mount package suitable for board-level integration (483-BCBGA / FCCBGA package family).
  • Temperature Range  Rated for operation from 0 °C to 105 °C.
  • Qualification & Compliance  Consumer-qualified device and RoHS compliant.

Typical Applications

  • Networking Equipment  Designed for networking and computing systems applications where a PowerPC G4 core with integrated cache support and high-bandwidth L3 options can accelerate packet processing and control-plane tasks.
  • Compute Appliances  Suitable for embedded compute appliances that benefit from an integrated L2 cache and optional external L3 SRAM for expanded working memory and private data regions.
  • Multimedia Processing  Systems requiring SIMD multimedia acceleration for media or signal-processing functions can leverage the device’s multimedia co-processor capabilities.

Unique Advantages

  • Superscalar PowerPC Core:  A superscalar 32-bit PowerPC G4 core with double-precision floating-point support enables parallel instruction execution and improved throughput for compute-intensive code paths.
  • Integrated L2 with L3 Expansion:  512-Kbyte on-chip L2 plus a dedicated L3 tag/controller lets designers scale system memory performance via external SRAM without adding complex glue logic.
  • Flexible Memory Interface:  Support for MPX and a subset of the 60x bus protocol provides compatibility with established memory and system architectures documented for the MPC7457 family.
  • Compact Surface-Mount Package:  483-FCCBGA (29×29) package provides a high pin-count option in a compact footprint for board-level integration.
  • RoHS Compliant:  Meets RoHS requirements for restricted substances.

Why Choose MC7457RX867NC?

The MC7457RX867NC offers a balanced combination of processing performance and cache-oriented memory architecture for networking and embedded computing designs. With a PowerPC G4 superscalar core, on-chip 512-Kbyte L2 cache, and a dedicated L3 interface for external SRAM, this device is positioned to accelerate workloads that require both compute and memory bandwidth.

Its consumer qualification, RoHS compliance, and 483-FCCBGA surface-mount package make it suitable for production embedded systems that need documented hardware specifications and configurable L3 cache options as described in the MPC7457 family documentation.

Request a quote or submit an inquiry to discuss availability, pricing, and board-level integration support for the MC7457RX867NC.

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