MCIMX6Z0DVM09ABR

I.MX6ULZ, 289MAPBGA
Part Description

ARM® Cortex®-A7 Microprocessor IC i.MX6ULZ 1 Core, 32-Bit 900MHz 289-MAPBGA (14x14)

Quantity 370 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6Z
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A7Device Package289-MAPBGA (14x14)
Display & Interface ControllersKeypadECCNN/AGraphics AccelerationNo
HTS CodeN/AMoisture Sensitivity LevelN/AMounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 95°C (TJ)
Package / Case289-LFBGARAM ControllersLPDDR2, DDR3, DDR3LREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSecurity FeaturesA-HAB, ARM TZ, CSU, SJC, SNVSSpeed900MHz
Supplier Device Package289-MAPBGA (14×14)USBUSB 2.0 OTG + PHY (2)

Overview of MCIMX6Z0DVM09ABR – I.MX6ULZ, 289MAPBGA

The MCIMX6Z0DVM09ABR is a single-core ARM® Cortex®-A7 microprocessor operating at up to 900 MHz in a 289-MAPBGA (14 × 14 mm) surface-mount package. Designed for embedded and consumer connected devices, this i.MX 6Z family device combines a compact footprint with integrated power-management features and a broad set of peripheral and memory interfaces.

With multimedia DSP and NEON™ SIMD support, flexible memory controller options, and integrated USB 2.0 OTG PHYs, the device is suited to space-constrained designs that require efficient processing, peripheral connectivity and on-chip security building blocks.

Key Features

  • Core 
    Single ARM® Cortex®-A7 32-bit core running up to 900 MHz, providing deterministic application processing in embedded systems.
  • Co-Processors 
    Multimedia DSP and NEON™ SIMD support for accelerated signal and media processing.
  • Memory Support 
    Controllers for LPDDR2, DDR3 and DDR3L and support for a wide range of memory types described in the series datasheet (Raw and Managed NAND, NOR, eMMC, Quad SPI).
  • Interfaces 
    Keypad display controller and additional interfaces including ESAI; broad peripheral connectivity options to support wireless modules and sensors as described in the series documentation.
  • USB 
    Two USB 2.0 OTG ports with integrated PHYs for host/device connectivity.
  • Security 
    Hardware security features listed for the device: A-HAB, ARM TZ, CSU, SJC and SNVS for platform security and trusted boot/secure storage functions.
  • Power & Integration 
    Integrated power management module in the i.MX 6ULL family reduces external power-supply complexity and simplifies sequencing (series-level detail from datasheet).
  • Package & Mounting 
    289-MAPBGA supplier device package (14 × 14 mm) with surface-mount mounting; package information and mechanical details available in the series documentation.
  • Operating Range & Compliance 
    Operational temperature range: 0 °C to 95 °C. RoHS-compliant.

Typical Applications

  • Connected IoT Devices 
    Processor performance and integrated interfaces enable compact edge devices that require networking and peripheral connectivity.
  • Consumer Embedded Products 
    Single-core Cortex-A7 performance with multimedia DSP support fits consumer-focused embedded applications where efficiency and integration are important.
  • User Interface Controllers 
    Keypad controller and general-purpose interfaces support human–machine interface designs for appliances and control panels.
  • Wireless-Enabled Modules 
    Flexible memory and peripheral options allow easy integration with WLAN, Bluetooth and GNSS modules as described in the series documentation.

Unique Advantages

  • Highly integrated platform: On-chip power-management and a broad set of memory and peripheral interfaces reduce external BOM complexity and simplify board design.
  • Efficient single-core processing: ARM® Cortex®-A7 at up to 900 MHz provides a balance of performance and power efficiency for embedded workloads.
  • Flexible memory support: Native controllers for LPDDR2, DDR3 and DDR3L plus series-level support for NAND, NOR, eMMC and Quad SPI enable scalable storage and memory choices.
  • Built-in security features: A-HAB, ARM TZ, CSU, SJC and SNVS provide a multi-layer security foundation for secure boot, trusted execution and protected storage.
  • Dual USB OTG with PHYs: Two integrated USB 2.0 OTG ports simplify host/device connectivity without the need for external PHYs.
  • Compact surface-mount package: 289-MAPBGA (14 × 14 mm) package supports high-density system designs where PCB real estate is limited.

Why Choose MCIMX6Z0DVM09ABR?

The MCIMX6Z0DVM09ABR positions itself as a compact, integrated microprocessor option for embedded and consumer connected products that need efficient single-core processing, multimedia acceleration, and a broad set of memory and peripheral interfaces. Its on-chip power-management features and hardware security building blocks help streamline system design and improve platform robustness.

Choose this device for designs that require a balance of processing capability, integration and flexible memory/peripheral options—particularly for compact, surface-mount implementations. The part’s temperature range, RoHS compliance and package detail support reliable deployment in consumer and connected-device applications described by the i.MX 6ULL series documentation.

Request a quote or submit an inquiry to get pricing and availability information for MCIMX6Z0DVM09ABR and to discuss design-in support for your project.

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