MCIMX7D3EVK10SD

IC MPU I.MX7D 1.0GHZ 488TFBGA
Part Description

ARM® Cortex®-A7, ARM® Cortex®-M4 Microprocessor IC i.MX7D 2 Core, 32-Bit 1.0GHz 488-TFBGA (12x12)

Quantity 131 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 7D
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time23 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A7, ARM® Cortex®-M4Device Package488-TFBGA (12x12)
Display & Interface ControllersKeypad, LCD, MIPIECCN5A992CEthernet10/100/1000Mbps (2)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-20°C ~ 105°C (TJ)Package / Case488-TFBGARAM ControllersLPDDR2, LPDDR3, DDR3, DDR3L
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesA-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Speed1.0GHzSupplier Device Package488-TFBGA (12×12)USBUSB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O1.8V, 3.3V

Overview of MCIMX7D3EVK10SD – ARM Cortex-A7/M4 1.0 GHz 2‑Core MPU

The MCIMX7D3EVK10SD is an NXP i.MX 7D family microprocessor featuring heterogeneous dual cores: an ARM® Cortex®-A7 application core running up to 1.0 GHz and an ARM® Cortex®-M4 coprocessor. It targets connected and portable devices that require a balance of application processing and real-time control with a high degree of functional integration.

Designed for low-power, integrated system designs, the device provides multiple peripheral interfaces and security subsystems to support applications such as audio, human‑machine interfaces, access control, portable medical devices, and IP phones.

Key Features

  • Core Architecture Dual-core architecture with ARM® Cortex®-A7 and ARM® Cortex®-M4 processors; Cortex-A7 up to 1 GHz for application processing and Cortex-M4 for real-time tasks.
  • Memory Interfaces Supports LPDDR2, LPDDR3, DDR3 and DDR3L memory controllers for flexible system memory configurations.
  • Display and HMI Integrated display interface controllers including keypad, LCD and MIPI to support common human‑machine interface designs.
  • Ethernet Connectivity Two 10/100/1000 Mbps Ethernet interfaces for high-speed wired networking.
  • USB Support USB 2.0 ports with PHY: one USB 2.0 + PHY and two USB 2.0 OTG + PHY connections for host and OTG configurations.
  • Security Subsystems On-chip security features including A-HAB, ARM TrustZone (ARM TZ), CAAM, CSU, SJC and SNVS to enable secure boot and trusted execution environments.
  • Co-processor / Multimedia Multimedia acceleration support via NEON™ MPE and DSP-oriented multimedia processing elements.
  • Package and Mounting 488‑TFBGA package (12 × 12 mm) with surface-mount construction suitable for compact embedded designs.
  • Operating Range Rated for operation from −20 °C to 105 °C to cover a broad range of industrial and commercial environments.
  • Additional Interfaces Legacy audio interface support via AC'97 for certain audio subsystem integrations.

Typical Applications

  • Connected Devices Integrated application and connectivity features enable networking and peripheral integration for connected consumer and industrial devices.
  • Human‑Machine Interfaces (HMI) Display and keypad interfaces combined with dual-core processing support responsive user interfaces and control logic.
  • Portable Medical & Health Devices Processing partitioning between application and real-time cores helps meet monitoring and control requirements in portable medical equipment.
  • Access Control & IP Phones Built-in Ethernet, USB and security modules support secure communications and device management for access control systems and VoIP endpoints.

Unique Advantages

  • Heterogeneous Dual-Core Design: Separates application-level processing (Cortex-A7) from real-time control (Cortex-M4) to simplify software partitioning and system design.
  • Broad Memory Flexibility: Support for LPDDR2/LPDDR3 and DDR3/DDR3L memory types enables designers to choose memory for performance, power, or cost targets.
  • Integrated Networking & Peripherals: Dual gigabit Ethernet and multiple USB PHYs reduce external components and ease board-level integration for connected products.
  • On-chip Security Primitives: A-HAB, ARM TrustZone, CAAM and related modules provide hardware foundations for secure boot and trusted execution.
  • Compact BGA Package: 488‑TFBGA (12 × 12 mm) saves PCB area while delivering a high pin-count for complex embedded systems.

Why Choose MCIMX7D3EVK10SD?

The MCIMX7D3EVK10SD positions itself as a flexible, integrated microprocessor solution for designers needing a mix of application performance and real-time control. With an ARM® Cortex®-A7 application core up to 1.0 GHz, an ARM® Cortex®-M4 coprocessor, extensive memory interface support, multiple high-speed I/O options and hardware security features, it is suitable for connected, portable and HMI-focused designs.

Its compact 488‑TFBGA package and industrial operating temperature range make it appropriate for space-constrained systems that must operate across a wide temperature envelope, while the on-chip peripheral set helps reduce BOM and streamline system integration.

Request a quote or submit a sales inquiry to evaluate MCIMX7D3EVK10SD for your next embedded design.

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