 | | MCIMX6X3CVO08AB | NXP Semiconductors | IC MPU I.MX6SX 800MHZ 400MAPBGA | Microprocessors | 400-MAPBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -40°C ~ 105°C (TA) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Supplier Device Package: 400-MAPBGA (17×17) | 885 | |
| N/A | | MCIMX6X3CVO08AC | NXP Semiconductors | IC MPU I.MX6SX 800MHZ 400MAPBGA | Microprocessors | 400-MAPBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -40°C ~ 105°C (TA) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Supplier Device Package: 400-MAPBGA (17×17) | 1,409 | |
 | | MCIMX6X3EVK10AB | NXP Semiconductors | IC MPU I.MX6SX 1GHZ 400MAPBGA | Microprocessors | 400-MAPBGA (14x14) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Supplier Device Package: 400-MAPBGA (14×14) | 1,071 | |
 | | MCIMX6X3EVK10ABR | NXP Semiconductors | IC MPU I.MX6SX 1GHZ 400MAPBGA | Microprocessors | 400-MAPBGA (14x14) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD, LVDS Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Supplier Device Package: 400-MAPBGA (14×14) | 462 | |
 | | MCIMX6X3EVK10AC | NXP Semiconductors | IC MPU I.MX6SX 1GHZ 400MAPBGA | Microprocessors | 400-MAPBGA (14x14) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD, LVDS Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Supplier Device Package: 400-MAPBGA (14×14) | 1,324 | |
 | | MCIMX6X3EVK10ACR | NXP Semiconductors | IC MPU I.MX6SX 1GHZ 400MAPBGA | Microprocessors | 400-MAPBGA (14x14) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD, LVDS Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Supplier Device Package: 400-MAPBGA (14×14) | 531 | |
 | | MCIMX6X3EVN10AB | NXP Semiconductors | IC MPU 227MHZ/1GHZ 400MAPBGA | Microprocessors | 400-MAPBGA (14x14) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Supplier Device Package: 400-MAPBGA (14×14) | 1,396 | |
| N/A | | MCIMX6X3EVN10AC | NXP Semiconductors | IC MPU I.MX6SX 1GHZ 400MAPBGA | Microprocessors | 400-MAPBGA (17x17) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Supplier Device Package: 400-MAPBGA (17×17) | 1,583 | |
 | | MCIMX6X3EVO10AB | NXP Semiconductors | IC MPU I.MX6SX 1GHZ 400MAPBGA | Microprocessors | 400-MAPBGA (17x17) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Supplier Device Package: 400-MAPBGA (17×17) | 1,656 | |
| N/A | | MCIMX6X3EVO10AC | NXP Semiconductors | IC MPU I.MX6SX 1GHZ 400MAPBGA | Microprocessors | 400-MAPBGA (17x17) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Supplier Device Package: 400-MAPBGA (17×17) | 331 | |
 | | MCIMX6X4AVM08AB | NXP Semiconductors | IC MPU I.MX6SX 800MHZ 529MAPBGA | Microprocessors | 529-MAPBGA (19x19) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD, LVDS Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Supplier Device Package: 529-MAPBGA (19×19) | 487 | |
 | | MCIMX6X4AVM08ABR | NXP Semiconductors | IC MPU I.MX6SX 800MHZ 529MAPBGA | Microprocessors | 529-MAPBGA (19x19) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD, LVDS Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Supplier Device Package: 529-MAPBGA (19×19) | 739 | |
 | | MCIMX6X4AVM08AC | NXP Semiconductors | IC MPU I.MX6SX 800MHZ 529MAPBGA | Microprocessors | 529-MAPBGA (19x19) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD, LVDS Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Supplier Device Package: 529-MAPBGA (19×19) | 83 | |
| N/A | | MCIMX6X4AVM08ACR | NXP Semiconductors | IC MPU I.MX6SX 800MHZ 529MAPBGA | Microprocessors | 529-MAPBGA (19x19) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD, LVDS Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Supplier Device Package: 529-MAPBGA (19×19) | 354 | |
 | | MCIMX6X4CVM08AB | NXP Semiconductors | IC MPU I.MX6SX 800MHZ 529MAPBGA | Microprocessors | 529-MAPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD, LVDS Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -40°C ~ 105°C (TA) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Supplier Device Package: 529-MAPBGA (19×19) | 1,276 | |
| N/A | | MCIMX6X4CVM08AC | NXP Semiconductors | IC MPU I.MX6SX 800MHZ 529MAPBGA | Microprocessors | 529-MAPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD, LVDS Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -40°C ~ 105°C (TA) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Supplier Device Package: 529-MAPBGA (19×19) | 123 | |
 | | MCIMX6X4EVM10AB | NXP Semiconductors | IC MPU I.MX6SX 1GHZ 529MAPBGA | Microprocessors | 529-MAPBGA (19x19) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD, LVDS Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Supplier Device Package: 529-MAPBGA (19×19) | 155 | |
 | | MCIMX6X4EVM10AC | NXP Semiconductors | IC MPU I.MX6SX 1GHZ 529MAPBGA | Microprocessors | 529-MAPBGA (19x19) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD, LVDS Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Supplier Device Package: 529-MAPBGA (19×19) | 56 | |
 | | MCIMX6Y0CVM05AA | NXP Semiconductors | IC MPU I.MX6 528MHZ 289MAPBGA | Microprocessors | 289-MAPBGA (14x14) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DDR3L Display & Interface Controllers: Electrophoretic, LCD USB: USB 2.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TJ) Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 289-MAPBGA (14×14) | 7 | |
 | | MCIMX6Y0CVM05AB | NXP Semiconductors | IC MPU I.MX6 528MHZ 289MAPBGA | Microprocessors | 289-MAPBGA (14x14) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DDR3L Display & Interface Controllers: Electrophoretic, LCD USB: USB 2.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TJ) Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS Mounting Type: Surface Mount Supplier Device Package: 289-MAPBGA (14×14) | 151 | |