MC8640HX1250HE
| Part Description |
PowerPC e600 Microprocessor IC MPC86xx 1 Core, 32-Bit 1.25GHz 994-FCCBGA (33x33) |
|---|---|
| Quantity | 36 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MC8640 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Core Processor | PowerPC e600 | Device Package | 994-FCCBGA (33x33) | Mounting Type | Surface Mount | ||
|---|---|---|---|---|---|---|---|
| Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C – 105°C | Package / Case | Tray | ||
| Speed | 1.25GHz | Voltage | 1.8V, 2.5V, 3.3V |
Overview of MC8640HX1250HE – IC MPU MPC86XX 1.25GHZ 994FCCBGA
The MC8640HX1250HE is a PowerPC e600 microprocessor class device featuring a single 32-bit core running at 1.25 GHz in a 994-FCCBGA (33×33) package. It targets embedded applications that require a high-frequency single core, multiple memory interface options, and multi-port Ethernet connectivity.
Designed for embedded systems and networking-oriented designs, the device combines a 1.25 GHz PowerPC e600 core with DDR/DDR2 memory controller support and four 10/100/1000 Mbps Ethernet interfaces, providing a compact, surface-mount solution for complex board-level integration.
Key Features
- Processor Core PowerPC e600 architecture, single 32‑bit core operating at 1.25 GHz.
- Memory Controllers On-chip support for DDR and DDR2 memory controllers to interface with common system memory options.
- High-speed Ethernet Four 10/100/1000 Mbps Ethernet interfaces, enabling multi-port networking and connectivity on a single device.
- Package & Mounting 994‑FCCBGA (33×33) supplier device package designed for surface-mount assembly; supplied in tray format.
- Power Supply Guidance (series) Series documentation specifies a core supply of 1.05 V ±50 mV for 1.25 GHz class parts (per series datasheet recommendations).
- Thermal Range (series) Series documentation indicates an extended junction temperature range down to –40 °C and up to 105 °C for parts in the 1.25 GHz class.
- Graphics Acceleration No graphics acceleration—focused processing feature set for embedded compute and networking workloads.
- Debug / Test JTAG AC timing details for the series include a minimum t_JTDVKH of 15 ns as specified in the series documentation.
Typical Applications
- Embedded Networking Multi‑port Gigabit Ethernet interfaces suit network appliances, switches, and gateway devices requiring integrated connectivity.
- Industrial Control Single high-frequency core with DDR/DDR2 support enables real-time control and monitoring systems in industrial embedded platforms.
- Communications Equipment Compact BGA package and multi‑Ethernet ports make the device appropriate for communications modules and infrastructure blades.
- General Embedded Systems Provides a focused processor solution for embedded compute tasks where a single 32‑bit PowerPC e600 core at 1.25 GHz is required.
Unique Advantages
- High-frequency single-core processing: 1.25 GHz PowerPC e600 core delivers predictable single-threaded compute performance for embedded workloads.
- Integrated multi-port Ethernet: Four 10/100/1000 Mbps interfaces reduce the need for additional Ethernet controllers on the board.
- Flexible memory support: On-chip DDR and DDR2 controller support simplifies memory subsystem design choices.
- Compact BGA footprint: 994‑FCCBGA (33×33) package enables high-density board layouts and surface-mount assembly.
- Defined series operating conditions: Series documentation provides recommended core voltage (1.05 V ±50 mV for 1.25 GHz class) and an extended junction range of –40 °C to 105 °C for thermal planning.
- Board-level testability: JTAG timing specifications documented in the series addendum support boundary-scan test and debug integration.
Why Choose MC8640HX1250HE?
The MC8640HX1250HE positions itself as a focused embedded processor option where a single high-frequency PowerPC e600 core, robust memory interface options, and multiple Gigabit Ethernet ports are required in a compact BGA package. It is suited to designers building networking, communications, or industrial embedded systems that need integrated connectivity and clear series-level operating parameters for power and thermal planning.
With series datasheet guidance on core supply voltage and extended junction temperature range, the device offers predictable electrical and thermal characteristics that help streamline system-level design and validation for production-ready embedded applications.
Request a quote or submit an inquiry today to obtain pricing and availability for the MC8640HX1250HE and to discuss how this microprocessor can meet your embedded design requirements.

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