MCIMX6X3EVK10AB

IC MPU I.MX6SX 1GHZ 400MAPBGA
Part Description

ARM® Cortex®-A9, ARM® Cortex®-M4 Microprocessor IC i.MX6SX 2 Core, 32-Bit 1GHz, 227MHz 400-MAPBGA (14x14)

Quantity 167 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6X
ManufacturerNXP Semiconductors
Manufacturing StatusActive
Manufacturer Standard Lead Time0 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A9, ARM® Cortex®-M4Device Package400-MAPBGA (14x14)
Display & Interface ControllersKeypad, LCDECCNN/AEthernet10/100/1000Mbps (2)
Graphics AccelerationYesHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-20°C ~ 105°C (TJ)Package / Case400-LFBGARAM ControllersDDR3, DDR3L, LPDDR2
REACH ComplianceREACH UnknownRoHS ComplianceROHS3 CompliantSecurity FeaturesA-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Speed1GHz, 227MHzSupplier Device Package400-MAPBGA (14×14)USBUSB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.15V

Overview of MCIMX6X3EVK10AB – IC MPU I.MX6SX 1GHZ 400MAPBGA

The MCIMX6X3EVK10AB is an NXP Semiconductors microprocessor IC based on the i.MX 6X series. It integrates ARM® Cortex®-A9 and ARM® Cortex®-M4 cores, delivering dual-core 32-bit processing including a 1 GHz application core and a 227 MHz microcontroller core in a 400-MAPBGA (14×14) package.

Designed for embedded systems, the device combines multimedia acceleration, extensive connectivity and hardware security features to support integrated, performance-oriented designs.

Key Features

  • Core Architecture  ARM® Cortex®-A9 and ARM® Cortex®-M4 dual-core 32-bit configuration with a 1 GHz primary core and a 227 MHz secondary core for mixed application and real-time tasks.
  • Multimedia and DSP  Includes multimedia co-processors and NEON™ MPE for enhanced media processing and vector operations.
  • Memory Controllers  Supports DDR3, DDR3L and LPDDR2 memory interfaces for flexible memory subsystem design.
  • Display and UI  Display interface controllers for LCD and keypad support to enable user interface integration.
  • Ethernet and USB Connectivity  Dual 10/100/1000 Mbps Ethernet ports and multiple USB interfaces: USB 2.0 + PHY (1) and USB 2.0 OTG + PHY (2).
  • Additional Interfaces  Includes CANbus support to integrate with vehicle networks and control systems.
  • Security Features  Hardware security suite including A-HAB, ARM TrustZone (ARM TZ), CAAM, CSU, SNVS, System JTAG and TVDECODE for secure boot and system protection.
  • Graphics Acceleration  On-chip graphics acceleration to support graphical user interfaces and multimedia rendering.
  • Package and Mounting  Supplied in a 400-MAPBGA (14×14) 400-LFBGA form factor for surface-mount PCB assembly.
  • Operating Temperature  Rated for operation from -20°C to 105°C.
  • RoHS Compliance  RoHS compliant.

Typical Applications

  • Embedded systems  Embedded designs that require combined application and microcontroller processing using ARM® Cortex®-A9 and Cortex®-M4 cores.
  • Connected devices  Networked products leveraging dual 10/100/1000 Mbps Ethernet and multiple USB interfaces for data and peripheral connectivity.
  • User interfaces  Systems requiring LCD and keypad support plus graphics acceleration for responsive GUIs and multimedia.

Unique Advantages

  • Dual-core processing: Combines a high-speed 1 GHz Cortex‑A9 core with a 227 MHz Cortex‑M4 core to separate application and real-time workloads.
  • Broad memory support: DDR3, DDR3L and LPDDR2 controller compatibility enables flexible memory choices to match system cost and performance targets.
  • Integrated connectivity: Built-in dual gigabit Ethernet, USB 2.0 with PHY and CANbus reduce external component count for connected designs.
  • Comprehensive security: Multiple hardware security blocks including A‑HAB, ARM TZ and CAAM support secure boot and system integrity.
  • Graphics and multimedia: On-chip multimedia accelerators and NEON™ MPE enable enhanced media processing and GUI responsiveness.
  • Industry-ready package and temperature range: 400-MAPBGA surface-mount package and -20°C to 105°C operating range support a wide set of embedded deployment scenarios.

Why Choose MCIMX6X3EVK10AB?

The MCIMX6X3EVK10AB positions itself as a highly integrated microprocessor for embedded designs that need both application-level performance and real-time control. With dual ARM cores, multimedia acceleration, multiple high-speed interfaces and a robust set of hardware security features, it supports designs that require consolidated functionality in a single device.

Ideal for engineers developing networked and human-interface centric embedded products, this NXP i.MX 6X device offers a balance of processing capability, connectivity and on-chip security while fitting standard surface-mount assembly and temperature requirements.

Request a quote or submit a purchase inquiry for MCIMX6X3EVK10AB to receive pricing and availability information tailored to your design and production needs.

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