MCIMX6Y7DVM09AA
| Part Description |
ARM® Cortex®-A7 Microprocessor IC i.MX6 1 Core, 32-Bit 900MHz 289-MAPBGA (14x14) |
|---|---|
| Quantity | 843 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6Y |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ MPE | Core Processor | ARM® Cortex®-A7 | Device Package | 289-MAPBGA (14x14) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Electrophoretic, LCD | ECCN | 5A992C | Ethernet | 10/100Mbps (2) | ||
| Graphics Acceleration | No | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | 0°C ~ 95°C (TJ) | Package / Case | 289-LFBGA | RAM Controllers | LPDDR2, DDR3, DDR3L | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | A-HAB, ARM TZ, CSU, SJC, SNVS | ||
| Speed | 900MHz | Supplier Device Package | 289-MAPBGA (14×14) | USB | USB 2.0 OTG + PHY (2) | ||
| Voltage – I/O | 1.8V, 2.8V, 3.3V |
Overview of MCIMX6Y7DVM09AA – IC MPU I.MX6 900MHz 289-MAPBGA
The MCIMX6Y7DVM09AA is a single-core ARM® Cortex®-A7 microprocessor operating at 900 MHz, part of NXP Semiconductors' i.MX 6Y series. Designed for consumer embedded and connected-device applications, it combines a compact 289-MAPBGA (14×14 mm) package with an integrated peripheral set and on-chip power management.
This device targets consumer products that require efficient 32-bit application processing, flexible memory support and a range of connectivity options while benefiting from integrated security features and RoHS compliance.
Key Features
- Core
Single ARM® Cortex®-A7 core, 32-bit, running at 900 MHz for general-purpose embedded processing. - Memory Support
Flexible memory controllers support LPDDR2, DDR3 and DDR3L; datasheet also documents interfaces for Raw and Managed NAND, NOR flash, eMMC and Quad SPI. - Co‑processors
Includes multimedia co‑processors and NEON™ MPE acceleration for optimized media and signal processing tasks. - Integrated Power Management
On-chip power management module and integrated LDO regulator elements reduce external power sequencing complexity and simplify supply design. - Connectivity & Interfaces
Dual 10/100 Mbps Ethernet ports, two USB 2.0 OTG ports with PHY, and additional interfaces including CAN; display controllers for electrophoretic and LCD panels are provided. - Security
Hardware security features include A‑HAB, ARM TrustZone, CSU, SJC and SNVS to support secure boot and system integrity functions. - Package & Mounting
Supplier device package: 289‑MAPBGA (14×14 mm, 0.8 mm pitch); package case referenced as 289‑LFBGA. Surface-mount package suitable for compact board designs. - Operating Range & Compliance
Operating temperature: 0 °C to 95 °C. RoHS compliant and qualified for consumer applications.
Typical Applications
- Consumer Devices
Embedded processing for consumer-oriented products that require efficient application control and multimedia handling. - Connected Devices & Gateways
Dual Ethernet ports, USB OTG and multiple peripheral interfaces make this device suitable for networked consumer equipment and small gateways. - Display & HMI Control
Integrated display controllers for electrophoretic and LCD panels enable user-interface and e‑paper display applications. - Sensor and Multimedia Peripherals
Support for camera sensors and peripheral interfaces (as documented in the series datasheet) helps integrate imaging and sensor subsystems.
Unique Advantages
- Compact, surface-mount BGA package: Enables small, space-constrained designs using the 289‑MAPBGA (14×14 mm) footprint.
- Integrated power management: On-chip power module and LDO-related features reduce external BOM and simplify power sequencing.
- Broad memory and boot options: Support for LPDDR2/DDR3/DDR3L and multiple flash interfaces simplifies system memory choices and boot device flexibility.
- Security primitives included: A‑HAB, ARM TrustZone, CSU, SJC and SNVS provide hardware-level primitives for secure system design.
- Rich peripheral set for connectivity: Dual 10/100 Ethernet, USB 2.0 OTG with PHY, and CAN support common embedded connectivity needs without extensive external controllers.
- Designed for consumer product lifecycles: Consumer qualification and RoHS compliance align with mainstream product manufacturing and environmental requirements.
Why Choose MCIMX6Y7DVM09AA?
The MCIMX6Y7DVM09AA delivers a focused combination of single‑core Cortex‑A7 processing at 900 MHz, integrated power-management features and a comprehensive peripheral set tailored for consumer embedded designs. Its memory flexibility, hardware security features and compact BGA packaging make it a practical choice for space-limited, connected consumer products.
This part is well suited to engineers designing consumer-facing HMIs, networked appliances and multimedia-capable devices that require straightforward power sequencing, multiple interface options and on-chip security building blocks, backed by NXP Semiconductors' i.MX family documentation and datasheet guidance.
Request a quote or submit an RFQ to receive pricing and availability information for MCIMX6Y7DVM09AA.

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