MCIMX6X4AVM08ACR

IC MPU I.MX6SX 800MHZ 529MAPBGA
Part Description

ARM® Cortex®-A9, ARM® Cortex®-M4 Microprocessor IC i.MX6SX 2 Core, 32-Bit 200MHz, 800MHz 529-MAPBGA (19x19)

Quantity 834 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6X
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A9, ARM® Cortex®-M4Device Package529-MAPBGA (19x19)
Display & Interface ControllersKeypad, LCD, LVDSECCN5A992CEthernet10/100/1000Mbps (2)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case529-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesA-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Speed200MHz, 800MHzSupplier Device Package529-MAPBGA (19×19)USBUSB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.15V

Overview of MCIMX6X4AVM08ACR – IC MPU I.MX6SX 800MHZ 529MAPBGA

The MCIMX6X4AVM08ACR is a dual-core microprocessor IC from NXP Semiconductors’ i.MX 6X series, combining ARM® Cortex®-A9 and ARM® Cortex®-M4 processing elements in a single device. The part targets multimedia-focused embedded designs that require a mix of high-performance application processing and responsive real-time control.

Its heterogeneous architecture, integrated graphics acceleration, multiple high-speed interfaces and flexible memory controller options deliver a compact, integrated solution for connected embedded systems and display-driven applications.

Key Features

  • Dual-Core Architecture  ARM® Cortex®-A9 and ARM® Cortex®-M4 cores provide a split of application-class and real-time processing; core frequencies are specified up to 800 MHz (A9) and 200 MHz (M4) in the product description.
  • Memory Interfaces  Built-in memory controller support for LPDDR2, LVDDR3 and DDR3 enables flexible memory choices to match performance and cost targets.
  • Graphics and Display  Graphics acceleration is included and display interface support covers keypad, LCD and LVDS for advanced HMI and display designs.
  • High-Speed Connectivity  Dual Ethernet controllers providing 10/100/1000 Mbps and multiple USB ports (USB 2.0 + PHY and USB 2.0 OTG + PHY) support a range of wired networking and peripheral connectivity options.
  • Security and Debug  On-chip features such as A-HAB, ARM TrustZone, CAAM, CSU, SNVS, System JTAG and TVDECODE provide an array of hardware security and debug capabilities.
  • Peripheral and Codec Interfaces  Additional interfaces include AC'97 support and multimedia co-processor capabilities including NEON™ MPE for advanced signal and media processing.
  • Package and Mounting  Supplied in a 529-MAPBGA (19×19) package, surface-mount package case also listed as 529-LFBGA for board-level integration.
  • Operating Range  Rated for operation from -40 °C to 125 °C to support extended-temperature embedded deployments.
  • RoHS Compliance  Vendor-declared RoHS compliant component.

Typical Applications

  • Infotainment & Multimedia Platforms  Use the Cortex-A9 core and graphics acceleration for media playback, user interfaces and display management.
  • Human‑Machine Interfaces (HMI)  Integrated display controllers and keypad support make it suitable for industrial and consumer HMI designs.
  • Connectivity Appliances  Dual Gigabit Ethernet and multiple USB interfaces enable networked embedded devices and gateway appliances.
  • Real‑Time Control Subsystems  The Cortex-M4 core handles responsive control tasks alongside the application processor for mixed workload systems.

Unique Advantages

  • Heterogeneous Processing: Combines Cortex-A9 and Cortex-M4 cores to separate high-level application workloads from low-latency control tasks, simplifying system partitioning.
  • Integrated Security Suite: Multiple hardware security engines (A-HAB, ARM TrustZone, CAAM, CSU, SNVS) allow designers to implement layered security and secure boot strategies.
  • Broad Memory Flexibility: Support for LPDDR2, LVDDR3 and DDR3 provides options to tune memory performance and BOM cost for target applications.
  • Comprehensive Connectivity: Dual Gigabit Ethernet and USB 2.0 host/OTG interfaces enable high-throughput networking and peripheral expansion without external bridge chips.
  • Extended Temperature Capability: Operation down to -40 °C and up to 125 °C supports deployment in thermally demanding embedded environments.

Why Choose MCIMX6X4AVM08ACR?

The MCIMX6X4AVM08ACR positions itself as an integrated microprocessor solution for embedded designs that require a balance of application-level processing, real-time control, multimedia capability and secure operation. Its dual-core ARM architecture, combined with graphics acceleration and broad interface support, makes it suitable for systems that consolidate multiple functions into a single device.

Built on NXP’s i.MX 6X family, this device is appropriate for developers seeking a compact, connectivity-rich MPU with hardware security features and flexible memory options. The package and temperature ratings support integration into a wide range of embedded product platforms.

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