MCIMX7D3EVK10SC
| Part Description |
ARM® Cortex®-A7, ARM® Cortex®-M4 Microprocessor IC i.MX7D 2 Core, 32-Bit 1.0GHz 488-TFBGA (12x12) |
|---|---|
| Quantity | 1,528 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 7D |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Not For New Designs |
| Manufacturer Standard Lead Time | 23 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ MPE | Core Processor | ARM® Cortex®-A7, ARM® Cortex®-M4 | Device Package | 488-TFBGA (12x12) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Keypad, LCD, MIPI | ECCN | 5A992C | Ethernet | 10/100/1000Mbps (2) | ||
| Graphics Acceleration | No | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 32-Bit | ||
| Operating Temperature | -20°C ~ 105°C (TJ) | Package / Case | 488-TFBGA | RAM Controllers | LPDDR2, LPDDR3, DDR3, DDR3L | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS | ||
| Speed | 1.0GHz | Supplier Device Package | 488-TFBGA (12×12) | USB | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | ||
| Voltage – I/O | 1.8V, 3.3V |
Overview of MCIMX7D3EVK10SC – IC MPU I.MX7D 1.0GHZ 488TFBGA
The MCIMX7D3EVK10SC is a dual‑core microprocessor IC from NXP Semiconductors combining an ARM® Cortex®‑A7 application core and an ARM® Cortex®‑M4 real‑time core. The device operates up to 1.0 GHz and is supplied in a 488‑TFBGA (12×12) surface‑mount package for embedded applications.
Designed for embedded designs that require application‑class processing together with real‑time control, the part integrates a broad set of connectivity, memory interface options and on‑chip security features documented in the i.MX 7Dual reference materials.
Key Features
- Core Architecture Dual‑core design with ARM® Cortex®‑A7 and ARM® Cortex®‑M4 cores; 32‑bit operation and up to 1 GHz performance for application and real‑time tasks.
- Co‑processors Integrated multimedia co‑processors including NEON™ MPE for advanced signal processing and multimedia workloads.
- Memory Interfaces External memory controller support for LPDDR2, LPDDR3, DDR3 and DDR3L to enable flexible system memory configurations.
- Display & I/O Display interface controllers include support for keypad, LCD and MIPI interfaces to drive user interfaces and camera subsystems.
- Connectivity Dual Ethernet interfaces rated 10/100/1000 Mbps and multiple USB ports: one USB 2.0 with PHY plus two USB 2.0 OTG ports with PHY; AC'97 audio interface included.
- Security On‑chip security features listed for the series include A‑HAB, ARM TrustZone (ARM TZ), CAAM, CSU, SJC and SNVS to support secure boot and system integrity functions.
- System Features (reference manual) The i.MX 7Dual family reference material documents system infrastructure including clocking and resets, interrupts and DMA, on‑chip memory and external memory interfaces, timers, audio and general connectivity interfaces.
- Package & Mounting 488‑TFBGA package (12×12) in a surface‑mount form factor for compact board designs.
- Operating Range & Compliance Rated operating temperature range −20 °C to 105 °C and RoHS compliant.
Typical Applications
- Embedded Control Systems — Dual‑core arrangement separates application processing from real‑time control tasks, useful for control and monitoring applications.
- Human‑Machine Interfaces (HMI) — LCD and MIPI display support with keypad interface enables responsive user interfaces for operator panels and touch displays.
- Networked Gateways & IoT Devices — Dual 10/100/1000 Mbps Ethernet interfaces and multiple USB ports provide connectivity for routers, gateways and edge devices.
- Multimedia & Audio Products — NEON™ MPE multimedia acceleration and AC'97 audio interface support audio processing and media playback functions.
Unique Advantages
- Heterogeneous processing — ARM® Cortex®‑A7 plus Cortex‑M4 cores enable consolidation of application software and deterministic control in a single IC.
- Flexible memory support — Controllers for LPDDR2/LPDDR3 and DDR3/DDR3L allow designers to choose memory technologies that match performance and power goals.
- Comprehensive connectivity — Dual Gigabit Ethernet, multiple USB interfaces and display I/O reduce the need for external bridging components.
- Integrated security features — On‑chip security building blocks such as A‑HAB, ARM TrustZone and CAAM help implement secure boot and data protection functions.
- Compact SMD package — 488‑TFBGA (12×12) surface‑mount package supports space‑constrained board layouts.
- Wide operating temperature — −20 °C to 105 °C rating supports a range of embedded operating environments.
Why Choose MCIMX7D3EVK10SC?
The MCIMX7D3EVK10SC positions itself as a balanced solution for embedded products that need application‑level processing alongside real‑time control. By combining an ARM® Cortex®‑A7 core with an ARM® Cortex®‑M4 core, flexible memory interfaces, robust connectivity and integrated security features, it helps reduce BOM complexity and accelerates system integration.
Backed by NXP Semiconductors and documented in the i.MX 7Dual reference materials, the device is suited to designers building compact, connected embedded systems where multicore processing, security and flexible I/O are required.
Request a quote or submit a pricing inquiry for MCIMX7D3EVK10SC today to check availability and delivery options.

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