MCIMX6X3EVK10AC

IC MPU I.MX6SX 1GHZ 400MAPBGA
Part Description

ARM® Cortex®-A9, ARM® Cortex®-M4 Microprocessor IC i.MX6SX 2 Core, 32-Bit 227MHz, 1GHz 400-MAPBGA (14x14)

Quantity 258 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6X
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A9, ARM® Cortex®-M4Device Package400-MAPBGA (14x14)
Display & Interface ControllersKeypad, LCD, LVDSECCN5A992CEthernet10/100/1000Mbps (2)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-20°C ~ 105°C (TJ)Package / Case400-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesA-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Speed227MHz, 1GHzSupplier Device Package400-MAPBGA (14×14)USBUSB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.15V

Overview of MCIMX6X3EVK10AC – IC MPU I.MX6SX 1GHZ 400MAPBGA

The MCIMX6X3EVK10AC is an NXP i.MX 6X series microprocessor IC featuring a heterogeneous dual-core architecture with ARM® Cortex®-A9 and ARM® Cortex®-M4 processing elements. It combines application-class processing with a real-time microcontroller core to address graphically rich and responsive embedded systems.

Designed for industrial and advanced embedded markets, this device integrates multimedia acceleration, multiple high-speed interfaces and security modules to support connected displays, networking and real-time control in compact surface-mount packaging.

Key Features

  • Core Architecture  Dual-core, 32-bit design with ARM® Cortex®-A9 and ARM® Cortex®-M4 cores; ARM® Cortex®-M4 reported at 227 MHz and Cortex®-A9 at 1 GHz in the product description.
  • Memory and Storage  Integrated memory controller support for LPDDR2, LVDDR3 and DDR3 devices to accommodate a range of system memory designs.
  • Graphics and Display  Graphics acceleration is supported; display interface controllers include keypad, LCD and LVDS options for rich user interfaces.
  • Connectivity  Dual Gigabit Ethernet ports (10/100/1000 Mbps) and multiple USB options (one USB 2.0 + PHY and two USB 2.0 OTG + PHY) for robust wired connectivity and peripheral support.
  • Security and Debug  On-chip security features include A-HAB, ARM TrustZone (ARM TZ), CAAM, CSU, SNVS and System JTAG along with TVDECODE to help protect system integrity.
  • Peripheral Interfaces  Additional interfaces include AC'97 and multimedia co-processor support including NEON™ MPE for accelerated media processing.
  • Package and Mounting  Supplied in a 400-MAPBGA package (14 × 14 mm), surface-mountable for compact board-level integration.
  • Operating Range  Specified operating temperature range of −20 °C to 105 °C for a variety of embedded environments.
  • Standards Compliance  RoHS compliant for environmental and supply-chain consistency.

Typical Applications

  • Industrial Control  Real-time control and user interface handling in industrial systems using the Cortex‑M4 core for deterministic tasks and the Cortex‑A9 for application processing.
  • Human Machine Interfaces (HMIs)  Graphical LCD and LVDS display support with graphics acceleration enables interactive operator panels and touchscreen displays.
  • Networking and Communications  Dual Gigabit Ethernet and multiple USB ports make this device suitable for gateways, communication modules and connected instrumentation.
  • Multimedia and Imaging  Multimedia co-processors, NEON™ MPE support and camera/display interfaces serve imaging, video and sensor-rich embedded systems.
  • Secure Embedded Systems  Integrated security modules support secure boot and runtime protection in applications requiring tamper resistance and trusted execution.

Unique Advantages

  • Heterogeneous Processing Efficiency: Combines application-level processing and a real-time microcontroller core in one device to separate high-level tasks from deterministic control.
  • Integrated Connectivity: Dual Gigabit Ethernet plus multiple USB PHYs reduce external components and simplify board-level design for connected products.
  • Multimedia and Display Integration: Built-in graphics acceleration and multiple display controllers streamline development of rich user interfaces and imaging applications.
  • Comprehensive Security: On-chip security modules (A-HAB, ARM TZ, CAAM, CSU, SNVS) provide layers of protection for boot and runtime operations.
  • Memory Flexibility: Support for LPDDR2, LVDDR3 and DDR3 memory types enables designers to choose the optimal memory topology for performance and cost.
  • Compact Surface-Mount Package: 400-MAPBGA (14 × 14 mm) package supports dense, space-constrained PCB designs.

Why Choose MCIMX6X3EVK10AC?

The MCIMX6X3EVK10AC positions itself as a versatile embedded processor for designs that require both application-level performance and real-time responsiveness. With ARM® Cortex®-A9 and Cortex®-M4 cores, integrated graphics and extensive connectivity options, it supports complex HMI, networking and multimedia workloads while consolidating system functions to reduce BOM and board complexity.

This device is suited for engineers and product teams developing industrial, medical and advanced embedded systems that benefit from on-chip security features, flexible memory support and a compact surface-mount package. Its specified operating temperature range and RoHS compliance contribute to reliable, production-ready designs.

Request a quote or submit an inquiry to discuss pricing, availability and integration support for the MCIMX6X3EVK10AC. Our team can assist with volume pricing and lead-time details to help you move your design forward.

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