MCIMX7D7DVK10SD

IC MPU I.MX7D 1.0GHZ 488TFBGA
Part Description

ARM® Cortex®-A7, ARM® Cortex®-M4 Microprocessor IC i.MX7D 2 Core, 32-Bit 1.0GHz 488-TFBGA (12x12)

Quantity 1,717 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 7D
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time23 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A7, ARM® Cortex®-M4Device Package488-TFBGA (12x12)
Display & Interface ControllersKeypad, LCD, MIPIECCN5A992CEthernet10/100/1000Mbps (2)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature0°C ~ 95°C (TJ)Package / Case488-TFBGARAM ControllersLPDDR2, LPDDR3, DDR3, DDR3L
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesA-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Speed1.0GHzSupplier Device Package488-TFBGA (12×12)USBUSB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O1.8V, 3.3V

Overview of MCIMX7D7DVK10SD – IC MPU I.MX7D 1.0GHZ 488TFBGA

The MCIMX7D7DVK10SD is a dual-core microprocessor from NXP Semiconductors based on ARM® Cortex®‑A7 and ARM® Cortex®‑M4 cores. It delivers up to 1.0 GHz performance in a highly integrated 488‑TFBGA (12 × 12 mm) surface‑mount package targeted at connected and portable devices.

Designed for embedded applications, the device pairs general‑purpose application processing with a real‑time microcontroller core and integrates a broad set of memory controllers, high‑speed connectivity and security features to streamline system design.

Key Features

  • Dual‑Core Architecture — ARM® Cortex®‑A7 plus ARM® Cortex®‑M4 cores, 2‑core 32‑bit design operating at up to 1 GHz to support mixed application and real‑time workloads.
  • Memory Interfaces — Integrated controllers for LPDDR2, LPDDR3, DDR3 and DDR3L memory types to support flexible memory configurations.
  • Connectivity — Dual 10/100/1000 Mbps Ethernet ports and multiple USB interfaces including USB 2.0 + PHY and USB 2.0 OTG + PHY for high bandwidth wired connectivity.
  • Display and I/O — Display interface controllers supporting keypad, LCD and MIPI interfaces for human‑machine interfaces and display subsystems.
  • Multimedia Acceleration — Multimedia DSP and NEON™ MPE co‑processing capabilities to accelerate media and signal processing tasks.
  • Security Features — On‑chip security including A‑HAB, ARM TrustZone (ARM TZ), CAAM, CSU, SJC and SNVS for platform integrity and secure boot options.
  • Analog and Audio — Additional interfaces including AC'97 to support legacy audio and analog subsystem connectivity.
  • Package and Mounting — 488‑TFBGA supplier device package (12 × 12 mm, 0.4 mm pitch) optimized for surface‑mount assembly.
  • Operating Range and Compliance — Consumer‑grade qualification with an operating temperature range of 0 °C to 95 °C and RoHS compliance.

Typical Applications

  • Audio systems — Multimedia DSP and NEON acceleration combined with AC'97 make the device suitable for embedded audio processing and connected audio products.
  • Connected devices — Dual gigabit Ethernet and USB interfaces enable networked and IoT device connectivity for industrial and consumer applications.
  • Human‑Machine Interfaces (HMI) — Display controllers (LCD, MIPI) and keypad support enable responsive user interfaces for control panels and kiosks.
  • Portable medical and health care — Targeted for portable devices, the dual‑core architecture supports application processing alongside real‑time sensor control and data handling.
  • IP phones and access control — Integrated connectivity, security features and mixed‑processing cores support communication stacks and secure access systems.

Unique Advantages

  • Mixed‑workload architecture: The combination of an ARM® Cortex®‑A7 application core with a Cortex®‑M4 real‑time core enables separation of high‑level application tasks and time‑critical control functions.
  • Broad memory flexibility: Support for LPDDR2/LPDDR3 and DDR3/DDR3L memory types permits designers to choose memory options that fit performance and power targets.
  • Integrated connectivity suite: Multiple Ethernet ports and USB interfaces reduce external component count and simplify board‑level integration for networked products.
  • Built‑in security blocks: A comprehensive set of security features (A‑HAB, ARM TZ, CAAM, CSU, SJC, SNVS) helps establish secure boot and runtime protection without extensive external circuitry.
  • Compact production package: The 488‑TFBGA (12 × 12 mm) package delivers a small footprint for space‑constrained embedded designs while enabling surface‑mount assembly processes.

Why Choose MCIMX7D7DVK10SD?

The MCIMX7D7DVK10SD positions itself as a flexible, integrated microprocessor solution for designers of connected and portable embedded systems who need a balance of application processing and real‑time control. With dual ARM cores, a wide set of memory and peripheral interfaces, and extensive onboard security features, it simplifies BOM and system integration for consumer‑grade applications operating within 0 °C to 95 °C.

As part of NXP’s i.MX 7Dual family, this device aligns with a family roadmap and packaging options that support design scalability. Its combination of connectivity, multimedia co‑processing and secure features provides a practical platform for architects building networked HMIs, portable healthcare devices, audio products and similar embedded systems.

Request a quote or submit an inquiry to receive pricing, lead‑time and availability information for the MCIMX7D7DVK10SD. Our team can assist with volume pricing and integration questions to help move your design forward.

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