Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AMCIMX7U5DVK07SDNXP SemiconductorsIC MPU I.MX7ULP 720MHZ 361VFBGAMicroprocessors361-VFBGA (10x10)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
720MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
MIPI-DSI
USB:
USB 2.0 (2)
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
Crypto/TRNG, eFuses/OTP, Secure Fuse, uHAB/HAB-Secure Boot
Mounting Type:
Surface Mount
Package / Case:
361-VFBGA
Supplier Device Package:
361-VFBGA (10×10)
1,344
MCIMX7U5DVP07SCMCIMX7U5DVP07SCNXP SemiconductorsIC MPU I.MX7ULP 720MHZMicroprocessorsN/AN/A0°C ~ 95°C
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
720MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
MIPI-DSI
USB:
USB 2.0 (2)
Operating Temperature:
0°C ~ 95°C
Security Features:
Crypto/TRNG, eFuses/OTP, Secure Fuse, uHAB/HAB-Secure Boot
504
N/AMCIMX7U5DVP07SDNXP SemiconductorsIC MPU I.MX7ULP 720MHZ 393VFBGAMicroprocessors393-VFBGA (14x14)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
720MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
MIPI-DSI
USB:
USB 2.0 (2)
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
Crypto/TRNG, eFuses/OTP, Secure Fuse, uHAB/HAB-Secure Boot
Mounting Type:
Surface Mount
Package / Case:
393-LFBGA
Supplier Device Package:
393-VFBGA (14×14)
1,145
N/AMCIMX7U5DVP08SCNXP SemiconductorsI.MX7ULP1 14X14Microprocessors-N/A–
Core Processor:
ARM® Cortex®-A7
RAM Controllers:
LPDDR2, LPDDR3
USB:
USB 2.0 (2)
Graphics Acceleration:
Yes
Co-Processors/DSP:
ARM® Cortex®-M4
Display & Interface Controllers:
MIPI-DSI
491
MCL908QT1CDWEMCL908QT1CDWENXP SemiconductorsIC MCU 8BIT 1.5KB FLASH 8SOMicrocontrollers8-SON/A-40°C ~ 85°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
2MHz
Peripherals:
LVD, POR, PWM
Number of I/O:
5
Program Memory Size:
1.5KB (1.5K x 8)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
8-SO
Package / Case:
8-SOIC (0.209″”, 5.30mm Width)
1,012
MCL908QT1CDWERMCL908QT1CDWERNXP SemiconductorsIC MCU 8BIT 1.5KB FLASH 8SOMicrocontrollers8-SON/A-40°C ~ 85°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
2MHz
Peripherals:
LVD, POR, PWM
Number of I/O:
5
Program Memory Size:
1.5KB (1.5K x 8)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
8-SO
Package / Case:
8-SOIC (0.209″”, 5.30mm Width)
1,552
MCL908QT1DWEMCL908QT1DWENXP SemiconductorsIC MCU 8BIT 1.5KB FLASH 8SOMicrocontrollers8-SON/A0°C ~ 70°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
2MHz
Peripherals:
LVD, POR, PWM
Number of I/O:
5
Program Memory Size:
1.5KB (1.5K x 8)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
8-SO
Package / Case:
8-SOIC (0.209″”, 5.30mm Width)
1,765
MCL908QT2CDWEMCL908QT2CDWENXP SemiconductorsIC MCU 8BIT 1.5KB FLASH 8SOMicrocontrollers8-SON/A-40°C ~ 85°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
2MHz
Peripherals:
LVD, POR, PWM
Number of I/O:
5
Program Memory Size:
1.5KB (1.5K x 8)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 3.6V
Data Converters:
A/D 4x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
8-SO
Package / Case:
8-SOIC (0.209″”, 5.30mm Width)
1,495
MCL908QY2CDTEMCL908QY2CDTENXP SemiconductorsIC MCU 8BIT 1.5KB FLASH 16TSSOPMicrocontrollers16-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
2MHz
Peripherals:
LVD, POR, PWM
Number of I/O:
13
Program Memory Size:
1.5KB (1.5K x 8)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 3.6V
Data Converters:
A/D 4x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
16-TSSOP
Package / Case:
16-TSSOP (0.173″”, 4.40mm Width)
1,153
MCL908QY2CDWEMCL908QY2CDWENXP SemiconductorsIC MCU 8BIT 1.5KB FLASH 16SOICMicrocontrollers16-SOICN/A-40°C ~ 85°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
2MHz
Peripherals:
LVD, POR, PWM
Number of I/O:
13
Program Memory Size:
1.5KB (1.5K x 8)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 3.6V
Data Converters:
A/D 4x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
16-SOIC
Package / Case:
