MCIMX6X3EVO10AB

The MCIMX6X3EVO10AB is an NXP Semiconductors microprocessor IC from the i.MX 6X family featuring ARM® Cortex®-A9 and ARM® Cortex®-M4 core architectures. The part lists multiple operating speeds (including 227 MHz and 1 GHz) and a 2‑core, 32‑bit configuration that targets embedded designs requiring integrated connectivity, graphics acceleration and hardware security.

Designed for embedded markets, this device combines multi‑core processing, rich I/O and on‑chip security features to support connectivity‑centric and multimedia applications in constrained board space.

Key Features

• Core & Performance  Dual‑core 32‑bit architecture with ARM® Cortex®‑A9 and ARM® Cortex®‑M4 processors. Documented operating points include 227 MHz and 1 GHz.
• Co‑processors & Acceleration  Multimedia acceleration with NEON™ MPE and graphics acceleration to support GUI and multimedia workloads.
• Memory Support  Integrated memory controller support for LPDDR2, LVDDR3 and DDR3 memory types to match a range of system memory designs.
• Display & Audio Interfaces  Display interface controllers include LCD and keypad support; AC'97 is provided as an additional audio interface.
• High‑Speed Connectivity  Dual Gigabit Ethernet (10/100/1000 Mbps) and multiple USB options: USB 2.0 + PHY (1) and USB 2.0 OTG + PHY (2).
• Security & Debug  On‑chip security features include A‑HAB, ARM TrustZone, CAAM, CSU, SNVS, System JTAG and TVDECODE for secure boot, cryptography and system integrity.
• Package & Mounting  Available in a 400‑ball MAPBGA (17 × 17 mm) supplier package (listed as 400‑MAPBGA / 400‑LFBGA) for surface‑mount assembly.
• Operating Range  Specified operating temperature from −20 °C to 105 °C for deployment in a wide set of embedded environments.

Typical Applications

• Auto Infotainment  Integration of display, audio and dual Gigabit Ethernet interfaces supports feature‑rich cockpit and infotainment systems as described for the i.MX 6 family.
• High‑Performance Tablets & HMI  Graphics acceleration and multimedia co‑processing enable responsive user interfaces for tablets and advanced human‑machine interfaces.
• IP Phones & Communication Devices  USB and Ethernet connectivity combined with audio interfaces make the device suitable for connected communication endpoints.
• Embedded Multimedia Systems  Multimedia acceleration and broad memory support enable applications such as media players and connected displays cited in i.MX 6 series materials.

Unique Advantages

• Dual‑core architecture for mixed workloads: Enables partitioning of real‑time control and application processing across ARM® Cortex®‑A9 and Cortex®‑M4 cores.
• Comprehensive connectivity on‑chip: Dual Gigabit Ethernet and multiple USB PHYs reduce external interface components and simplify board design.
• Extensive security feature set: A‑HAB, ARM TrustZone, CAAM and related subsystems provide hardware‑level options for secure boot and cryptographic acceleration.
• Flexible memory support: LPDDR2, LVDDR3 and DDR3 controller support lets designers choose memory types to match performance and cost targets.
• Robust thermal range and standard package: −20 °C to 105 °C rating and 400‑ball MAPBGA packaging support compact, surface‑mount embedded designs.
• Software ecosystem alignment: Series documentation cites software support including Android, Windows Embedded CE, Ubuntu and Linux, aiding platform development and porting.

Why Choose MCIMX6X3EVO10AB?

The MCIMX6X3EVO10AB positions itself as an integrated embedded processor option combining multi‑core processing, multimedia acceleration, broad memory compatibility and on‑chip security features. Its mix of high‑speed interfaces and graphics capabilities suits designs that require connectivity, user interfaces and secure operation in a compact surface‑mount package.

This part is appropriate for engineering teams building connected multimedia systems, infotainment or HMI platforms that benefit from the i.MX 6 series software ecosystem and the scalability offered by multi‑core architectures. The documented operating range and package choices help support long‑term deployment in varied embedded environments.

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