MCIMX6Z0DVM09ABR
| Part Description |
ARM® Cortex®-A7 Microprocessor IC i.MX6ULZ 1 Core, 32-Bit 900MHz 289-MAPBGA (14x14) |
|---|---|
| Quantity | 370 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6Z |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A7 | Device Package | 289-MAPBGA (14x14) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Keypad | ECCN | N/A | Graphics Acceleration | No | ||
| HTS Code | N/A | Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 95°C (TJ) | ||
| Package / Case | 289-LFBGA | RAM Controllers | LPDDR2, DDR3, DDR3L | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Security Features | A-HAB, ARM TZ, CSU, SJC, SNVS | Speed | 900MHz | ||
| Supplier Device Package | 289-MAPBGA (14×14) | USB | USB 2.0 OTG + PHY (2) |
Overview of MCIMX6Z0DVM09ABR – I.MX6ULZ, 289MAPBGA
The MCIMX6Z0DVM09ABR is a single-core ARM® Cortex®-A7 microprocessor operating at up to 900 MHz in a 289-MAPBGA (14 × 14 mm) surface-mount package. Designed for embedded and consumer connected devices, this i.MX 6Z family device combines a compact footprint with integrated power-management features and a broad set of peripheral and memory interfaces.
With multimedia DSP and NEON™ SIMD support, flexible memory controller options, and integrated USB 2.0 OTG PHYs, the device is suited to space-constrained designs that require efficient processing, peripheral connectivity and on-chip security building blocks.
Key Features
- Core
Single ARM® Cortex®-A7 32-bit core running up to 900 MHz, providing deterministic application processing in embedded systems. - Co-Processors
Multimedia DSP and NEON™ SIMD support for accelerated signal and media processing. - Memory Support
Controllers for LPDDR2, DDR3 and DDR3L and support for a wide range of memory types described in the series datasheet (Raw and Managed NAND, NOR, eMMC, Quad SPI). - Interfaces
Keypad display controller and additional interfaces including ESAI; broad peripheral connectivity options to support wireless modules and sensors as described in the series documentation. - USB
Two USB 2.0 OTG ports with integrated PHYs for host/device connectivity. - Security
Hardware security features listed for the device: A-HAB, ARM TZ, CSU, SJC and SNVS for platform security and trusted boot/secure storage functions. - Power & Integration
Integrated power management module in the i.MX 6ULL family reduces external power-supply complexity and simplifies sequencing (series-level detail from datasheet). - Package & Mounting
289-MAPBGA supplier device package (14 × 14 mm) with surface-mount mounting; package information and mechanical details available in the series documentation. - Operating Range & Compliance
Operational temperature range: 0 °C to 95 °C. RoHS-compliant.
Typical Applications
- Connected IoT Devices
Processor performance and integrated interfaces enable compact edge devices that require networking and peripheral connectivity. - Consumer Embedded Products
Single-core Cortex-A7 performance with multimedia DSP support fits consumer-focused embedded applications where efficiency and integration are important. - User Interface Controllers
Keypad controller and general-purpose interfaces support human–machine interface designs for appliances and control panels. - Wireless-Enabled Modules
Flexible memory and peripheral options allow easy integration with WLAN, Bluetooth and GNSS modules as described in the series documentation.
Unique Advantages
- Highly integrated platform: On-chip power-management and a broad set of memory and peripheral interfaces reduce external BOM complexity and simplify board design.
- Efficient single-core processing: ARM® Cortex®-A7 at up to 900 MHz provides a balance of performance and power efficiency for embedded workloads.
- Flexible memory support: Native controllers for LPDDR2, DDR3 and DDR3L plus series-level support for NAND, NOR, eMMC and Quad SPI enable scalable storage and memory choices.
- Built-in security features: A-HAB, ARM TZ, CSU, SJC and SNVS provide a multi-layer security foundation for secure boot, trusted execution and protected storage.
- Dual USB OTG with PHYs: Two integrated USB 2.0 OTG ports simplify host/device connectivity without the need for external PHYs.
- Compact surface-mount package: 289-MAPBGA (14 × 14 mm) package supports high-density system designs where PCB real estate is limited.
Why Choose MCIMX6Z0DVM09ABR?
The MCIMX6Z0DVM09ABR positions itself as a compact, integrated microprocessor option for embedded and consumer connected products that need efficient single-core processing, multimedia acceleration, and a broad set of memory and peripheral interfaces. Its on-chip power-management features and hardware security building blocks help streamline system design and improve platform robustness.
Choose this device for designs that require a balance of processing capability, integration and flexible memory/peripheral options—particularly for compact, surface-mount implementations. The part’s temperature range, RoHS compliance and package detail support reliable deployment in consumer and connected-device applications described by the i.MX 6ULL series documentation.
Request a quote or submit an inquiry to get pricing and availability information for MCIMX6Z0DVM09ABR and to discuss design-in support for your project.

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