MCIMX6Y7DVM09AB

IC MPU I.MX6 900MHZ 289MAPBGA
Part Description

ARM® Cortex®-A7 Microprocessor IC i.MX6 1 Core, 32-Bit 900MHz 289-MAPBGA (14x14)

Quantity 519 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6Y
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A7Device Package289-MAPBGA (14x14)
Display & Interface ControllersElectrophoretic, LCDECCN5A992CEthernet10/100Mbps (2)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature0°C ~ 95°C (TJ)Package / Case289-LFBGARAM ControllersLPDDR2, DDR3, DDR3L
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesA-HAB, ARM TZ, CSU, SJC, SNVS
Speed900MHzSupplier Device Package289-MAPBGA (14×14)USBUSB 2.0 OTG + PHY (2)
Voltage – I/O1.8V, 2.8V, 3.3V

Overview of MCIMX6Y7DVM09AB – IC MPU I.MX6 900MHZ 289MAPBGA

The MCIMX6Y7DVM09AB is an NXP i.MX 6ULL family microprocessor featuring a single ARM® Cortex®-A7 core running at up to 900 MHz. It targets connected consumer devices and embedded systems that require efficient single-core processing with integrated power and peripheral support.

Designed for compact, surface-mount implementations, this device delivers integrated power management, broad memory interface support and a range of connectivity options to simplify system design and accelerate time to market.

Key Features

  • Processor Core Single ARM® Cortex®-A7 core, 32-bit, operating up to 900 MHz for efficient single-threaded applications.
  • Multimedia and Acceleration Includes multimedia co-processors and NEON™ MPE for enhanced media processing and DSP-style workloads.
  • Memory Interfaces Integrated controllers supporting LPDDR2, DDR3 and DDR3L plus multiple flash options (Raw and Managed NAND, NOR, eMMC, Quad SPI) for flexible memory subsystem design.
  • Connectivity Dual 10/100 Mbps Ethernet ports, USB 2.0 OTG with PHY (2), and CAN interface provide wired connectivity options for networked and industrial consumer applications.
  • Display and Sensor Support Display interface controllers include support for LCD and electrophoretic displays and connectivity to camera sensors and other peripherals.
  • Integrated Power and Timing On-chip power management module, integrated LDOs, PLLs and oscillators reduce external power supply complexity and simplify sequencing.
  • Security Features Hardware security elements including A-HAB, ARM TrustZone, CSU, SJC and SNVS for authenticated boot and system integrity.
  • Package and Mounting 289-ball MAPBGA package in a 14 × 14 mm footprint, surface-mount device suitable for dense board layouts.
  • Qualification and Compliance Consumer qualification and RoHS compliance for mainstream embedded consumer applications.
  • Operating Range Specified operating temperature range: 0 °C to 95 °C.

Typical Applications

  • Consumer Connected Devices Single-core processing and integrated power management make it suitable for compact, networked consumer products.
  • Display-Enabled Devices LCD and electrophoretic display controllers enable user interfaces and low-power display applications.
  • Multimedia and Sensor Systems NEON™ MPE and multimedia co-processors support media processing and camera sensor interfacing for imaging applications.
  • Embedded Networking Appliances Dual 10/100 Ethernet ports, USB OTG and CAN provide flexible wired connectivity for networked embedded systems.

Unique Advantages

  • Highly Integrated Power Management: On-chip power management and integrated LDOs reduce external components and simplify power sequencing.
  • Flexible Memory and Boot Options: Support for LPDDR2, DDR3/DDR3L and multiple flash types (NAND, NOR, eMMC, Quad SPI) enables adaptable storage architectures.
  • Broad Connectivity Set: Dual Ethernet, USB 2.0 OTG with PHY and CAN provide multiple wired interfaces from a single device.
  • Security-Ready Platform: Built-in security features such as A-HAB and ARM TrustZone support authenticated boot and runtime integrity measures.
  • Compact Surface-Mount Package: 289-MAPBGA (14 × 14 mm) package offers a small footprint for space-constrained designs.
  • Consumer-Grade Qualification: Consumer qualification and RoHS compliance align the device with mainstream embedded product requirements.

Why Choose MCIMX6Y7DVM09AB?

The MCIMX6Y7DVM09AB combines a 900 MHz ARM® Cortex®-A7 core with integrated power management, extensive memory support and a versatile set of connectivity interfaces to deliver a compact, efficient solution for embedded consumer applications. Its built-in security features and on-chip timing and power resources simplify system design while enabling robust, connected products.

This part is well suited for developers building display-enabled consumer devices, connected appliances, and sensor-driven products that require a balance of processing efficiency, integration and proven platform support within the i.MX 6ULL family.

Request a quote or submit an inquiry to receive pricing and availability information for MCIMX6Y7DVM09AB and to discuss how it fits your next embedded design.

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