MCIMX7D7DVM10SD

IC MPU I.MX7D 1.0GHZ 541MAPBGA
Part Description

ARM® Cortex®-A7, ARM® Cortex®-M4 Microprocessor IC i.MX7D 2 Core, 32-Bit 1.0GHz 541-MAPBGA (19x19)

Quantity 944 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 7D
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time23 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A7, ARM® Cortex®-M4Device Package541-MAPBGA (19x19)
Display & Interface ControllersKeypad, LCD, MIPIECCN5A992CEthernet10/100/1000Mbps (2)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature0°C ~ 95°C (TJ)Package / Case541-LFBGARAM ControllersLPDDR2, LPDDR3, DDR3, DDR3L
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesA-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Speed1.0GHzSupplier Device Package541-MAPBGA (19×19)USBUSB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O1.8V, 3.3V

Overview of MCIMX7D7DVM10SD – IC MPU I.MX7D 1.0GHZ 541MAPBGA

The MCIMX7D7DVM10SD is a dual‑core microprocessor from NXP Semiconductors' i.MX 7D family, integrating an ARM® Cortex®‑A7 and an ARM® Cortex®‑M4 on a single 32‑bit platform running at 1.0 GHz. The device is designed for connected and portable consumer applications, delivering high‑performance processing for low‑power requirements with a high degree of functional integration.

Packaged in a 541‑MAPBGA (19 × 19 mm) surface‑mount package and rated for an operating range of 0 °C to 95 °C, this MPU provides a compact, system‑level option for embedded designs that require heterogeneous processing, security features, and multiple memory and peripheral interfaces.

Key Features

  • Cores and Architecture  Dual‑core configuration with ARM® Cortex®‑A7 and ARM® Cortex®‑M4 processors; 32‑bit operation at up to 1.0 GHz for responsive application processing and real‑time control.
  • Co‑processing and Acceleration  Multimedia co‑processor support with NEON™ MPE for enhanced media processing; note that the device reports no dedicated graphics acceleration.
  • Memory Interfaces  Supports LPDDR2, LPDDR3, DDR3, and DDR3L memory controllers to match a range of system memory choices and performance targets.
  • Connectivity  Dual Gigabit Ethernet ports (10/100/1000 Mbps) and multiple USB 2.0 controllers: one USB 2.0 + PHY and two USB 2.0 OTG + PHY interfaces, plus AC'97 for legacy audio codec connectivity.
  • Display and HMI  Display interface controllers for keypad, LCD, and MIPI, enabling human‑machine interface designs and display integration.
  • Security  Integrated security features including A‑HAB, ARM TrustZone (ARM TZ), CAAM, CSU, SJC, and SNVS to support secure boot and runtime protection strategies.
  • Package and Mounting  541‑MAPBGA (19 × 19 mm) supplier device package in a surface‑mount BGA form factor for space‑efficient board designs.
  • Operating Range and Compliance  Consumer qualification with an operating temperature range of 0 °C to 95 °C; RoHS compliant.

Typical Applications

  • Connected Devices  Networked consumer electronics and IoT devices that require dual‑core processing, Gigabit Ethernet, and USB connectivity.
  • Human‑Machine Interfaces (HMI)  Touch and display panels using LCD/MIPI interfaces and keypad controllers for responsive UI control and local processing.
  • Portable Medical & Health Care  Battery‑aware portable instruments and monitoring devices that benefit from heterogeneous processing (application + real‑time control) and security features.
  • Access Control & IP Telephony  Access panels and IP phones leveraging integrated Ethernet, audio interfaces (AC'97), and on‑chip security functions.
  • Audio and Multimedia Devices  Audio products that use the multimedia co‑processor and NEON™ MPE for media processing tasks without dedicated graphics acceleration.

Unique Advantages

  • Heterogeneous Dual‑Core Processing: Combines an ARM® Cortex®‑A7 for application workloads with an ARM® Cortex®‑M4 for real‑time tasks, enabling workload partitioning on a single chip.
  • Flexible Memory Support: On‑chip controllers for LPDDR2/LPDDR3 and DDR3/DDR3L provide options to balance performance, power, and BOM cost.
  • Broad Connectivity Suite: Dual Gigabit Ethernet ports, multiple USB 2.0 controllers with PHY, and AC'97 expand system I/O choices for networking and audio subsystems.
  • Integrated Security Building Blocks: A‑HAB, ARM TrustZone, CAAM, CSU, SJC, and SNVS enable secure boot and hardware security features to be integrated into system designs.
  • Compact BGA Packaging: The 541‑MAPBGA (19 × 19 mm) package supports dense board layouts and surface‑mount assembly for compact product form factors.
  • Designed for Low‑Power Systems: As part of the i.MX 7Dual family, the device targets high‑performance processing for low‑power requirements, suitable for battery‑sensitive consumer applications.

Why Choose MCIMX7D7DVM10SD?

The MCIMX7D7DVM10SD positions itself as a compact, integrated solution for consumer embedded systems that need both application and real‑time processing on a single die. With ARM® Cortex®‑A7 and Cortex®‑M4 cores, a flexible memory interface, extensive connectivity, and a comprehensive set of security features, it is suited for designers building connected, portable, and HMI‑centric products.

Choosing this part provides immediate system integration advantages—reduced component count and a clear path for balancing compute and control tasks—while its package and operating range align with typical consumer product requirements in the i.MX 7D family.

Request a quote or submit a pricing inquiry to evaluate MCIMX7D7DVM10SD for your next embedded design project.

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