MCIMX7D3DVK10SC

IC MPU I.MX7D 1.0GHZ 488TFBGA
Part Description

ARM® Cortex®-A7, ARM® Cortex®-M4 Microprocessor IC i.MX7D 2 Core, 32-Bit 1.0GHz 488-TFBGA (12x12)

Quantity 1,907 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 7D
ManufacturerNXP USA Inc.
Manufacturing StatusNot For New Designs
Manufacturer Standard Lead Time23 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A7, ARM® Cortex®-M4Device Package488-TFBGA (12x12)
Display & Interface ControllersKeypad, LCD, MIPIECCN5A992CEthernet10/100/1000Mbps (2)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature0°C ~ 95°C (TJ)Package / Case488-TFBGARAM ControllersLPDDR2, LPDDR3, DDR3, DDR3L
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesA-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Speed1.0GHzSupplier Device Package488-TFBGA (12×12)USBUSB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O1.8V, 3.3V

Overview of MCIMX7D3DVK10SC – IC MPU I.MX7D 1.0GHZ 488TFBGA

The MCIMX7D3DVK10SC is a dual‑core microprocessor IC from NXP’s i.MX 7D family featuring ARM® Cortex®‑A7 and ARM® Cortex®‑M4 cores. It delivers up to 1.0 GHz Cortex‑A7 processing alongside a Cortex‑M4 companion core in a highly integrated package aimed at connected and portable embedded devices.

Designed for applications that require efficient processing with rich peripheral integration, the device targets markets such as audio, human‑machine interfaces, access control, portable medical/healthcare devices and IP phones, offering a balance of performance, security and flexible memory and I/O support.

Key Features

  • Dual‑Core Architecture ARM® Cortex®‑A7 plus ARM® Cortex®‑M4 cores in a 2‑core, 32‑bit configuration delivering up to 1.0 GHz on the A7 core.
  • Multimedia / DSP Integrated multimedia support including NEON™ MPE for media processing.
  • Flexible Memory Interfaces Supports LPDDR2, LPDDR3, DDR3 and DDR3L memory controllers, with memory interface options in the i.MX 7Dual family up to 1066 MT/s.
  • Rich Connectivity Dual Ethernet controllers (10/100/1000 Mbps) and multiple USB options: one USB 2.0 + PHY and two USB 2.0 OTG + PHY interfaces.
  • Display & Audio Interfaces Includes interfaces for keypad, LCD and MIPI to support display and user‑interface designs, plus AC'97 for audio connectivity.
  • Security Features On‑chip security functions including A‑HAB, ARM TrustZone, CAAM, CSU, SJC and SNVS to support secure boot and runtime security architectures.
  • Package and Mounting 488‑TFBGA package in a 12 × 12 mm BGA with 0.4 mm pitch; surface‑mount form factor suitable for compact embedded designs.
  • Operating Range Specified for operation from 0 °C to 95 °C to meet typical consumer embedded temperature requirements.
  • Regulatory / Compliance RoHS compliant.

Typical Applications

  • Audio Systems Low‑power multimedia and audio products leveraging the Cortex‑A7/Cortex‑M4 pairing and NEON media processing.
  • Connected Devices IoT and portable connected devices requiring integrated Ethernet and USB connectivity with secure boot options.
  • Human‑Machine Interfaces (HMI) Touch and display‑based control panels using LCD and MIPI interfaces for responsive UIs.
  • Access Control Secure access panels and controllers benefitting from on‑chip security modules and real‑time control capabilities.
  • Portable Medical & Healthcare Compact, battery‑sensitive medical devices that require efficient processing and a range of peripheral interfaces.

Unique Advantages

  • Highly Integrated Processing Dual‑core Cortex‑A7/Cortex‑M4 architecture consolidates application and real‑time control on a single device to reduce BOM and system complexity.
  • Flexible Memory Support Compatibility with LPDDR2/LPDDR3 and DDR3/DDR3L enables designers to match memory performance and power to application needs.
  • Comprehensive Connectivity Multiple Ethernet and USB PHY options plus display and audio interfaces streamline integration of networking, UI and media features.
  • Built‑in Security Primitives A range of security modules (A‑HAB, TrustZone, CAAM, CSU, SJC, SNVS) supports secure boot and data protection strategies.
  • Compact BGA Package 488‑TFBGA 12 × 12 mm package with 0.4 mm pitch enables space‑constrained designs while maintaining robust thermal and mechanical characteristics.
  • Targeted for Low‑Power Designs i.MX 7Dual family emphasis on high performance for low‑power requirements makes this device suitable for battery‑sensitive applications.

Why Choose MCIMX7D3DVK10SC?

The MCIMX7D3DVK10SC brings a balanced combination of application‑level processing and real‑time control in a single, compact package. Its Cortex‑A7 and Cortex‑M4 cores, flexible memory interface options and extensive peripheral set make it well suited for embedded designs that demand connectivity, security and efficient compute.

As a member of the i.MX 7Dual family, the device offers design scalability across the family and package options described in the product documentation, allowing teams to align performance and integration choices with project requirements while leveraging consistent architecture and interfaces.

Request a quote or submit a procurement inquiry to receive pricing, lead‑time and availability information for MCIMX7D3DVK10SC.

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