MCIMX6X3EVK10ABR

IC MPU I.MX6SX 1GHZ 400MAPBGA
Part Description

ARM® Cortex®-A9, ARM® Cortex®-M4 Microprocessor IC i.MX6SX 2 Core, 32-Bit 227MHz, 1GHz 400-MAPBGA (14x14)

Quantity 1,254 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6X
ManufacturerNXP USA Inc.
Manufacturing StatusNot For New Designs
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A9, ARM® Cortex®-M4Device Package400-MAPBGA (14x14)
Display & Interface ControllersKeypad, LCD, LVDSECCN5A992CEthernet10/100/1000Mbps (2)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-20°C ~ 105°C (TJ)Package / Case400-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesA-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Speed227MHz, 1GHzSupplier Device Package400-MAPBGA (14×14)USBUSB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.15V

Overview of MCIMX6X3EVK10ABR – IC MPU I.MX6SX 1GHZ 400MAPBGA

The MCIMX6X3EVK10ABR is a dual-core microprocessor IC featuring ARM® Cortex®-A9 and ARM® Cortex®-M4 architectures in a 32-bit configuration. The device combines a high-speed application core and a real-time microcontroller core with listed core speeds of 1 GHz and 227 MHz respectively, delivering a heterogeneous processing platform for embedded designs.

Engineered for industrial and medical applications that demand multimedia, display and connectivity integration, the part offers extensive interfaces, hardware security features, and a compact 400-MAPBGA (14×14) surface-mount package with an operating temperature range of −20 °C to 105 °C.

Key Features

  • Core Architecture – ARM® Cortex®-A9 and ARM® Cortex®-M4 dual-core, 32-bit architecture with listed core speeds of 1 GHz and 227 MHz, providing heterogeneous processing for application and real-time tasks.
  • Multimedia and DSP – Integrated multimedia co-processors including NEON™ MPE for accelerated media processing and graphics acceleration support.
  • Memory Interfaces – Supports LPDDR2, LVDDR3 and DDR3 memory controllers for flexible system memory configurations.
  • Display and Audio – Display interface controllers for keypad, LCD and LVDS; additional AC'97 interface for legacy audio connectivity.
  • High-speed Connectivity – Two 10/100/1000 Mbps Ethernet interfaces and multiple USB options: one USB 2.0 host with PHY and two USB 2.0 OTG ports with PHY.
  • Security and System Integrity – Built-in security features including A-HAB, ARM TrustZone (ARM TZ), CAAM, CSU, SNVS, System JTAG and TVDECODE for secure boot and system protection.
  • Package and Mounting – 400-MAPBGA (14×14) supplier device package; surface-mount package case suitable for compact embedded boards.
  • Operating Range and Compliance – Operating temperature from −20 °C to 105 °C; RoHS compliant.

Typical Applications

  • Industrial HMI and Control – Drives graphically rich, responsive user interfaces and real-time control tasks in industrial equipment.
  • Medical Devices – Supports embedded medical systems requiring multimedia display and reliable real-time processing within a defined operating temperature range.
  • Multimedia and Display Systems – Handles display controllers and graphics-accelerated operations for compact, integrated multimedia devices.
  • Embedded Networking and Gateways – Dual Gigabit Ethernet and multiple USB interfaces enable robust connectivity for networked embedded products.

Unique Advantages

  • Heterogeneous Multicore Design: Combines an application-class ARM® Cortex®-A9 core with a Cortex®-M4 real-time core to segregate high-level processing and deterministic control functions.
  • Integrated Multimedia Acceleration: NEON™ MPE and graphics acceleration reduce software load for media and GUI tasks, simplifying system partitioning.
  • Comprehensive Connectivity: Dual 10/100/1000 Mbps Ethernet ports plus USB 2.0 host and OTG PHYs provide flexible wired connectivity options for embedded networks.
  • Robust Security Suite: Multiple hardware security blocks (A-HAB, ARM TZ, CAAM, CSU, SNVS) support secure boot, cryptography and system integrity mechanisms.
  • Flexible Memory Support: DDR3, LPDDR2 and LVDDR3 controller support enables a range of memory performance and cost trade-offs.
  • Industrial Temperature and Compact Package: −20 °C to 105 °C operating range in a 400-MAPBGA (14×14) surface-mount package for space-constrained embedded designs.

Why Choose MCIMX6X3EVK10ABR?

The MCIMX6X3EVK10ABR positions itself as a balanced embedded processor solution that combines application-level performance with real-time responsiveness and extensive peripheral integration. Its dual-core ARM architecture, multimedia acceleration, broad memory interface support and hardware security features make it suitable for designs that require both rich user interfaces and deterministic control.

Designed for industrial and medical environments, the device’s wired connectivity, multiple USB PHYs and compact BGA package support scalable, integrated system designs that benefit from hardware-level security and a defined operating temperature range.

Request a quote or submit an inquiry for pricing and availability to move your design forward with the MCIMX6X3EVK10ABR.

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