MCIMX6Z0DVM09AB
| Part Description |
ARM® Cortex®-A7 Microprocessor IC i.MX6 1 Core, 32-Bit 900MHz 289-MAPBGA (14x14) |
|---|---|
| Quantity | 496 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6Z |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A7 | Device Package | 289-MAPBGA (14x14) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Keypad | ECCN | 5A992C | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 95°C (TJ) | ||
| Package / Case | 289-LFBGA | RAM Controllers | LPDDR2, DDR3, DDR3L | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Security Features | A-HAB, ARM TZ, CSU, SJC, SNVS | Speed | 900MHz | ||
| Supplier Device Package | 289-MAPBGA (14×14) | USB | USB 2.0 OTG + PHY (2) |
Overview of MCIMX6Z0DVM09AB – IC MPU I.MX6 900MHZ 289MAPBGA
The MCIMX6Z0DVM09AB is a single-core ARM® Cortex®‑A7 microprocessor IC from NXP’s i.MX 6Z family, running at up to 900 MHz in a compact 289‑MAPBGA (14 × 14 mm) package. It targets connected consumer devices and embedded applications that require efficient processing, integrated power management, and a broad set of peripheral interfaces.
Designed as an applications processor for consumer and connected-device markets, this part combines a 32‑bit Cortex‑A7 core with multimedia extensions and multiple memory and peripheral interfaces to simplify BOM and accelerate time-to-market for compact embedded designs.
Key Features
- Core & Performance Single ARM® Cortex®‑A7 32‑bit core running at up to 900 MHz, providing a balance of performance and power efficiency for embedded consumer applications.
- Multimedia Acceleration Integrated NEON™ SIMD multimedia support to accelerate signal and media processing tasks.
- Memory & Storage Flexibility Memory controller support for LPDDR2, DDR3 and DDR3L plus support for raw and managed NAND, NOR, eMMC and Quad SPI enables a wide range of memory configurations.
- Power Management Integrated power management module reduces external power-supply complexity and simplifies power sequencing for streamlined board design.
- Interfaces & Connectivity Dual USB 2.0 OTG with PHY, ESAI audio interface, keypad/display controller support and a broad set of peripheral interfaces for connecting WLAN, Bluetooth and other modules.
- Security & System Integrity Hardware security features including A‑HAB, ARM TrustZone, CSU, SJC and SNVS provide multiple layers of platform protection and secure boot capability.
- Package & Thermal 289‑MAPBGA package (14 × 14 mm, 0.8 mm pitch) in a surface‑mount form factor, specified for an operating range of 0 °C to 95 °C and qualified for consumer applications.
- Compliance RoHS‑compliant construction supports environmental and regulatory requirements for consumer electronics.
Typical Applications
- Consumer Electronics Applications processors for consumer products where compact integration and efficient application processing are required.
- Connected Devices & IoT Embedded endpoints and connected devices that need on-chip power management and a flexible set of memory and peripheral interfaces.
- Telematics Systems for telematics and similar connected vehicle or fleet solutions within consumer-grade environments.
- Audio & Peripheral Hubs Designs that require audio interfaces and multiple peripheral connections (WLAN, Bluetooth, GPS) supported by the device’s interface set.
Unique Advantages
- Highly integrated single‑core platform: Single ARM Cortex‑A7 core at 900 MHz delivers efficient compute for control and application tasks while keeping board complexity low.
- Broad memory support: Native controllers for LPDDR2, DDR3 and DDR3L plus support for multiple flash options let designers choose optimal cost/performance storage architectures.
- On‑chip power management: Integrated power management module simplifies power sequencing and reduces the number of external components required on the PCB.
- Robust security feature set: Multiple hardware security modules (A‑HAB, ARM TrustZone, CSU, SJC, SNVS) enable layered platform protection and secure boot strategies.
- Compact, manufacturable package: 289‑MAPBGA (14 × 14 mm) surface‑mount package supports high‑density designs and standard board assembly processes.
- Designed for consumer markets: Consumer qualification and RoHS compliance align the part with mainstream electronics manufacturing requirements.
Why Choose MCIMX6Z0DVM09AB?
MCIMX6Z0DVM09AB positions itself as an efficient, compact applications processor for consumer and connected-device designs. Its single ARM Cortex‑A7 core at up to 900 MHz, combined with integrated power management and a comprehensive set of memory and peripheral interfaces, helps reduce BOM complexity while enabling versatile system architectures.
This part is well suited for designers building consumer-grade embedded systems that require secure boot, flexible storage options, and a small package footprint. As a member of the i.MX 6ULZ family, it provides a consistent platform for development across connected and consumer applications backed by NXP’s documented technical resources.
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