MCIMX6X4AVM08ACR
| Part Description |
ARM® Cortex®-A9, ARM® Cortex®-M4 Microprocessor IC i.MX6SX 2 Core, 32-Bit 200MHz, 800MHz 529-MAPBGA (19x19) |
|---|---|
| Quantity | 834 Available (as of October 9, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6X |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 15 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ MPE | Core Processor | ARM® Cortex®-A9, ARM® Cortex®-M4 | Device Package | 529-MAPBGA (19x19) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Keypad, LCD, LVDS | ECCN | 5A992C | Ethernet | 10/100/1000Mbps (2) | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 529-LFBGA | RAM Controllers | LPDDR2, LVDDR3, DDR3 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | ||
| Speed | 200MHz, 800MHz | Supplier Device Package | 529-MAPBGA (19×19) | USB | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | ||
| Voltage – I/O | 1.8V, 2.5V, 2.8V, 3.15V |
Overview of MCIMX6X4AVM08ACR – IC MPU I.MX6SX 800MHZ 529MAPBGA
The MCIMX6X4AVM08ACR is a dual-core microprocessor IC from NXP Semiconductors’ i.MX 6X series, combining ARM® Cortex®-A9 and ARM® Cortex®-M4 processing elements in a single device. The part targets multimedia-focused embedded designs that require a mix of high-performance application processing and responsive real-time control.
Its heterogeneous architecture, integrated graphics acceleration, multiple high-speed interfaces and flexible memory controller options deliver a compact, integrated solution for connected embedded systems and display-driven applications.
Key Features
- Dual-Core Architecture ARM® Cortex®-A9 and ARM® Cortex®-M4 cores provide a split of application-class and real-time processing; core frequencies are specified up to 800 MHz (A9) and 200 MHz (M4) in the product description.
- Memory Interfaces Built-in memory controller support for LPDDR2, LVDDR3 and DDR3 enables flexible memory choices to match performance and cost targets.
- Graphics and Display Graphics acceleration is included and display interface support covers keypad, LCD and LVDS for advanced HMI and display designs.
- High-Speed Connectivity Dual Ethernet controllers providing 10/100/1000 Mbps and multiple USB ports (USB 2.0 + PHY and USB 2.0 OTG + PHY) support a range of wired networking and peripheral connectivity options.
- Security and Debug On-chip features such as A-HAB, ARM TrustZone, CAAM, CSU, SNVS, System JTAG and TVDECODE provide an array of hardware security and debug capabilities.
- Peripheral and Codec Interfaces Additional interfaces include AC'97 support and multimedia co-processor capabilities including NEON™ MPE for advanced signal and media processing.
- Package and Mounting Supplied in a 529-MAPBGA (19×19) package, surface-mount package case also listed as 529-LFBGA for board-level integration.
- Operating Range Rated for operation from -40 °C to 125 °C to support extended-temperature embedded deployments.
- RoHS Compliance Vendor-declared RoHS compliant component.
Typical Applications
- Infotainment & Multimedia Platforms Use the Cortex-A9 core and graphics acceleration for media playback, user interfaces and display management.
- Human‑Machine Interfaces (HMI) Integrated display controllers and keypad support make it suitable for industrial and consumer HMI designs.
- Connectivity Appliances Dual Gigabit Ethernet and multiple USB interfaces enable networked embedded devices and gateway appliances.
- Real‑Time Control Subsystems The Cortex-M4 core handles responsive control tasks alongside the application processor for mixed workload systems.
Unique Advantages
- Heterogeneous Processing: Combines Cortex-A9 and Cortex-M4 cores to separate high-level application workloads from low-latency control tasks, simplifying system partitioning.
- Integrated Security Suite: Multiple hardware security engines (A-HAB, ARM TrustZone, CAAM, CSU, SNVS) allow designers to implement layered security and secure boot strategies.
- Broad Memory Flexibility: Support for LPDDR2, LVDDR3 and DDR3 provides options to tune memory performance and BOM cost for target applications.
- Comprehensive Connectivity: Dual Gigabit Ethernet and USB 2.0 host/OTG interfaces enable high-throughput networking and peripheral expansion without external bridge chips.
- Extended Temperature Capability: Operation down to -40 °C and up to 125 °C supports deployment in thermally demanding embedded environments.
Why Choose MCIMX6X4AVM08ACR?
The MCIMX6X4AVM08ACR positions itself as an integrated microprocessor solution for embedded designs that require a balance of application-level processing, real-time control, multimedia capability and secure operation. Its dual-core ARM architecture, combined with graphics acceleration and broad interface support, makes it suitable for systems that consolidate multiple functions into a single device.
Built on NXP’s i.MX 6X family, this device is appropriate for developers seeking a compact, connectivity-rich MPU with hardware security features and flexible memory options. The package and temperature ratings support integration into a wide range of embedded product platforms.
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