MCIMX6X4EVM10AC

The MCIMX6X4EVM10AC is an NXP i.MX 6SoloX family microprocessor IC featuring a heterogeneous dual‑core architecture: an ARM® Cortex®‑A9 application core operating up to 1 GHz and an ARM® Cortex®‑M4 real‑time core operating up to 227 MHz. This integrated multimedia‑focused processor targets connected and consumer multimedia devices that require a mix of high‑performance application processing and responsive real‑time control.

Built with extensive on‑chip integration — including a GPU for 2D/3D graphics, multiple display and connectivity controllers, and integrated power management — the device is designed to simplify system design while providing the interfaces and security features required for multimedia and connected applications.

Key Features

• Dual‑Core Architecture ARM Cortex‑A9 application core (up to 1 GHz) paired with an ARM Cortex‑M4 real‑time core (up to 227 MHz) for heterogeneous processing and real‑time responsiveness.
• Memory Interfaces 32‑bit DDR controller supporting LPDDR2, LVDDR3 and DDR3 memory technologies; datasheet references LPDDR2‑800 support for system memory.
• Graphics and Display Integrated GPU acceleration capable of supporting 2D and 3D operations, with display interface controllers for keypad, LCD and LVDS connections.
• Connectivity Dual Gigabit Ethernet ports (10/100/1000 Mbps) and multiple USB controllers including USB 2.0 + PHY and USB 2.0 OTG + PHY options for peripheral and host connectivity.
• Security and Trust On‑chip security features including A‑HAB, ARM TrustZone (ARM TZ), CAAM, CSU, SNVS, System JTAG and TVDECODE for secure boot, cryptography and system protection.
• Peripheral and Audio Interfaces Additional interfaces such as AC'97 and general peripheral connectivity to support audio codecs and external devices.
• Packaging and Mounting Supplier device package: 529‑MAPBGA (19×19 mm) / 529‑LFBGA; surface‑mount package suited to compact embedded board designs.
• Operating Range and Compliance Operating temperature range of −20 °C to 105 °C and RoHS‑compliant status for environmental compliance.

Typical Applications

• Consumer Multimedia Devices On‑board GPU and display interfaces support devices requiring 2D/3D graphics, LCD/LVDS displays and camera sensor connectivity.
• Connected Devices and Gateways Dual Gigabit Ethernet and multiple USB ports enable networking and peripheral connectivity for connected consumer products.
• Real‑Time Control and Sensor Integration The Cortex‑M4 core provides deterministic real‑time responsiveness for control loops and sensor interfacing alongside high‑level application processing.

Unique Advantages

• Heterogeneous Processing Combines a high‑performance Cortex‑A9 application core with a Cortex‑M4 real‑time core to separate OS‑level tasks from time‑critical control functions.
• Integrated Multimedia Capability On‑chip GPU and display controllers reduce external component count for graphics‑enabled consumer products.
• Comprehensive Connectivity Dual Gigabit Ethernet, USB host/OTG and a variety of peripheral interfaces provide flexible options for system integration.
• Built‑in Security Framework Multiple security blocks (A‑HAB, TrustZone, CAAM, CSU, SNVS) enable secure boot, cryptography and system integrity features.
• Design‑Friendly Packaging 529‑ball MAPBGA package in a 19×19 mm footprint supports compact embedded board layouts while enabling surface‑mount assembly.
• Documented Power and Timing Characteristics Datasheet provides detailed electrical characteristics, integrated LDO and PLL parameters, and DDR controller timing for reliable system design.

Why Choose MCIMX6X4EVM10AC?

The MCIMX6X4EVM10AC brings together application and real‑time processing in a single, highly integrated device suited to multimedia‑focused connected products. Its combination of an ARM Cortex‑A9 core (up to 1 GHz) and an ARM Cortex‑M4 core (up to 227 MHz), plus GPU acceleration, multi‑standard memory interfaces and broad connectivity, enables designers to implement rich user experiences alongside deterministic control functions without excessive external logic.

This device is well matched to teams developing consumer multimedia and connected applications that require a mix of performance, peripheral integration and security. Comprehensive datasheet coverage of package assignments, electrical characteristics and module timing supports engineering validation and production readiness.

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