MCIMX7D7DVK10SD
| Part Description |
ARM® Cortex®-A7, ARM® Cortex®-M4 Microprocessor IC i.MX7D 2 Core, 32-Bit 1.0GHz 488-TFBGA (12x12) |
|---|---|
| Quantity | 1,717 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 7D |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 23 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ MPE | Core Processor | ARM® Cortex®-A7, ARM® Cortex®-M4 | Device Package | 488-TFBGA (12x12) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Keypad, LCD, MIPI | ECCN | 5A992C | Ethernet | 10/100/1000Mbps (2) | ||
| Graphics Acceleration | No | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 32-Bit | ||
| Operating Temperature | 0°C ~ 95°C (TJ) | Package / Case | 488-TFBGA | RAM Controllers | LPDDR2, LPDDR3, DDR3, DDR3L | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS | ||
| Speed | 1.0GHz | Supplier Device Package | 488-TFBGA (12×12) | USB | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | ||
| Voltage – I/O | 1.8V, 3.3V |
Overview of MCIMX7D7DVK10SD – IC MPU I.MX7D 1.0GHZ 488TFBGA
The MCIMX7D7DVK10SD is a dual-core microprocessor from NXP Semiconductors based on ARM® Cortex®‑A7 and ARM® Cortex®‑M4 cores. It delivers up to 1.0 GHz performance in a highly integrated 488‑TFBGA (12 × 12 mm) surface‑mount package targeted at connected and portable devices.
Designed for embedded applications, the device pairs general‑purpose application processing with a real‑time microcontroller core and integrates a broad set of memory controllers, high‑speed connectivity and security features to streamline system design.
Key Features
- Dual‑Core Architecture — ARM® Cortex®‑A7 plus ARM® Cortex®‑M4 cores, 2‑core 32‑bit design operating at up to 1 GHz to support mixed application and real‑time workloads.
- Memory Interfaces — Integrated controllers for LPDDR2, LPDDR3, DDR3 and DDR3L memory types to support flexible memory configurations.
- Connectivity — Dual 10/100/1000 Mbps Ethernet ports and multiple USB interfaces including USB 2.0 + PHY and USB 2.0 OTG + PHY for high bandwidth wired connectivity.
- Display and I/O — Display interface controllers supporting keypad, LCD and MIPI interfaces for human‑machine interfaces and display subsystems.
- Multimedia Acceleration — Multimedia DSP and NEON™ MPE co‑processing capabilities to accelerate media and signal processing tasks.
- Security Features — On‑chip security including A‑HAB, ARM TrustZone (ARM TZ), CAAM, CSU, SJC and SNVS for platform integrity and secure boot options.
- Analog and Audio — Additional interfaces including AC'97 to support legacy audio and analog subsystem connectivity.
- Package and Mounting — 488‑TFBGA supplier device package (12 × 12 mm, 0.4 mm pitch) optimized for surface‑mount assembly.
- Operating Range and Compliance — Consumer‑grade qualification with an operating temperature range of 0 °C to 95 °C and RoHS compliance.
Typical Applications
- Audio systems — Multimedia DSP and NEON acceleration combined with AC'97 make the device suitable for embedded audio processing and connected audio products.
- Connected devices — Dual gigabit Ethernet and USB interfaces enable networked and IoT device connectivity for industrial and consumer applications.
- Human‑Machine Interfaces (HMI) — Display controllers (LCD, MIPI) and keypad support enable responsive user interfaces for control panels and kiosks.
- Portable medical and health care — Targeted for portable devices, the dual‑core architecture supports application processing alongside real‑time sensor control and data handling.
- IP phones and access control — Integrated connectivity, security features and mixed‑processing cores support communication stacks and secure access systems.
Unique Advantages
- Mixed‑workload architecture: The combination of an ARM® Cortex®‑A7 application core with a Cortex®‑M4 real‑time core enables separation of high‑level application tasks and time‑critical control functions.
- Broad memory flexibility: Support for LPDDR2/LPDDR3 and DDR3/DDR3L memory types permits designers to choose memory options that fit performance and power targets.
- Integrated connectivity suite: Multiple Ethernet ports and USB interfaces reduce external component count and simplify board‑level integration for networked products.
- Built‑in security blocks: A comprehensive set of security features (A‑HAB, ARM TZ, CAAM, CSU, SJC, SNVS) helps establish secure boot and runtime protection without extensive external circuitry.
- Compact production package: The 488‑TFBGA (12 × 12 mm) package delivers a small footprint for space‑constrained embedded designs while enabling surface‑mount assembly processes.
Why Choose MCIMX7D7DVK10SD?
The MCIMX7D7DVK10SD positions itself as a flexible, integrated microprocessor solution for designers of connected and portable embedded systems who need a balance of application processing and real‑time control. With dual ARM cores, a wide set of memory and peripheral interfaces, and extensive onboard security features, it simplifies BOM and system integration for consumer‑grade applications operating within 0 °C to 95 °C.
As part of NXP’s i.MX 7Dual family, this device aligns with a family roadmap and packaging options that support design scalability. Its combination of connectivity, multimedia co‑processing and secure features provides a practical platform for architects building networked HMIs, portable healthcare devices, audio products and similar embedded systems.
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