MCIMX7D3DVK10SD

IC MPU I.MX7D 1.0GHZ 488TFBGA
Part Description

ARM® Cortex®-A7, ARM® Cortex®-M4 Microprocessor IC i.MX7D 2 Core, 32-Bit 1.0GHz 488-TFBGA (12x12)

Quantity 1,253 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 7D
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time23 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A7, ARM® Cortex®-M4Device Package488-TFBGA (12x12)
Display & Interface ControllersKeypad, LCD, MIPIECCN5A992CEthernet10/100/1000Mbps (2)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature0°C ~ 95°C (TJ)Package / Case488-TFBGARAM ControllersLPDDR2, LPDDR3, DDR3, DDR3L
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesA-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Speed1.0GHzSupplier Device Package488-TFBGA (12×12)USBUSB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O1.8V, 3.3V

Overview of MCIMX7D3DVK10SD – IC MPU I.MX7D 1.0GHZ 488TFBGA

The MCIMX7D3DVK10SD is a dual-core microprocessor from the NXP i.MX 7D family combining an ARM® Cortex®-A7 application core with an ARM® Cortex®-M4 real-time core. It delivers up to 1.0 GHz application processing alongside an efficient microcontroller-class core for deterministic tasks, targeting connected and portable devices that require integrated connectivity and low-power operation.

Built for integrated system designs, this 32-bit, dual-core device supports a broad set of interfaces and memory options while incorporating hardware security features and a compact 488-TFBGA (12 × 12 mm) package for space-constrained applications.

Key Features

  • Heterogeneous Dual-Core Architecture — ARM Cortex-A7 up to 1.0 GHz paired with an ARM Cortex-M4 core for real-time processing and partitioned workloads.
  • Memory Interfaces — Integrated controllers for LPDDR2, LPDDR3, DDR3 and DDR3L memory types to support flexible system memory configurations.
  • Connectivity — Two 10/100/1000 Mbps Ethernet interfaces for robust wired networking in connected products.
  • USB Subsystem — Multiple USB ports including USB 2.0 + PHY (1) and USB 2.0 OTG + PHY (2) for device, host and OTG connectivity scenarios.
  • Display and Audio Interfaces — Display interface controllers including keypad, LCD and MIPI plus additional AC'97 audio interface support.
  • Multimedia Acceleration — Co-processor support for multimedia workloads with NEON™ MPE for enhanced signal processing.
  • Security Features — On-chip security elements including A-HAB, ARM TrustZone (ARM TZ), CAAM, CSU, SJC and SNVS to help protect boot and runtime operations.
  • Package and Mounting — 488-TFBGA package (12 × 12 mm, 0.4 mm pitch) in a surface-mount form factor suitable for compact boards.
  • Operating Range and Compliance — Consumer qualification with an operating temperature range of 0 °C to 95 °C and RoHS compliance.
  • Integrated Power Management — On-chip voltage regulation and LDO functionality are documented in the device datasheet for design reference.

Typical Applications

  • Connected Devices — Networked sensors and gateways leveraging dual Gigabit Ethernet and multiple USB interfaces for communication and peripheral connectivity.
  • Human-Machine Interfaces (HMI) — LCD and MIPI display support combined with application-level processing for responsive user interfaces.
  • Access Control and IP Telephony — Secure boot and runtime security features with integrated networking for access panels and IP phone implementations.
  • Portable Medical and Healthcare — Low-power, integrated processing and real‑time control via the Cortex-M4 core for portable medical devices and monitoring equipment.
  • Audio and Multimedia Devices — Multimedia co-processor support and audio interfaces for connected audio products.

Unique Advantages

  • Highly integrated dual-core solution: Combines application and real-time cores to simplify partitioning of user interface and time-critical tasks, reducing overall system complexity.
  • Flexible memory support: Wide compatibility with LPDDR2/LPDDR3/DDR3/DDR3L memory types enables designers to choose performance and cost trade-offs that match system requirements.
  • Extensive connectivity: Dual Gigabit Ethernet and multiple USB ports provide abundant I/O options for networked and peripheral-rich designs.
  • Comprehensive on-chip security: Multiple hardware security blocks support secure boot and run-time protection strategies suitable for consumer connected products.
  • Compact, manufacturable package: 488-TFBGA (12 × 12 mm) surface-mount package supports space-constrained applications while aligning with standard PCB assembly processes.
  • Documented power and analog parameters: Integrated LDO and detailed electrical characteristic documentation in the datasheet help accelerate design validation and system power planning.

Why Choose MCIMX7D3DVK10SD?

The MCIMX7D3DVK10SD positions itself as a balanced microprocessor for designers who need application-class performance together with deterministic real-time control. Its dual-core Cortex-A7/Cortex-M4 architecture, broad memory interface support, and extensive connectivity options make it suitable for connected, portable and HMI-focused designs where integration and documented electrical behavior are important.

Backed by the i.MX 7Dual family documentation, this device is appropriate for consumer applications requiring secure boot, Ethernet and USB connectivity, and a compact package footprint—helping teams move from prototype to production with reference material and device-level specifications available in the product datasheet.

Request a quote or submit an availability inquiry to receive pricing and lead-time information for the MCIMX7D3DVK10SD.

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