MCIMX7D2DVK12SC

IC MPU I.MX7D 1.2GHZ 488TFBGA
Part Description

ARM® Cortex®-A7, ARM® Cortex®-M4 Microprocessor IC i.MX7D 2 Core, 32-Bit 1.2GHz 488-TFBGA (12x12)

Quantity 797 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 7D
ManufacturerNXP USA Inc.
Manufacturing StatusNot For New Designs
Manufacturer Standard Lead Time23 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A7, ARM® Cortex®-M4Device Package488-TFBGA (12x12)
Display & Interface ControllersKeypad, LCD, MIPIECCN5A992CEthernet10/100/1000Mbps (2)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature0°C ~ 85°C (TJ)Package / Case488-TFBGARAM ControllersLPDDR2, LPDDR3, DDR3, DDR3L
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesA-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Speed1.2GHzSupplier Device Package488-TFBGA (12×12)USBUSB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O1.8V, 3.3V

Overview of MCIMX7D2DVK12SC – ARM® Cortex®-A7/M4 Dual-Core 1.2 GHz MPU, 488‑TFBGA (12×12)

The MCIMX7D2DVK12SC is an NXP i.MX 7D series microprocessor combining an ARM® Cortex®-A7 application core and an ARM® Cortex®-M4 real-time core in a dual‑core 32‑bit architecture running up to 1.2 GHz. It is designed for connected and portable devices that require a balance of processing performance, low-power operation and broad peripheral integration.

Targeted market segments include audio, connected devices, access control panels, human‑machine interfaces (HMI), portable medical and health care devices, and IP phones. The device provides a high degree of functional integration with documented system-level features and power management elements suited to embedded designs.

Key Features

  • Core Architecture  Dual-core 32-bit configuration with ARM® Cortex®-A7 and ARM® Cortex®-M4 processors, supporting up to 1.2 GHz operation for application and real‑time workloads.
  • Memory Support  Flexible memory controller support for LPDDR2, LPDDR3, DDR3 and DDR3L memory interfaces to match a range of system performance and power targets.
  • Connectivity  Dual Ethernet controllers supporting 10/100/1000 Mbps, plus multiple USB ports including USB 2.0 with PHY and USB 2.0 OTG with PHY options for robust wired connectivity.
  • Display and Peripheral Interfaces  Integrated display interface support including keypad, LCD and MIPI, alongside additional legacy interfaces such as AC'97 for audio and peripheral integration.
  • Security  Hardware security features including A‑HAB, ARM TrustZone, CAAM, CSU, SJC and SNVS to support secure boot, cryptography and trusted execution.
  • Multimedia Acceleration  Co‑processor and DSP capabilities listed as Multimedia with NEON™ MPE support for enhanced media processing.
  • Power and System Control  Device documentation includes integrated LDO regulator parameters, PLL and on‑chip oscillator characteristics to support platform power management and clocking.
  • Package and Compliance  488‑TFBGA package in a 12 × 12 mm footprint (0.4 mm pitch); RoHS compliant. Operating qualification listed as Consumer, and temperature range specified from 0 °C to 85 °C.

Typical Applications

  • Audio and Voice Devices  High‑integration connectivity and multimedia processing for IP phones and audio-centric embedded systems.
  • Connected Consumer Devices  Dual‑core processing and multiple network/USB interfaces for IoT gateways, home hubs and connected appliances.
  • Human‑Machine Interfaces (HMI)  LCD and MIPI display support with application and real‑time cores for responsive user interfaces and control logic.
  • Access Control and Security Panels  On‑chip security features and network interfaces to implement protected access systems and secure communications.
  • Portable Medical and Health Care  Low‑power family characteristics and mixed application/real‑time capabilities suitable for portable medical devices and monitoring equipment.

Unique Advantages

  • Highly Integrated Dual‑Core Design: Combines an application Cortex‑A7 core with a Cortex‑M4 real‑time core to consolidate application and control functions on a single IC, reducing system complexity.
  • Flexible Memory Options: Support for LPDDR2/LPDDR3 and DDR3/DDR3L lets designers choose the memory technology that best matches performance and power requirements.
  • Robust Connectivity Suite: Dual gigabit Ethernet and multiple USB PHYs enable diverse wired networking and peripheral configurations without additional bridging silicon.
  • Hardware Security Building Blocks: Dedicated security modules (A‑HAB, ARM TrustZone, CAAM, CSU, SJC, SNVS) provide foundations for secure boot and cryptographic functions.
  • Documented Power and Clocking: Integrated LDO, PLL and oscillator parameters are provided in the product documentation to help streamline power supply and clock design.
  • Compact, Manufacturing‑Ready Package: 488‑TFBGA 12 × 12 mm package supports surface mount assembly and RoHS compliance for consumer electronics production.

Why Choose MCIMX7D2DVK12SC?

The MCIMX7D2DVK12SC pairs application performance and real‑time responsiveness in a tightly integrated i.MX 7D family processor. With support for multiple memory types, dual gigabit Ethernet, USB PHYs, display interfaces and a suite of hardware security features, it is positioned for embedded designs that require connectivity, multimedia handling and secure operation within a consumer temperature range.

Designers building connected devices, HMI systems, access control panels or portable medical equipment will find the documented i.MX 7Dual family resources and on‑chip system features useful for platform development, scalability and long‑term product planning.

Request a quote or submit an inquiry to receive pricing and availability information for MCIMX7D2DVK12SC. Our team can provide further technical details and support documentation to help evaluate this i.MX 7D series processor for your design.

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