Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MC8641DHX1000NEMC8641DHX1000NENXP SemiconductorsIC MPU MPC86XX 1.0GHZ 1023FCCBGAMicroprocessors1023-FCCBGA (33x33)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Mounting Type:
Surface Mount
1,130
N/AMC8641DHX1500KENXP SemiconductorsIC MPU MPC86XX 1.5GHZ 1023FCCBGAMicroprocessors1023-FCCBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.5GHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
1023-BCBGA, FCBGA
Supplier Device Package:
1023-FCCBGA (33×33)
648
MC8641DTHX1333JEMC8641DTHX1333JENXP SemiconductorsRISC MICROPROCESSOR, 32-BIT, POWMicroprocessors1023-FCCBGA (33x33)N/A-40 °C – 105 °C
Voltage – I/O:
1.8 V – 3.3 V
Core Processor:
PowerPC e600
RAM Controllers:
DDR, DDR2
Ethernet:
10/100/1000Mbps (4)
Graphics Acceleration:
No
Qualification:
Industrial
422
MC8641DTVJ1333JEMC8641DTVJ1333JENXP SemiconductorsIC MPU MPC86XX 1.333GHZ 1023BGAMicroprocessors1023-FCCBGA (33x33)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.333GHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
1023-BCBGA, FCCBGA
Supplier Device Package:
1023-FCCBGA (33×33)
1,559
MC8641DTVU1333JCMC8641DTVU1333JCNXP SemiconductorsIC MPU MPC86XX 1.333GHZ 1023BGAMicroprocessors1023-FCCBGA (33x33)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.333GHz
Mounting Type:
Surface Mount
637
MC8641DTVU1333JEMC8641DTVU1333JENXP SemiconductorsIC MPU MPC86XX 1.333GHZ 1023BGAMicroprocessors1023-FCCBGA (33x33)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.333GHz
Mounting Type:
Surface Mount
931
MC8641DVJ1000NEMC8641DVJ1000NENXP SemiconductorsIC MPU MPC86XX 1.0GHZ 1023FCCBGAMicroprocessors1023-FCCBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
1023-BCBGA, FCCBGA
Supplier Device Package:
1023-FCCBGA (33×33)
462
MC8641DVJ1333JEMC8641DVJ1333JENXP SemiconductorsIC MPU MPC86XX 1.333GHZ 1023BGAMicroprocessors1023-FCCBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.333GHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
1023-BCBGA, FCCBGA
Supplier Device Package:
1023-FCCBGA (33×33)
581
MC8641DVJ1500KEMC8641DVJ1500KENXP SemiconductorsIC MPU MPC86XX 1.5GHZ 1023FCCBGAMicroprocessors1023-FCCBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.5GHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
1023-BCBGA, FCBGA
Supplier Device Package:
1023-FCCBGA (33×33)
150
MC8641DVU1000GBMC8641DVU1000GBNXP SemiconductorsIC MPU MPC86XX 1.0GHZ 1023FCCBGAMicroprocessors1023-FCCBGA (33x33)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Mounting Type:
Surface Mount
1,608
MC8641DVU1333JEMC8641DVU1333JENXP SemiconductorsIC MPU MPC86XX 1.333GHZ 1023BGAMicroprocessors1023-FCCBGA (33x33)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.333GHz
Mounting Type:
Surface Mount
114
MC8641DVU1500KEMC8641DVU1500KENXP SemiconductorsIC MPU MPC86XX 1.5GHZ 1023FCCBGAMicroprocessors1023-FCCBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.5GHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
1023-BCBGA, FCCBGA
Supplier Device Package:
1023-FCCBGA (33×33)
788
MC8641VJ1000NEMC8641VJ1000NENXP SemiconductorsIC MPU MPC86XX 1.0GHZ 994FCCBGAMicroprocessors994-FCCBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
994-BCBGA, FCCBGA
Supplier Device Package:
994-FCCBGA (33×33)
593
N/AMC8641VJ1333JENXP SemiconductorsIC MPU MPC86XX 1.333GHZ 1023BGAMicroprocessors1023-FCCBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.333GHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
1023-BCBGA, FCBGA
Supplier Device Package:
1023-FCCBGA (33×33)
495
MC8641VJ1500KEMC8641VJ1500KENXP SemiconductorsIC MPU MPC86XX 1.5GHZ 994FCCBGAMicroprocessors994-FCCBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.5GHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
994-BCBGA, FCCBGA
Supplier Device Package:
994-FCCBGA (33×33)
1,036
MC8641VU1000NEMC8641VU1000NENXP SemiconductorsIC MPU MPC86XX 1.0GHZ 994FCCBGAMicroprocessors994-FCCBGA (33x33)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Mounting Type:
Surface Mount
639
MC8641VU1333JEMC8641VU1333JENXP SemiconductorsIC MPU MPC86XX 1.333GHZ 994BGAMicroprocessors994-FCCBGA (33x33)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.333GHz
Mounting Type:
Surface Mount
249
MC8641VU1500KEMC8641VU1500KENXP SemiconductorsRISC MICROPROCESSOR, 32-BIT, POWMicroprocessors994-FCCBGA (33x33)N/A0 °C – 105 °C
Voltage – I/O:
1.8 V – 3.3 V
Core Processor:
PowerPC e600
RAM Controllers:
DDR, DDR2
Ethernet:
10/100/1000Mbps (4)
Graphics Acceleration:
No
Qualification:
Consumer
1,638
MC908AB32CFUEMC908AB32CFUENXP SemiconductorsIC MCU 8BIT 32KB FLASH 64QFPMicrocontrollers64-QFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
SCI, SPI
Peripherals:
POR, PWM
Number of I/O:
51
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
512 x 8
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×14)
Package / Case:
64-QFP
201
MC908AB32CFUERMC908AB32CFUERNXP SemiconductorsIC MCU 8BIT 32KB FLASH 64QFPMicrocontrollers64-QFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
SCI, SPI
Peripherals:
POR, PWM
Number of I/O:
51
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
512 x 8
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×14)
Package / Case:
64-QFP
801

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