MCIMX7D5EVM10SD

IC MPU I.MX7D 1.0GHZ 541MAPBGA
Part Description

ARM® Cortex®-A7, ARM® Cortex®-M4 Microprocessor IC i.MX7D 2 Core, 32-Bit 1.0GHz 541-MAPBGA (19x19)

Quantity 1,385 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 7D
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time23 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A7, ARM® Cortex®-M4Device Package541-MAPBGA (19x19)
Display & Interface ControllersKeypad, LCD, MIPIECCN5A992CEthernet10/100/1000Mbps (2)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-20°C ~ 105°C (TJ)Package / Case541-LFBGARAM ControllersLPDDR2, LPDDR3, DDR3, DDR3L
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesA-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Speed1.0GHzSupplier Device Package541-MAPBGA (19×19)USBUSB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O1.8V, 3.3V

Overview of MCIMX7D5EVM10SD – IC MPU I.MX7D 1.0GHZ 541MAPBGA

The MCIMX7D5EVM10SD is a dual-core microprocessor IC from NXP Semiconductors’ i.MX 7D family featuring heterogeneous ARM cores: an ARM® Cortex®-A7 application core and an ARM® Cortex®-M4 companion core. The device is specified at 1 GHz for the application core and is supplied in a 541-MAPBGA (19×19) surface-mount package.

Designed for connected and portable devices, the i.MX7D architecture combines general-purpose processing with a real-time microcontroller core and integrated peripheral interfaces to address applications such as audio, human-machine interfaces, access control, portable medical/healthcare devices, and IP phones.

Key Features

  • Core and Processing  Dual-core heterogeneous architecture with ARM® Cortex®-A7 plus ARM® Cortex®-M4; 32-bit operation and a Cortex-A7 core frequency of 1 GHz.
  • Memory Support  Flexible memory interface supporting LPDDR2, LPDDR3, DDR3 and DDR3L; datasheet reference indicates support for 32-bit DDR interfaces and common performance profiles.
  • Connectivity  Dual 10/100/1000 Mbps Ethernet interfaces and multiple USB ports (one USB 2.0 + PHY and two USB 2.0 OTG + PHY) for robust wired and USB peripheral connectivity.
  • Multimedia and Accelerators  Multimedia co-processor support including NEON™ MPE for enhanced media processing workloads.
  • Display and Audio Interfaces  Integrated display interface controllers with support for keypad, LCD and MIPI connections; additional audio interface support via AC'97.
  • Security  On-chip security features including A-HAB, ARM TrustZone (ARM TZ), CAAM, CSU, SJC and SNVS for hardware-assisted security and system integrity.
  • Package and Mounting  541-MAPBGA supplier device package (19×19 mm) with surface-mount mounting type; package details and pin assignments are documented in the datasheet.
  • Operating Range  Specified operating temperature range of −20 °C to 105 °C for a broad set of embedded operating environments.

Typical Applications

  • Audio Systems  Use the dual-core i.MX7D to combine application-level processing and real-time audio tasks with available multimedia acceleration.
  • Connected Devices  Implement networked IoT and edge devices using dual Gigabit Ethernet and multiple USB interfaces for wired connectivity and peripheral support.
  • Human–Machine Interfaces (HMI)  Drive LCD and MIPI displays and keypad interfaces for embedded HMIs and control panels.
  • Portable Medical and Healthcare  Leverage the heterogeneous cores and security features for secure data handling and responsive local processing in portable medical devices.
  • Access Control and IP Phones  Utilize integrated networking, audio interfaces and security capabilities for secure access systems and VoIP endpoint designs.

Unique Advantages

  • Heterogeneous Dual-Core Architecture: Combines an ARM® Cortex®-A7 application core with an ARM® Cortex®-M4 companion core to separate high-level OS tasks from real-time functions.
  • Flexible Memory Options: Support for LPDDR2/LPDDR3 and DDR3/DDR3L provides design flexibility across performance and power profiles.
  • Robust Wired and USB Connectivity: Dual Gigabit Ethernet ports plus multiple USB 2.0 and OTG PHYs enable a wide range of high-bandwidth peripheral and network connections.
  • Integrated Security Building Blocks: Hardware security modules and TrustZone support help simplify implementation of secure boot and cryptographic operations.
  • Compact Surface-Mount Package: 541-MAPBGA (19×19) package provides a compact footprint for space-constrained embedded systems.
  • Documented Family and Package Support: The i.MX 7Dual family datasheet and package information provide detailed electrical, timing and packaging specifications for design and verification.

Why Choose MCIMX7D5EVM10SD?

The MCIMX7D5EVM10SD positions itself as a versatile, dual-core embedded processor for designs that require a mix of application-level processing and real-time control. Its combination of an ARM® Cortex®-A7 core at 1 GHz and an ARM® Cortex®-M4 companion core, together with flexible memory support and extensive I/O, makes it suitable for connected devices, HMIs, audio systems and portable medical equipment.

Backed by NXP Semiconductors’ i.MX7D family documentation and package references, this device offers design teams clear electrical, timing and package data to support development, validation and scaling of embedded products that require secure, networked and responsive processing.

Request a quote or submit a purchase inquiry for the MCIMX7D5EVM10SD to begin integrating this i.MX7D dual-core solution into your next embedded design.

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