MCIMX6Z0DVM09AB

IC MPU I.MX6 900MHZ 289MAPBGA
Part Description

ARM® Cortex®-A7 Microprocessor IC i.MX6 1 Core, 32-Bit 900MHz 289-MAPBGA (14x14)

Quantity 496 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6Z
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A7Device Package289-MAPBGA (14x14)
Display & Interface ControllersKeypadECCN5A992CGraphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 95°C (TJ)
Package / Case289-LFBGARAM ControllersLPDDR2, DDR3, DDR3LREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSecurity FeaturesA-HAB, ARM TZ, CSU, SJC, SNVSSpeed900MHz
Supplier Device Package289-MAPBGA (14×14)USBUSB 2.0 OTG + PHY (2)

Overview of MCIMX6Z0DVM09AB – IC MPU I.MX6 900MHZ 289MAPBGA

The MCIMX6Z0DVM09AB is a single-core ARM® Cortex®‑A7 microprocessor IC from NXP’s i.MX 6Z family, running at up to 900 MHz in a compact 289‑MAPBGA (14 × 14 mm) package. It targets connected consumer devices and embedded applications that require efficient processing, integrated power management, and a broad set of peripheral interfaces.

Designed as an applications processor for consumer and connected-device markets, this part combines a 32‑bit Cortex‑A7 core with multimedia extensions and multiple memory and peripheral interfaces to simplify BOM and accelerate time-to-market for compact embedded designs.

Key Features

  • Core & Performance Single ARM® Cortex®‑A7 32‑bit core running at up to 900 MHz, providing a balance of performance and power efficiency for embedded consumer applications.
  • Multimedia Acceleration Integrated NEON™ SIMD multimedia support to accelerate signal and media processing tasks.
  • Memory & Storage Flexibility Memory controller support for LPDDR2, DDR3 and DDR3L plus support for raw and managed NAND, NOR, eMMC and Quad SPI enables a wide range of memory configurations.
  • Power Management Integrated power management module reduces external power-supply complexity and simplifies power sequencing for streamlined board design.
  • Interfaces & Connectivity Dual USB 2.0 OTG with PHY, ESAI audio interface, keypad/display controller support and a broad set of peripheral interfaces for connecting WLAN, Bluetooth and other modules.
  • Security & System Integrity Hardware security features including A‑HAB, ARM TrustZone, CSU, SJC and SNVS provide multiple layers of platform protection and secure boot capability.
  • Package & Thermal 289‑MAPBGA package (14 × 14 mm, 0.8 mm pitch) in a surface‑mount form factor, specified for an operating range of 0 °C to 95 °C and qualified for consumer applications.
  • Compliance RoHS‑compliant construction supports environmental and regulatory requirements for consumer electronics.

Typical Applications

  • Consumer Electronics Applications processors for consumer products where compact integration and efficient application processing are required.
  • Connected Devices & IoT Embedded endpoints and connected devices that need on-chip power management and a flexible set of memory and peripheral interfaces.
  • Telematics Systems for telematics and similar connected vehicle or fleet solutions within consumer-grade environments.
  • Audio & Peripheral Hubs Designs that require audio interfaces and multiple peripheral connections (WLAN, Bluetooth, GPS) supported by the device’s interface set.

Unique Advantages

  • Highly integrated single‑core platform: Single ARM Cortex‑A7 core at 900 MHz delivers efficient compute for control and application tasks while keeping board complexity low.
  • Broad memory support: Native controllers for LPDDR2, DDR3 and DDR3L plus support for multiple flash options let designers choose optimal cost/performance storage architectures.
  • On‑chip power management: Integrated power management module simplifies power sequencing and reduces the number of external components required on the PCB.
  • Robust security feature set: Multiple hardware security modules (A‑HAB, ARM TrustZone, CSU, SJC, SNVS) enable layered platform protection and secure boot strategies.
  • Compact, manufacturable package: 289‑MAPBGA (14 × 14 mm) surface‑mount package supports high‑density designs and standard board assembly processes.
  • Designed for consumer markets: Consumer qualification and RoHS compliance align the part with mainstream electronics manufacturing requirements.

Why Choose MCIMX6Z0DVM09AB?

MCIMX6Z0DVM09AB positions itself as an efficient, compact applications processor for consumer and connected-device designs. Its single ARM Cortex‑A7 core at up to 900 MHz, combined with integrated power management and a comprehensive set of memory and peripheral interfaces, helps reduce BOM complexity while enabling versatile system architectures.

This part is well suited for designers building consumer-grade embedded systems that require secure boot, flexible storage options, and a small package footprint. As a member of the i.MX 6ULZ family, it provides a consistent platform for development across connected and consumer applications backed by NXP’s documented technical resources.

Request a quote or submit an inquiry to begin procurement and receive pricing and availability information for MCIMX6Z0DVM09AB.

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