MCIMX6X3EVK10AB
| Part Description |
ARM® Cortex®-A9, ARM® Cortex®-M4 Microprocessor IC i.MX6SX 2 Core, 32-Bit 1GHz, 227MHz 400-MAPBGA (14x14) |
|---|---|
| Quantity | 167 Available (as of October 9, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6X |
| Manufacturer | NXP Semiconductors |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 0 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ MPE | Core Processor | ARM® Cortex®-A9, ARM® Cortex®-M4 | Device Package | 400-MAPBGA (14x14) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Keypad, LCD | ECCN | N/A | Ethernet | 10/100/1000Mbps (2) | ||
| Graphics Acceleration | Yes | HTS Code | N/A | Moisture Sensitivity Level | N/A | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 32-Bit | ||
| Operating Temperature | -20°C ~ 105°C (TJ) | Package / Case | 400-LFBGA | RAM Controllers | DDR3, DDR3L, LPDDR2 | ||
| REACH Compliance | REACH Unknown | RoHS Compliance | ROHS3 Compliant | Security Features | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | ||
| Speed | 1GHz, 227MHz | Supplier Device Package | 400-MAPBGA (14×14) | USB | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | ||
| Voltage – I/O | 1.8V, 2.5V, 2.8V, 3.15V |
Overview of MCIMX6X3EVK10AB – IC MPU I.MX6SX 1GHZ 400MAPBGA
The MCIMX6X3EVK10AB is an NXP Semiconductors microprocessor IC based on the i.MX 6X series. It integrates ARM® Cortex®-A9 and ARM® Cortex®-M4 cores, delivering dual-core 32-bit processing including a 1 GHz application core and a 227 MHz microcontroller core in a 400-MAPBGA (14×14) package.
Designed for embedded systems, the device combines multimedia acceleration, extensive connectivity and hardware security features to support integrated, performance-oriented designs.
Key Features
- Core Architecture ARM® Cortex®-A9 and ARM® Cortex®-M4 dual-core 32-bit configuration with a 1 GHz primary core and a 227 MHz secondary core for mixed application and real-time tasks.
- Multimedia and DSP Includes multimedia co-processors and NEON™ MPE for enhanced media processing and vector operations.
- Memory Controllers Supports DDR3, DDR3L and LPDDR2 memory interfaces for flexible memory subsystem design.
- Display and UI Display interface controllers for LCD and keypad support to enable user interface integration.
- Ethernet and USB Connectivity Dual 10/100/1000 Mbps Ethernet ports and multiple USB interfaces: USB 2.0 + PHY (1) and USB 2.0 OTG + PHY (2).
- Additional Interfaces Includes CANbus support to integrate with vehicle networks and control systems.
- Security Features Hardware security suite including A-HAB, ARM TrustZone (ARM TZ), CAAM, CSU, SNVS, System JTAG and TVDECODE for secure boot and system protection.
- Graphics Acceleration On-chip graphics acceleration to support graphical user interfaces and multimedia rendering.
- Package and Mounting Supplied in a 400-MAPBGA (14×14) 400-LFBGA form factor for surface-mount PCB assembly.
- Operating Temperature Rated for operation from -20°C to 105°C.
- RoHS Compliance RoHS compliant.
Typical Applications
- Embedded systems Embedded designs that require combined application and microcontroller processing using ARM® Cortex®-A9 and Cortex®-M4 cores.
- Connected devices Networked products leveraging dual 10/100/1000 Mbps Ethernet and multiple USB interfaces for data and peripheral connectivity.
- User interfaces Systems requiring LCD and keypad support plus graphics acceleration for responsive GUIs and multimedia.
Unique Advantages
- Dual-core processing: Combines a high-speed 1 GHz Cortex‑A9 core with a 227 MHz Cortex‑M4 core to separate application and real-time workloads.
- Broad memory support: DDR3, DDR3L and LPDDR2 controller compatibility enables flexible memory choices to match system cost and performance targets.
- Integrated connectivity: Built-in dual gigabit Ethernet, USB 2.0 with PHY and CANbus reduce external component count for connected designs.
- Comprehensive security: Multiple hardware security blocks including A‑HAB, ARM TZ and CAAM support secure boot and system integrity.
- Graphics and multimedia: On-chip multimedia accelerators and NEON™ MPE enable enhanced media processing and GUI responsiveness.
- Industry-ready package and temperature range: 400-MAPBGA surface-mount package and -20°C to 105°C operating range support a wide set of embedded deployment scenarios.
Why Choose MCIMX6X3EVK10AB?
The MCIMX6X3EVK10AB positions itself as a highly integrated microprocessor for embedded designs that need both application-level performance and real-time control. With dual ARM cores, multimedia acceleration, multiple high-speed interfaces and a robust set of hardware security features, it supports designs that require consolidated functionality in a single device.
Ideal for engineers developing networked and human-interface centric embedded products, this NXP i.MX 6X device offers a balance of processing capability, connectivity and on-chip security while fitting standard surface-mount assembly and temperature requirements.
Request a quote or submit a purchase inquiry for MCIMX6X3EVK10AB to receive pricing and availability information tailored to your design and production needs.

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