MCIMX6X3EVO10AC

IC MPU I.MX6SX 1GHZ 400MAPBGA
Part Description

ARM® Cortex®-A9, ARM® Cortex®-M4 Microprocessor IC i.MX6SX 2 Core, 32-Bit 227MHz, 1GHz 400-MAPBGA (17x17)

Quantity 1,207 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6X
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A9, ARM® Cortex®-M4Device Package400-MAPBGA (17x17)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (2)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-20°C ~ 105°C (TJ)Package / Case400-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesA-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Speed227MHz, 1GHzSupplier Device Package400-MAPBGA (17×17)USBUSB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.15V

Overview of MCIMX6X3EVO10AC – IC MPU I.MX6SX 1GHz 400-MAPBGA

The MCIMX6X3EVO10AC is an i.MX 6SoloX family microprocessor IC featuring a heterogeneous dual-core architecture with an ARM® Cortex®-A9 application core (up to 1 GHz) and an ARM® Cortex®-M4 real-time core (227 MHz). It integrates multimedia acceleration, a GPU for 2D/3D operations, and on-chip power management to address connected and consumer-focused embedded designs.

Designed for connected devices and consumer products, the device delivers a mix of high-performance application processing and deterministic real-time responsiveness with extensive connectivity and security features for integrated system designs.

Key Features

  • Cores and Performance  Dual-core heterogeneous architecture: ARM® Cortex®-A9 application core up to 1 GHz and ARM® Cortex®-M4 real-time core at 227 MHz for efficient partitioning of application and real-time tasks.
  • Multimedia and Graphics  Includes multimedia co-processors and NEON™ MPE plus a GPU capable of supporting 2D and 3D operations for rich user interfaces and media handling.
  • Memory Interfaces  Supports LPDDR2, LVDDR3, and DDR3 memory controllers for flexible system memory choices.
  • Networking and Connectivity  Dual Gigabit Ethernet ports (10/100/1000 Mbps) and multiple USB controllers including USB 2.0 + PHY and USB 2.0 OTG + PHY to support diverse peripheral and network topologies.
  • Display and I/O  Integrated display interface controllers supporting LCD and keypad connections plus additional analog interface AC'97 for legacy audio/peripheral support.
  • Security Features  Built-in security functions including A-HAB, ARM TrustZone (ARM TZ), CAAM, CSU, SNVS, System JTAG and TVDECODE to support secure boot and runtime protection.
  • Package and Mounting  Supplied in a 400-MAPBGA (17 × 17 mm) package (400-LFBGA variant noted) with surface-mount mounting for compact board integration.
  • Operating Range and Compliance  Rated for operation from −20 °C to 105 °C and RoHS compliant for environmental regulatory adherence.
  • On-Chip Power Management  Includes integrated power management to assist in optimizing system-level power and management of multiple power domains.

Typical Applications

  • Connected Consumer Devices  Multimedia-capable processing and integrated connectivity make this device suitable for connected consumer products that require application processing and real-time control.
  • Human–Machine Interfaces (HMI)  GPU acceleration, LCD interface support and keypad I/O enable responsive graphical user interfaces and control panels.
  • Embedded Gateways and Networking  Dual Gigabit Ethernet and USB connectivity support use in networked gateways and communication hubs.
  • Sensor and Camera Systems  Peripheral interfaces and multimedia processing support designs that integrate WLAN, Bluetooth™, GPS, camera sensors and related peripherals as indicated in product documentation.

Unique Advantages

  • Heterogeneous Dual-Core Architecture:  Separates high-level application workloads (Cortex-A9) from deterministic real-time tasks (Cortex-M4) for responsive and efficient system design.
  • Integrated Multimedia Subsystem:  On-chip multimedia engines, NEON MPE and a GPU for 2D/3D accelerate graphics and media tasks while reducing external accelerator requirements.
  • Flexible Memory Support:  Multiple supported memory types (LPDDR2, LVDDR3, DDR3) enable scalable performance and BOM choices across product tiers.
  • Comprehensive Security:  Multiple security blocks—A-HAB, ARM TZ, CAAM, CSU, SNVS—help implement secure boot and runtime protection strategies per product documentation.
  • Rich Connectivity:  Dual Gigabit Ethernet, multiple USB controllers and legacy AC'97 support provide broad peripheral and networking options for varied embedded applications.
  • Compact Packaging and Industrial Temperature Range:  400-MAPBGA package and −20 °C to 105 °C operating range facilitate compact designs that operate across a wide thermal envelope.

Why Choose MCIMX6X3EVO10AC?

The MCIMX6X3EVO10AC combines a high-performance ARM® Cortex®-A9 application core with an ARM® Cortex®-M4 real-time core, integrated multimedia and graphics acceleration, and robust security features to serve connected and consumer embedded designs that require both application throughput and real-time responsiveness. Its flexible memory interfaces, comprehensive connectivity options and integrated power management simplify system integration and BOM optimization.

Backed by the i.MX 6SoloX family documentation from NXP, this device is suited for engineering teams building multimedia-capable, connected products where integration, security and predictable real-time behavior are priorities.

Request a quote or submit a pricing and availability inquiry to discuss MCIMX6X3EVO10AC for your next embedded design.

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