MCIMX6Y7DVM09AA

IC MPU I.MX6 900MHZ 289MAPBGA
Part Description

ARM® Cortex®-A7 Microprocessor IC i.MX6 1 Core, 32-Bit 900MHz 289-MAPBGA (14x14)

Quantity 843 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6Y
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A7Device Package289-MAPBGA (14x14)
Display & Interface ControllersElectrophoretic, LCDECCN5A992CEthernet10/100Mbps (2)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature0°C ~ 95°C (TJ)Package / Case289-LFBGARAM ControllersLPDDR2, DDR3, DDR3L
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesA-HAB, ARM TZ, CSU, SJC, SNVS
Speed900MHzSupplier Device Package289-MAPBGA (14×14)USBUSB 2.0 OTG + PHY (2)
Voltage – I/O1.8V, 2.8V, 3.3V

Overview of MCIMX6Y7DVM09AA – IC MPU I.MX6 900MHz 289-MAPBGA

The MCIMX6Y7DVM09AA is a single-core ARM® Cortex®-A7 microprocessor operating at 900 MHz, part of NXP Semiconductors' i.MX 6Y series. Designed for consumer embedded and connected-device applications, it combines a compact 289-MAPBGA (14×14 mm) package with an integrated peripheral set and on-chip power management.

This device targets consumer products that require efficient 32-bit application processing, flexible memory support and a range of connectivity options while benefiting from integrated security features and RoHS compliance.

Key Features

  • Core 
    Single ARM® Cortex®-A7 core, 32-bit, running at 900 MHz for general-purpose embedded processing.
  • Memory Support 
    Flexible memory controllers support LPDDR2, DDR3 and DDR3L; datasheet also documents interfaces for Raw and Managed NAND, NOR flash, eMMC and Quad SPI.
  • Co‑processors 
    Includes multimedia co‑processors and NEON™ MPE acceleration for optimized media and signal processing tasks.
  • Integrated Power Management 
    On-chip power management module and integrated LDO regulator elements reduce external power sequencing complexity and simplify supply design.
  • Connectivity & Interfaces 
    Dual 10/100 Mbps Ethernet ports, two USB 2.0 OTG ports with PHY, and additional interfaces including CAN; display controllers for electrophoretic and LCD panels are provided.
  • Security 
    Hardware security features include A‑HAB, ARM TrustZone, CSU, SJC and SNVS to support secure boot and system integrity functions.
  • Package & Mounting 
    Supplier device package: 289‑MAPBGA (14×14 mm, 0.8 mm pitch); package case referenced as 289‑LFBGA. Surface-mount package suitable for compact board designs.
  • Operating Range & Compliance 
    Operating temperature: 0 °C to 95 °C. RoHS compliant and qualified for consumer applications.

Typical Applications

  • Consumer Devices 
    Embedded processing for consumer-oriented products that require efficient application control and multimedia handling.
  • Connected Devices & Gateways 
    Dual Ethernet ports, USB OTG and multiple peripheral interfaces make this device suitable for networked consumer equipment and small gateways.
  • Display & HMI Control 
    Integrated display controllers for electrophoretic and LCD panels enable user-interface and e‑paper display applications.
  • Sensor and Multimedia Peripherals 
    Support for camera sensors and peripheral interfaces (as documented in the series datasheet) helps integrate imaging and sensor subsystems.

Unique Advantages

  • Compact, surface-mount BGA package: Enables small, space-constrained designs using the 289‑MAPBGA (14×14 mm) footprint.
  • Integrated power management: On-chip power module and LDO-related features reduce external BOM and simplify power sequencing.
  • Broad memory and boot options: Support for LPDDR2/DDR3/DDR3L and multiple flash interfaces simplifies system memory choices and boot device flexibility.
  • Security primitives included: A‑HAB, ARM TrustZone, CSU, SJC and SNVS provide hardware-level primitives for secure system design.
  • Rich peripheral set for connectivity: Dual 10/100 Ethernet, USB 2.0 OTG with PHY, and CAN support common embedded connectivity needs without extensive external controllers.
  • Designed for consumer product lifecycles: Consumer qualification and RoHS compliance align with mainstream product manufacturing and environmental requirements.

Why Choose MCIMX6Y7DVM09AA?

The MCIMX6Y7DVM09AA delivers a focused combination of single‑core Cortex‑A7 processing at 900 MHz, integrated power-management features and a comprehensive peripheral set tailored for consumer embedded designs. Its memory flexibility, hardware security features and compact BGA packaging make it a practical choice for space-limited, connected consumer products.

This part is well suited to engineers designing consumer-facing HMIs, networked appliances and multimedia-capable devices that require straightforward power sequencing, multiple interface options and on-chip security building blocks, backed by NXP Semiconductors' i.MX family documentation and datasheet guidance.

Request a quote or submit an RFQ to receive pricing and availability information for MCIMX6Y7DVM09AA.

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