 | | MCIMX6Y2DVM05AAR | NXP Semiconductors | IC MPU I.MX6 528MHZ 289MAPBGA | Microprocessors | 289-MAPBGA (14x14) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DDR3L Display & Interface Controllers: Electrophoretic, LCD USB: USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.8V, 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 289-MAPBGA (14×14) | 674 | |
 | | MCIMX6Y2DVM05AB | NXP Semiconductors | IC MPU I.MX6 528MHZ 289MAPBGA | Microprocessors | 289-MAPBGA (14x14) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DDR3L Display & Interface Controllers: Electrophoretic, LCD USB: USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.8V, 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 289-MAPBGA (14×14) | 726 | |
| N/A | | MCIMX6Y2DVM05ABR | NXP Semiconductors | I.MX 32-BIT MPU, ARM CORTEX-A7 C | Microprocessors | 289-MAPBGA (14x14) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DDR3L Display & Interface Controllers: Electrophoretic, LCD USB: USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.8V, 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 289-MAPBGA (14×14) | 1,149 | |
 | | MCIMX6Y2DVM09AA | NXP Semiconductors | IC MPU I.MX6 900MHZ 289MAPBGA | Microprocessors | 289-MAPBGA (14x14) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DDR3L Display & Interface Controllers: Electrophoretic, LCD USB: USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.8V, 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 289-MAPBGA (14×14) | 733 | |
 | | MCIMX6Y2DVM09AB | NXP Semiconductors | IC MPU I.MX6 900MHZ 289MAPBGA | Microprocessors | 289-MAPBGA (14x14) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DDR3L Display & Interface Controllers: Electrophoretic, LCD USB: USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.8V, 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 289-MAPBGA (14×14) | 916 | |
 | | MCIMX6Y7DVK05AA | NXP Semiconductors | IC MPU I.MX6 528MHZ 272MAPBGA | Microprocessors | 272-MAPBGA (9x9) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DDR3L Display & Interface Controllers: Electrophoretic, LCD USB: USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.8V, 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 272-MAPBGA (9×9) | 436 | |
 | | MCIMX6Y7DVK05AB | NXP Semiconductors | IC MPU I.MX6 528MHZ 272MAPBGA | Microprocessors | 272-MAPBGA (9x9) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DDR3L Display & Interface Controllers: Electrophoretic, LCD USB: USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.8V, 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 272-MAPBGA (9×9) | 692 | |
 | | MCIMX6Y7DVM09AA | NXP Semiconductors | IC MPU I.MX6 900MHZ 289MAPBGA | Microprocessors | 289-MAPBGA (14x14) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DDR3L Display & Interface Controllers: Electrophoretic, LCD USB: USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.8V, 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 289-MAPBGA (14×14) | 41 | |
 | | MCIMX6Y7DVM09AB | NXP Semiconductors | IC MPU I.MX6 900MHZ 289MAPBGA | Microprocessors | 289-MAPBGA (14x14) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DDR3L Display & Interface Controllers: Electrophoretic, LCD USB: USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.8V, 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 289-MAPBGA (14×14) | 1,631 | |
 | | MCIMX6Z0DVM09AB | NXP Semiconductors | IC MPU I.MX6 900MHZ 289MAPBGA | Microprocessors | 289-MAPBGA (14x14) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Display & Interface Controllers: Keypad USB: USB 2.0 OTG + PHY (2) Operating Temperature: 0°C ~ 95°C (TJ) Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 289-MAPBGA (14×14) | 831 | |
| N/A | | MCIMX6Z0DVM09ABR | NXP Semiconductors | I.MX6ULZ, 289MAPBGA | Microprocessors | 289-MAPBGA (14x14) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Display & Interface Controllers: Keypad USB: USB 2.0 OTG + PHY (2) Operating Temperature: 0°C ~ 95°C (TJ) Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 289-MAPBGA (14×14) | 65 | |
 | | MCIMX7D2DVK12SC | NXP Semiconductors | IC MPU I.MX7D 1.2GHZ 488TFBGA | Microprocessors | 488-TFBGA (12x12) | N/A | 0°C ~ 85°C (TJ) | Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L Display & Interface Controllers: Keypad, LCD, MIPI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: 0°C ~ 85°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 488-TFBGA (12×12) | 574 | |
 | | MCIMX7D2DVK12SD | NXP Semiconductors | IC MPU I.MX7D 1.2GHZ 488TFBGA | Microprocessors | 488-TFBGA (12x12) | N/A | 0°C ~ 85°C (TJ) | Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L Display & Interface Controllers: Keypad, LCD, MIPI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: 0°C ~ 85°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 488-TFBGA (12×12) | 956 | |
 | | MCIMX7D2DVM12SC | NXP Semiconductors | IC MPU I.MX7D 1.2GHZ 541MAPBGA | Microprocessors | 541-MAPBGA (19x19) | N/A | 0°C ~ 85°C (TJ) | Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L Display & Interface Controllers: Keypad, LCD, MIPI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: 0°C ~ 85°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 541-MAPBGA (19×19) | 1,175 | |
 | | MCIMX7D2DVM12SD | NXP Semiconductors | IC MPU I.MX7D 1.2GHZ 541MAPBGA | Microprocessors | 541-MAPBGA (19x19) | N/A | 0°C ~ 85°C (TJ) | Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L Display & Interface Controllers: Keypad, LCD, MIPI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: 0°C ~ 85°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 541-MAPBGA (19×19) | 73 | |
 | | MCIMX7D3DVK10SC | NXP Semiconductors | IC MPU I.MX7D 1.0GHZ 488TFBGA | Microprocessors | 488-TFBGA (12x12) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L Display & Interface Controllers: Keypad, LCD, MIPI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 488-TFBGA (12×12) | 1,384 | |
 | | MCIMX7D3DVK10SD | NXP Semiconductors | IC MPU I.MX7D 1.0GHZ 488TFBGA | Microprocessors | 488-TFBGA (12x12) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L Display & Interface Controllers: Keypad, LCD, MIPI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 488-TFBGA (12×12) | 812 | |
 | | MCIMX7D3EVK10SC | NXP Semiconductors | IC MPU I.MX7D 1.0GHZ 488TFBGA | Microprocessors | 488-TFBGA (12x12) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L Display & Interface Controllers: Keypad, LCD, MIPI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 488-TFBGA (12×12) | 1,035 | |
 | | MCIMX7D3EVK10SD | NXP Semiconductors | IC MPU I.MX7D 1.0GHZ 488TFBGA | Microprocessors | 488-TFBGA (12x12) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L Display & Interface Controllers: Keypad, LCD, MIPI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 488-TFBGA (12×12) | 179 | |
 | | MCIMX7D5EVK10SD | NXP Semiconductors | IC MPU I.MX7D 1GHZ 488TFBGA | Microprocessors | 488-TFBGA (12x12) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3, DDR3L, LPDDR2, LPDDR3 Display & Interface Controllers: Keypad, LCD, MIPI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 488-TFBGA (12×12) | 1,045 | |