MCIMX7S3DVK08SD

IC MPU I.MX7S 800MHZ 488TFBGA
Part Description

ARM® Cortex®-A7, ARM® Cortex®-M4 Microprocessor IC i.MX7S 1 Core, 32-Bit 800MHz 488-TFBGA (12x12)

Quantity 185 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 7S
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time23 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A7, ARM® Cortex®-M4Device Package488-TFBGA (12x12)
Display & Interface ControllersKeypad, LCD, MIPIECCN5A992CEthernet10/100/1000Mbps (1)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature0°C ~ 95°C (TJ)Package / Case488-TFBGARAM ControllersLPDDR2, LPDDR3, DDR3, DDR3L
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesA-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Speed800MHzSupplier Device Package488-TFBGA (12×12)USBUSB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Voltage – I/O1.8V, 3.3V

Overview of MCIMX7S3DVK08SD – IC MPU I.MX7S 800MHz 488-TFBGA

The MCIMX7S3DVK08SD is an NXP i.MX 7S series microprocessor IC featuring ARM® Cortex®-A7 and ARM® Cortex®-M4 processing elements with an ARM® Cortex®-A7 core running at up to 800 MHz. It targets connected and portable devices, delivering a high degree of functional integration for applications that require application-class processing combined with microcontroller-class capabilities.

Designed for consumer-grade systems, the device integrates a broad set of interfaces and memory controller options while providing hardware security features and a compact 488-TFBGA (12 × 12 mm) surface-mount package.

Key Features

  • Processor Cores — ARM® Cortex®-A7 and ARM® Cortex®-M4 microprocessor elements; Cortex-A7 up to 800 MHz and 32-bit core architecture.
  • Memory Interfaces — Supports LPDDR2, LPDDR3, DDR3 and DDR3L memory controllers with memory interface options up to the LPDDR3/DDR3-1066 range as documented for the i.MX 7Solo family.
  • Co-processors / DSP — Multimedia support including NEON™ MPE for enhanced media processing.
  • Display and Audio Interfaces — Integrated controllers for keypad, LCD and MIPI display interfaces plus AC'97 audio interface support.
  • Connectivity — Integrated Ethernet MAC supporting 10/100/1000 Mbps (1) and USB connectivity including one USB 2.0 host with PHY and one USB 2.0 OTG with PHY.
  • Security — On-chip security features including A-HAB, ARM TrustZone (ARM TZ), CAAM, CSU, SJC and SNVS for system-level protection.
  • Package and Mounting — 488-TFBGA package, 12 × 12 mm footprint (0.4 mm pitch), surface mount.
  • Qualification and Compliance — Consumer qualification; RoHS compliant.
  • Operating Range — Rated for an operating temperature range of 0 °C to 95 °C.
  • Graphics Acceleration — No dedicated graphics acceleration engine included.

Typical Applications

  • Connected Devices — Application and connectivity processing for smart, networked appliances and IoT endpoints.
  • Human-Machine Interfaces (HMI) — Driving LCD and MIPI displays with integrated input support for keypad-based interfaces.
  • Portable Medical & Healthcare — Embedded processing for portable monitoring and health-care devices within consumer temperature range.
  • Point-of-Sale & Access Control — Processing and secure transaction handling leveraging on-chip security modules.
  • Audio & IP Phones — Multimedia-capable processing for audio and voice-centric devices.

Unique Advantages

  • Heterogeneous Processing Elements: Combines ARM® Cortex®-A7 and ARM® Cortex®-M4 processors to provide both application-class and microcontroller-class processing elements in a single device.
  • Flexible Memory Support: Multiple memory controller options (LPDDR2/LPDDR3/DDR3/DDR3L) and documented support up to LPDDR3/DDR3-1066 provide design flexibility for varying performance and power targets.
  • Integrated Connectivity: Built-in Ethernet (10/100/1000 Mbps) and USB 2.0 host/OTG with PHY reduce external component count for networked applications.
  • Embedded Security Primitives: A-HAB, ARM TZ, CAAM, CSU, SJC and SNVS provide a foundation for secure boot and system-level security functions.
  • Compact Surface-Mount Package: 488-TFBGA (12 × 12 mm, 0.4 mm pitch) enables space-constrained designs while supporting standard PCB assembly processes.
  • Consumer-Grade Qualification: Designed and qualified for consumer applications with RoHS compliance and an operating range suited to typical consumer environments.

Why Choose MCIMX7S3DVK08SD?

The MCIMX7S3DVK08SD positions itself as a versatile, integrated solution for consumer-focused embedded systems that need a blend of application processing, secure operation, and a rich peripheral set. With ARM® Cortex® cores, comprehensive memory interface options and integrated connectivity, it supports designs where functional integration and compact packaging matter.

This device is well suited for developers and OEMs building connected appliances, HMIs, portable medical devices, POS systems and similar consumer equipment seeking a scalable, supported processor family with documented electrical and package details.

Request a quote or submit an RFQ to obtain pricing and availability for MCIMX7S3DVK08SD and to discuss how it fits your next embedded design.

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