MC8641DVJ1000NE

IC MPU MPC86XX 1.0GHZ 1023FCCBGA
Part Description

PowerPC e600 Microprocessor IC MPC86xx 2 Core, 32-Bit 1.0GHz 1023-FCCBGA (33x33)

Quantity 321 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMC8641
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Core ProcessorPowerPC e600Device Package1023-FCCBGA (33x33)ECCN3A991A1
Ethernet10/100/1000Mbps (4)Graphics AccelerationNoHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width2 Core, 32-BitOperating Temperature0°C ~ 105°C (TA)Package / Case1023-BCBGA, FCCBGA
RAM ControllersDDR, DDR2REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Speed1.0GHzSupplier Device Package1023-FCCBGA (33×33)Voltage – I/O1.8V, 2.5V, 3.3V

Overview of MC8641DVJ1000NE – PowerPC e600 2‑Core 1.0 GHz Microprocessor, 1023‑FCCBGA

The MC8641DVJ1000NE is an NXP Semiconductors microprocessor in the MC8641 family that integrates two Power Architecture® e600 cores running at 1.0 GHz. It provides system logic and high‑performance processing intended for embedded applications in networking, storage, wireless infrastructure and other general‑purpose embedded systems.

Designed with integrated memory controllers, multi‑gigabit Ethernet interfaces and a broad set of high‑speed I/O, this dual‑core device delivers a compact, surface‑mount solution in a 1023‑FCCBGA (33×33) package for space‑constrained embedded designs.

Key Features

  • Processor Core Dual PowerPC e600 cores, 32‑bit architecture running at 1.0 GHz, with 32 KB L1 instruction and 32 KB L1 data cache per core.
  • Memory Integrated DDR and DDR2 SDRAM controllers for flexible system memory configurations.
  • Ethernet Connectivity Four 10/100/1000 Mbps Ethernet interfaces (quad Gigabit Ethernet) for high‑speed networking applications; enhanced three‑speed Ethernet (eTSEC) functionality is provided in the family documentation.
  • High‑Speed I/O and System Interfaces On‑chip support for high‑speed serial interfaces including PCI Express and Serial RapidIO as described in the device hardware specification.
  • Peripheral and Control Interfaces Integrated DUART and other system interfaces for serial control, management and debug.
  • Package and Mounting 1023‑FCCBGA supplier device package (33×33 mm), surface‑mount mounting type suitable for compact board layouts.
  • Operating Range and Compliance Rated for an operating temperature range of 0 °C to 105 °C and RoHS‑compliant material status.

Typical Applications

  • Networking Equipment Ideal for routers, switches and network appliances that require multi‑core processing and multiple Gigabit Ethernet ports.
  • Storage Systems Suited to embedded storage controllers and NAS devices that benefit from integrated DDR/DDR2 memory controllers and high‑speed I/O.
  • Wireless Infrastructure Applicable to base station and infrastructure equipment where dual cores and high‑speed serial interfaces support data plane and control plane tasks.
  • General‑Purpose Embedded Systems Useful in a broad range of embedded applications that need compact, surface‑mount, dual‑core processing with rich peripheral integration.

Unique Advantages

  • Dual e600 Processing Two PowerPC e600 cores provide parallel processing capability for multitasking embedded workloads.
  • Integrated Networking Subsystem Quad Gigabit Ethernet interfaces reduce external PHY and switch requirements for networked product designs.
  • Flexible Memory Support On‑chip DDR and DDR2 controllers simplify memory subsystem design and support common embedded SDRAM choices.
  • Broad High‑Speed Connectivity Built‑in support for PCI Express and Serial RapidIO provides options for peripheral expansion and system interconnect.
  • Compact, Surface‑Mount Package 1023‑FCCBGA (33×33) package enables dense PCB layouts while maintaining enterprise‑class feature integration.
  • Commercial Temperature and RoHS Compliance Operates across 0 °C to 105 °C and meets RoHS requirements for environmental compliance.

Why Choose MC8641DVJ1000NE?

The MC8641DVJ1000NE positions itself as a highly integrated dual‑core embedded processor suitable for networking, storage and wireless infrastructure designs. With dual PowerPC e600 cores, onboard DDR/DDR2 memory controllers, quad Gigabit Ethernet and a suite of high‑speed interfaces, it provides an integrated platform that simplifies system architecture and reduces external component counts.

This device is targeted at designers and procurement teams seeking a compact, surface‑mount microprocessor solution in a 1023‑FCCBGA package with a defined commercial operating range and RoHS compliance. The MC8641DVJ1000NE offers a balance of processing capability and integrated I/O for scalable embedded system designs backed by documented hardware specifications.

If you would like pricing, availability or to request a quote for MC8641DVJ1000NE, submit a request through your usual procurement channels or request a formal quote today.

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