Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MCIMX6X3CVO08ABMCIMX6X3CVO08ABNXP SemiconductorsIC MPU I.MX6SX 800MHZ 400MAPBGAMicroprocessors400-MAPBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
200MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (17×17)
885
N/AMCIMX6X3CVO08ACNXP SemiconductorsIC MPU I.MX6SX 800MHZ 400MAPBGAMicroprocessors400-MAPBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
200MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (17×17)
1,409
MCIMX6X3EVK10ABMCIMX6X3EVK10ABNXP SemiconductorsIC MPU I.MX6SX 1GHZ 400MAPBGAMicroprocessors400-MAPBGA (14x14)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1GHz, 227MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ MPE
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (14×14)
1,071
MCIMX6X3EVK10ABRMCIMX6X3EVK10ABRNXP SemiconductorsIC MPU I.MX6SX 1GHZ 400MAPBGAMicroprocessors400-MAPBGA (14x14)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
227MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD, LVDS
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (14×14)
462
MCIMX6X3EVK10ACMCIMX6X3EVK10ACNXP SemiconductorsIC MPU I.MX6SX 1GHZ 400MAPBGAMicroprocessors400-MAPBGA (14x14)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
227MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD, LVDS
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (14×14)
1,324
MCIMX6X3EVK10ACRMCIMX6X3EVK10ACRNXP SemiconductorsIC MPU I.MX6SX 1GHZ 400MAPBGAMicroprocessors400-MAPBGA (14x14)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
227MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD, LVDS
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (14×14)
531
MCIMX6X3EVN10ABMCIMX6X3EVN10ABNXP SemiconductorsIC MPU 227MHZ/1GHZ 400MAPBGAMicroprocessors400-MAPBGA (14x14)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
227MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ MPE
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (14×14)
1,396
N/AMCIMX6X3EVN10ACNXP SemiconductorsIC MPU I.MX6SX 1GHZ 400MAPBGAMicroprocessors400-MAPBGA (17x17)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
227MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (17×17)
1,583
MCIMX6X3EVO10ABMCIMX6X3EVO10ABNXP SemiconductorsIC MPU I.MX6SX 1GHZ 400MAPBGAMicroprocessors400-MAPBGA (17x17)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
227MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (17×17)
1,656
N/AMCIMX6X3EVO10ACNXP SemiconductorsIC MPU I.MX6SX 1GHZ 400MAPBGAMicroprocessors400-MAPBGA (17x17)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
227MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (17×17)
331
MCIMX6X4AVM08ABMCIMX6X4AVM08ABNXP SemiconductorsIC MPU I.MX6SX 800MHZ 529MAPBGAMicroprocessors529-MAPBGA (19x19)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
200MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD, LVDS
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
529-LFBGA
Supplier Device Package:
529-MAPBGA (19×19)
487
MCIMX6X4AVM08ABRMCIMX6X4AVM08ABRNXP SemiconductorsIC MPU I.MX6SX 800MHZ 529MAPBGAMicroprocessors529-MAPBGA (19x19)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
200MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD, LVDS
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
529-LFBGA
Supplier Device Package:
529-MAPBGA (19×19)
739
MCIMX6X4AVM08ACMCIMX6X4AVM08ACNXP SemiconductorsIC MPU I.MX6SX 800MHZ 529MAPBGAMicroprocessors529-MAPBGA (19x19)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
200MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD, LVDS
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
529-LFBGA
Supplier Device Package:
529-MAPBGA (19×19)
83
N/AMCIMX6X4AVM08ACRNXP SemiconductorsIC MPU I.MX6SX 800MHZ 529MAPBGAMicroprocessors529-MAPBGA (19x19)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
200MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD, LVDS
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
529-LFBGA
Supplier Device Package:
529-MAPBGA (19×19)
354
MCIMX6X4CVM08ABMCIMX6X4CVM08ABNXP SemiconductorsIC MPU I.MX6SX 800MHZ 529MAPBGAMicroprocessors529-MAPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
200MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD, LVDS
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
529-LFBGA
Supplier Device Package:
529-MAPBGA (19×19)
1,276
N/AMCIMX6X4CVM08ACNXP SemiconductorsIC MPU I.MX6SX 800MHZ 529MAPBGAMicroprocessors529-MAPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
200MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD, LVDS
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
529-LFBGA
Supplier Device Package:
529-MAPBGA (19×19)
123
MCIMX6X4EVM10ABMCIMX6X4EVM10ABNXP SemiconductorsIC MPU I.MX6SX 1GHZ 529MAPBGAMicroprocessors529-MAPBGA (19x19)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
227MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD, LVDS
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
529-LFBGA
Supplier Device Package:
529-MAPBGA (19×19)
155
MCIMX6X4EVM10ACMCIMX6X4EVM10ACNXP SemiconductorsIC MPU I.MX6SX 1GHZ 529MAPBGAMicroprocessors529-MAPBGA (19x19)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
227MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD, LVDS
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
529-LFBGA
Supplier Device Package:
529-MAPBGA (19×19)
56
MCIMX6Y0CVM05AAMCIMX6Y0CVM05AANXP SemiconductorsIC MPU I.MX6 528MHZ 289MAPBGAMicroprocessors289-MAPBGA (14x14)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ MPE
RAM Controllers:
LPDDR2, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
Electrophoretic, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
A-HAB, ARM TZ, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
289-LFBGA
Supplier Device Package:
289-MAPBGA (14×14)
7
MCIMX6Y0CVM05ABMCIMX6Y0CVM05ABNXP SemiconductorsIC MPU I.MX6 528MHZ 289MAPBGAMicroprocessors289-MAPBGA (14x14)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ MPE
RAM Controllers:
LPDDR2, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
Electrophoretic, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
A-HAB, ARM TZ, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
289-LFBGA
Supplier Device Package:
289-MAPBGA (14×14)
151

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