MCIMX6Y2DVM09AB

IC MPU I.MX6 900MHZ 289MAPBGA
Part Description

ARM® Cortex®-A7 Microprocessor IC i.MX6 1 Core, 32-Bit 900MHz 289-MAPBGA (14x14)

Quantity 1,370 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6Y
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A7Device Package289-MAPBGA (14x14)
Display & Interface ControllersElectrophoretic, LCDECCN5A992CEthernet10/100Mbps (2)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature0°C ~ 95°C (TJ)Package / Case289-LFBGARAM ControllersLPDDR2, DDR3, DDR3L
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesA-HAB, ARM TZ, CSU, SJC, SNVS
Speed900MHzSupplier Device Package289-MAPBGA (14×14)USBUSB 2.0 OTG + PHY (2)
Voltage – I/O1.8V, 2.8V, 3.3V

Overview of MCIMX6Y2DVM09AB – IC MPU I.MX6 900MHz 289MAPBGA

The MCIMX6Y2DVM09AB is an NXP Semiconductors single-core ARM® Cortex®-A7 microprocessor operating at up to 900 MHz, designed for connected consumer devices and embedded applications. As part of the i.MX 6Y family, it combines high-efficiency processing with a high degree of functional integration to simplify system design and reduce external component count.

Built with an integrated power management module and a broad set of memory and peripheral interfaces, this device targets consumer-focused applications that require efficient compute, flexible memory support, and robust security features.

Key Features

  • Core Single ARM® Cortex®-A7 core, 32-bit, running up to 900 MHz for efficient single-threaded processing.
  • Memory Support Supports LPDDR2, DDR3 and DDR3L memory controllers; datasheet references additional support for Raw and Managed NAND, NOR flash, eMMC and Quad SPI memory interfaces for flexible storage options.
  • Integrated Power Management Integrated power management module reduces external power supply complexity and simplifies power sequencing for compact, cost-effective designs.
  • Connectivity and I/O Dual 10/100 Mbps Ethernet interfaces, two USB 2.0 OTG ports with PHY, and CANbus support enable common wired connectivity and peripheral integration.
  • Multimedia and DSP Includes multimedia co-processor capabilities and NEON™ MPE support to accelerate media and signal processing tasks.
  • Display & Sensor Interfaces Display interface controllers for electrophoretic and LCD panels plus support for camera sensors and peripheral interfaces for WLAN/Bluetooth/GPS integration referenced in the family datasheet.
  • Security Hardware security features including A‑HAB, ARM TrustZone (ARM TZ), Central Security Unit (CSU), Secure JTAG Controller (SJC) and Secure Non-Volatile Storage (SNVS).
  • Package & Mounting 289‑MAPBGA supplier device package (14 × 14 mm, 0.8 mm pitch), surface-mount mounting for dense, production-ready PCB layouts.
  • Operational Range & Compliance Consumer qualification with an operating temperature range of 0 °C to 95 °C and RoHS compliance.

Typical Applications

  • Connected Consumer Devices — Host processing for smart home appliances and consumer electronics that require networked connectivity and local control.
  • Human‑Machine Interfaces — Drive LCD or electrophoretic displays and manage touch or sensor inputs for control panels and display modules.
  • Edge Peripheral Hubs — Aggregate data from sensors and cameras, provide protocol bridging (Ethernet/USB/CANbus) and local processing for consumer IoT gateways.

Unique Advantages

  • Single‑chip integration: Integrated power management and a wide set of memory and peripheral interfaces reduce external BOM and simplify board-level power sequencing.
  • Flexible memory support: Native controllers for LPDDR2, DDR3 and DDR3L plus support for NAND/NOR/eMMC/Quad SPI enable multiple storage and performance options.
  • Security baseline included: A suite of hardware security features (A‑HAB, ARM TZ, CSU, SJC, SNVS) helps meet consumer product security requirements without large software overhead.
  • Connectivity breadth: Dual 10/100 Ethernet, dual USB 2.0 OTG with PHY and CANbus provide versatile interfaces for networking and peripheral integration.
  • Compact packaging: 289‑MAPBGA (14 × 14 mm) package supports high-density designs while remaining suitable for automated surface-mount assembly.

Why Choose MCIMX6Y2DVM09AB?

The MCIMX6Y2DVM09AB positions itself as an efficient, highly integrated single‑core ARM Cortex‑A7 solution for consumer-focused connected devices. Its combination of a 900 MHz core, integrated power management, flexible memory support and hardware security features makes it well suited for designers building compact, networked consumer products with display and peripheral requirements.

As part of the i.MX 6Y family from NXP Semiconductors, this device offers designers a family-level roadmap for scalability within similar processor options, and the integration level helps reduce BOM complexity and accelerate time to market.

Request a quote or submit a request for pricing and availability to evaluate the MCIMX6Y2DVM09AB for your next connected consumer design.

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