MCIMX6Y7DVM09AB
| Part Description |
ARM® Cortex®-A7 Microprocessor IC i.MX6 1 Core, 32-Bit 900MHz 289-MAPBGA (14x14) |
|---|---|
| Quantity | 519 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6Y |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ MPE | Core Processor | ARM® Cortex®-A7 | Device Package | 289-MAPBGA (14x14) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Electrophoretic, LCD | ECCN | 5A992C | Ethernet | 10/100Mbps (2) | ||
| Graphics Acceleration | No | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | 0°C ~ 95°C (TJ) | Package / Case | 289-LFBGA | RAM Controllers | LPDDR2, DDR3, DDR3L | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | A-HAB, ARM TZ, CSU, SJC, SNVS | ||
| Speed | 900MHz | Supplier Device Package | 289-MAPBGA (14×14) | USB | USB 2.0 OTG + PHY (2) | ||
| Voltage – I/O | 1.8V, 2.8V, 3.3V |
Overview of MCIMX6Y7DVM09AB – IC MPU I.MX6 900MHZ 289MAPBGA
The MCIMX6Y7DVM09AB is an NXP i.MX 6ULL family microprocessor featuring a single ARM® Cortex®-A7 core running at up to 900 MHz. It targets connected consumer devices and embedded systems that require efficient single-core processing with integrated power and peripheral support.
Designed for compact, surface-mount implementations, this device delivers integrated power management, broad memory interface support and a range of connectivity options to simplify system design and accelerate time to market.
Key Features
- Processor Core Single ARM® Cortex®-A7 core, 32-bit, operating up to 900 MHz for efficient single-threaded applications.
- Multimedia and Acceleration Includes multimedia co-processors and NEON™ MPE for enhanced media processing and DSP-style workloads.
- Memory Interfaces Integrated controllers supporting LPDDR2, DDR3 and DDR3L plus multiple flash options (Raw and Managed NAND, NOR, eMMC, Quad SPI) for flexible memory subsystem design.
- Connectivity Dual 10/100 Mbps Ethernet ports, USB 2.0 OTG with PHY (2), and CAN interface provide wired connectivity options for networked and industrial consumer applications.
- Display and Sensor Support Display interface controllers include support for LCD and electrophoretic displays and connectivity to camera sensors and other peripherals.
- Integrated Power and Timing On-chip power management module, integrated LDOs, PLLs and oscillators reduce external power supply complexity and simplify sequencing.
- Security Features Hardware security elements including A-HAB, ARM TrustZone, CSU, SJC and SNVS for authenticated boot and system integrity.
- Package and Mounting 289-ball MAPBGA package in a 14 × 14 mm footprint, surface-mount device suitable for dense board layouts.
- Qualification and Compliance Consumer qualification and RoHS compliance for mainstream embedded consumer applications.
- Operating Range Specified operating temperature range: 0 °C to 95 °C.
Typical Applications
- Consumer Connected Devices Single-core processing and integrated power management make it suitable for compact, networked consumer products.
- Display-Enabled Devices LCD and electrophoretic display controllers enable user interfaces and low-power display applications.
- Multimedia and Sensor Systems NEON™ MPE and multimedia co-processors support media processing and camera sensor interfacing for imaging applications.
- Embedded Networking Appliances Dual 10/100 Ethernet ports, USB OTG and CAN provide flexible wired connectivity for networked embedded systems.
Unique Advantages
- Highly Integrated Power Management: On-chip power management and integrated LDOs reduce external components and simplify power sequencing.
- Flexible Memory and Boot Options: Support for LPDDR2, DDR3/DDR3L and multiple flash types (NAND, NOR, eMMC, Quad SPI) enables adaptable storage architectures.
- Broad Connectivity Set: Dual Ethernet, USB 2.0 OTG with PHY and CAN provide multiple wired interfaces from a single device.
- Security-Ready Platform: Built-in security features such as A-HAB and ARM TrustZone support authenticated boot and runtime integrity measures.
- Compact Surface-Mount Package: 289-MAPBGA (14 × 14 mm) package offers a small footprint for space-constrained designs.
- Consumer-Grade Qualification: Consumer qualification and RoHS compliance align the device with mainstream embedded product requirements.
Why Choose MCIMX6Y7DVM09AB?
The MCIMX6Y7DVM09AB combines a 900 MHz ARM® Cortex®-A7 core with integrated power management, extensive memory support and a versatile set of connectivity interfaces to deliver a compact, efficient solution for embedded consumer applications. Its built-in security features and on-chip timing and power resources simplify system design while enabling robust, connected products.
This part is well suited for developers building display-enabled consumer devices, connected appliances, and sensor-driven products that require a balance of processing efficiency, integration and proven platform support within the i.MX 6ULL family.
Request a quote or submit an inquiry to receive pricing and availability information for MCIMX6Y7DVM09AB and to discuss how it fits your next embedded design.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
Employees: 38,000+
Revenue: $10.53 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016