16-SOIC (0.295″”, 7.50mm Width)
631
MCL908QY2DWEMCL908QY2DWENXP SemiconductorsIC MCU 8BIT 1.5KB FLASH 16SOICMicrocontrollers16-SOICN/A0°C ~ 70°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
2MHz
Peripherals:
LVD, POR, PWM
Number of I/O:
13
Program Memory Size:
1.5KB (1.5K x 8)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 4x8b
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
16-SOIC
Package / Case:
16-SOIC (0.295″”, 7.50mm Width)
908
MCL908QY4CDTEMCL908QY4CDTENXP SemiconductorsIC MCU 8BIT 4KB FLASH 16TSSOPMicrocontrollers16-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
2MHz
Peripherals:
LVD, POR, PWM
Number of I/O:
13
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 3.6V
Data Converters:
A/D 4x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
16-TSSOP
Package / Case:
16-TSSOP (0.173″”, 4.40mm Width)
381
MCP11A1CFNE3MCP11A1CFNE3NXP SemiconductorsIC MCU 8BIT ROMLESS 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
3MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Type:
ROMless
EEPROM Size:
512 x 8
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
456
N/AMCP2003-E/MDMicrochip TechnologyIC TRANSCEIVER HALF 1/1 8DFNDrivers, Receivers, Transceivers8-DFN (4x4)6V ~ 27V-40°C ~ 125°C
Type:
Transceiver
Protocol:
LINbus
Number of Drivers/Receivers:
1/1
Duplex:
Half
Receiver Hysteresis:
175 mV
Voltage – Supply:
6V ~ 27V
Operating Temperature:
-40°C ~ 125°C
Mounting Type:
Surface Mount
Package / Case:
8-VDFN Exposed Pad
Supplier Device Package:
8-DFN (4×4)
472
MCP2003-E/PMCP2003-E/PMicrochip TechnologyIC TRANSCEIVER HALF 1/1 8DIPDrivers, Receivers, Transceivers8-PDIP6V ~ 27V-40°C ~ 125°C
Type:
Transceiver
Protocol:
LINbus
Number of Drivers/Receivers:
1/1
Duplex:
Half
Receiver Hysteresis:
175 mV
Voltage – Supply:
6V ~ 27V
Operating Temperature:
-40°C ~ 125°C
Mounting Type:
Through Hole
Package / Case:
8-DIP (0.300″”, 7.62mm)
Supplier Device Package:
8-PDIP
1,116
MCP2003-E/SNMCP2003-E/SNMicrochip TechnologyIC TRANSCEIVER HALF 1/1 8SOICDrivers, Receivers, Transceivers8-SOIC6V ~ 27V-40°C ~ 125°C
Type:
Transceiver
Protocol:
LINbus
Number of Drivers/Receivers:
1/1
Duplex:
Half
Receiver Hysteresis:
175 mV
Voltage – Supply:
6V ~ 27V
Operating Temperature:
-40°C ~ 125°C
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOIC
1,198
N/AMCP2003A-E/MDMicrochip TechnologyIC TRANSCEIVER HALF 1/1 8DFNDrivers, Receivers, Transceivers8-DFN (4x4)6V ~ 27V-40°C ~ 125°C
Type:
Transceiver
Protocol:
LINbus
Number of Drivers/Receivers:
1/1
Duplex:
Half
Receiver Hysteresis:
175 mV
Voltage – Supply:
6V ~ 27V
Operating Temperature:
-40°C ~ 125°C
Mounting Type:
Surface Mount
Package / Case:
8-VDFN Exposed Pad
Supplier Device Package:
8-DFN (4×4)
1,170
MCP2003A-E/PMCP2003A-E/PMicrochip TechnologyIC TRANSCEIVER HALF 1/1 8DIPDrivers, Receivers, Transceivers8-PDIP6V ~ 27V-40°C ~ 125°C
Type:
Transceiver
Protocol:
LINbus
Number of Drivers/Receivers:
1/1
Duplex:
Half
Receiver Hysteresis:
175 mV
Voltage – Supply:
6V ~ 27V
Operating Temperature:
-40°C ~ 125°C
Mounting Type:
Through Hole
Package / Case:
8-DIP (0.300″”, 7.62mm)
Supplier Device Package:
8-PDIP
885
MCP2003A-E/SNMCP2003A-E/SNMicrochip TechnologyIC TRANSCEIVER HALF 1/1 8SOICDrivers, Receivers, Transceivers8-SOIC6V ~ 27V-40°C ~ 125°C
Type:
Transceiver
Protocol:
LINbus
Number of Drivers/Receivers:
1/1
Duplex:
Half
Receiver Hysteresis:
175 mV
Voltage – Supply:
6V ~ 27V
Operating Temperature:
-40°C ~ 125°C
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOIC
680
N/AMCP2003AT-E/MDMicrochip TechnologyIC TRANSCEIVER HALF 1/1 8DFNDrivers, Receivers, Transceivers8-DFN (4x4)6V ~ 27V-40°C ~ 125°C
Type:
Transceiver
Protocol:
LINbus
Number of Drivers/Receivers:
1/1
Duplex:
Half
Receiver Hysteresis:
175 mV
Voltage – Supply:
6V ~ 27V
Operating Temperature:
-40°C ~ 125°C
Mounting Type:
Surface Mount
Package / Case:
8-VDFN Exposed Pad
Supplier Device Package:
8-DFN (4×4)
491

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