MCIMX7D7DVM10SD
| Part Description |
ARM® Cortex®-A7, ARM® Cortex®-M4 Microprocessor IC i.MX7D 2 Core, 32-Bit 1.0GHz 541-MAPBGA (19x19) |
|---|---|
| Quantity | 944 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 7D |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 23 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ MPE | Core Processor | ARM® Cortex®-A7, ARM® Cortex®-M4 | Device Package | 541-MAPBGA (19x19) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Keypad, LCD, MIPI | ECCN | 5A992C | Ethernet | 10/100/1000Mbps (2) | ||
| Graphics Acceleration | No | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 32-Bit | ||
| Operating Temperature | 0°C ~ 95°C (TJ) | Package / Case | 541-LFBGA | RAM Controllers | LPDDR2, LPDDR3, DDR3, DDR3L | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS | ||
| Speed | 1.0GHz | Supplier Device Package | 541-MAPBGA (19×19) | USB | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | ||
| Voltage – I/O | 1.8V, 3.3V |
Overview of MCIMX7D7DVM10SD – IC MPU I.MX7D 1.0GHZ 541MAPBGA
The MCIMX7D7DVM10SD is a dual‑core microprocessor from NXP Semiconductors' i.MX 7D family, integrating an ARM® Cortex®‑A7 and an ARM® Cortex®‑M4 on a single 32‑bit platform running at 1.0 GHz. The device is designed for connected and portable consumer applications, delivering high‑performance processing for low‑power requirements with a high degree of functional integration.
Packaged in a 541‑MAPBGA (19 × 19 mm) surface‑mount package and rated for an operating range of 0 °C to 95 °C, this MPU provides a compact, system‑level option for embedded designs that require heterogeneous processing, security features, and multiple memory and peripheral interfaces.
Key Features
- Cores and Architecture Dual‑core configuration with ARM® Cortex®‑A7 and ARM® Cortex®‑M4 processors; 32‑bit operation at up to 1.0 GHz for responsive application processing and real‑time control.
- Co‑processing and Acceleration Multimedia co‑processor support with NEON™ MPE for enhanced media processing; note that the device reports no dedicated graphics acceleration.
- Memory Interfaces Supports LPDDR2, LPDDR3, DDR3, and DDR3L memory controllers to match a range of system memory choices and performance targets.
- Connectivity Dual Gigabit Ethernet ports (10/100/1000 Mbps) and multiple USB 2.0 controllers: one USB 2.0 + PHY and two USB 2.0 OTG + PHY interfaces, plus AC'97 for legacy audio codec connectivity.
- Display and HMI Display interface controllers for keypad, LCD, and MIPI, enabling human‑machine interface designs and display integration.
- Security Integrated security features including A‑HAB, ARM TrustZone (ARM TZ), CAAM, CSU, SJC, and SNVS to support secure boot and runtime protection strategies.
- Package and Mounting 541‑MAPBGA (19 × 19 mm) supplier device package in a surface‑mount BGA form factor for space‑efficient board designs.
- Operating Range and Compliance Consumer qualification with an operating temperature range of 0 °C to 95 °C; RoHS compliant.
Typical Applications
- Connected Devices Networked consumer electronics and IoT devices that require dual‑core processing, Gigabit Ethernet, and USB connectivity.
- Human‑Machine Interfaces (HMI) Touch and display panels using LCD/MIPI interfaces and keypad controllers for responsive UI control and local processing.
- Portable Medical & Health Care Battery‑aware portable instruments and monitoring devices that benefit from heterogeneous processing (application + real‑time control) and security features.
- Access Control & IP Telephony Access panels and IP phones leveraging integrated Ethernet, audio interfaces (AC'97), and on‑chip security functions.
- Audio and Multimedia Devices Audio products that use the multimedia co‑processor and NEON™ MPE for media processing tasks without dedicated graphics acceleration.
Unique Advantages
- Heterogeneous Dual‑Core Processing: Combines an ARM® Cortex®‑A7 for application workloads with an ARM® Cortex®‑M4 for real‑time tasks, enabling workload partitioning on a single chip.
- Flexible Memory Support: On‑chip controllers for LPDDR2/LPDDR3 and DDR3/DDR3L provide options to balance performance, power, and BOM cost.
- Broad Connectivity Suite: Dual Gigabit Ethernet ports, multiple USB 2.0 controllers with PHY, and AC'97 expand system I/O choices for networking and audio subsystems.
- Integrated Security Building Blocks: A‑HAB, ARM TrustZone, CAAM, CSU, SJC, and SNVS enable secure boot and hardware security features to be integrated into system designs.
- Compact BGA Packaging: The 541‑MAPBGA (19 × 19 mm) package supports dense board layouts and surface‑mount assembly for compact product form factors.
- Designed for Low‑Power Systems: As part of the i.MX 7Dual family, the device targets high‑performance processing for low‑power requirements, suitable for battery‑sensitive consumer applications.
Why Choose MCIMX7D7DVM10SD?
The MCIMX7D7DVM10SD positions itself as a compact, integrated solution for consumer embedded systems that need both application and real‑time processing on a single die. With ARM® Cortex®‑A7 and Cortex®‑M4 cores, a flexible memory interface, extensive connectivity, and a comprehensive set of security features, it is suited for designers building connected, portable, and HMI‑centric products.
Choosing this part provides immediate system integration advantages—reduced component count and a clear path for balancing compute and control tasks—while its package and operating range align with typical consumer product requirements in the i.MX 7D family.
Request a quote or submit a pricing inquiry to evaluate MCIMX7D7DVM10SD for your next embedded design project.

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