MCIMX6X3CVN08AB
| Part Description |
ARM® Cortex®-A9, ARM® Cortex®-M4 Microprocessor IC i.MX6SX 2 Core, 32-Bit 200MHz, 800MHz 400-MAPBGA (17x17) |
|---|---|
| Quantity | 920 Available (as of October 9, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6X |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Not For New Designs |
| Manufacturer Standard Lead Time | 15 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ MPE | Core Processor | ARM® Cortex®-A9, ARM® Cortex®-M4 | Device Package | 400-MAPBGA (17x17) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Keypad, LCD | ECCN | 5A992C | Ethernet | 10/100/1000Mbps (2) | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 105°C (TA) | Package / Case | 400-LFBGA | RAM Controllers | LPDDR2, LVDDR3, DDR3 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | ||
| Speed | 200MHz, 800MHz | Supplier Device Package | 400-MAPBGA (17×17) | USB | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | ||
| Voltage – I/O | 1.8V, 2.5V, 2.8V, 3.15V |
Overview of MCIMX6X3CVN08AB – IC MPU I.MX6SX 800MHZ 400MAPBGA
The MCIMX6X3CVN08AB is an i.MX 6SX series microprocessor IC integrating ARM® Cortex®‑A9 and ARM® Cortex®‑M4 cores in a heterogeneous, dual‑core architecture. The device combines high‑performance application processing with a real‑time microcontroller core to address embedded designs requiring mixed application and control tasks.
Targeted for embedded and industrial applications, this module delivers integrated peripherals, security engines and broad memory support to simplify platform design while supporting demanding HMI, multimedia and networking use cases.
Key Features
- Dual‑Core Architecture ARM® Cortex®‑A9 and ARM® Cortex®‑M4 cores with operating points up to 800 MHz and 200 MHz respectively, providing application processing and real‑time control on a single device.
- Memory Support On‑chip memory controllers supporting LPDDR2, LVDDR3 and DDR3 memory types for flexible system memory configurations.
- Multimedia and Graphics Graphics acceleration and multimedia DSP support with NEON™ MPE to enable GUI and media processing workloads.
- Display and Audio Interfaces Integrated display interface controllers (LCD, keypad) plus AC'97 for legacy audio connectivity.
- High‑Speed Networking Two 10/100/1000 Mbps Ethernet interfaces for robust wired networking and simultaneous data streams.
- USB Connectivity Multiple USB options including one USB 2.0 host + PHY and two USB 2.0 OTG + PHY interfaces for peripheral and host connectivity.
- Security and System Integrity Hardware security features including A‑HAB, ARM TrustZone, CAAM, CSU, SNVS, System JTAG and TVDECODE to support secure boot and runtime protections.
- Package and Mounting 400‑MAPBGA package (17 × 17 mm) in a surface‑mount format suitable for compact, high‑density designs.
- Industrial Qualification and Temperature Range Industrial qualification with an operating temperature range of −40 °C to 105 °C for deployment in harsh environments.
Typical Applications
- Infotainment and HMI High‑performance application processing and graphics acceleration support multimedia user interfaces and display systems.
- Industrial Control Heterogeneous cores provide real‑time control alongside application tasks for factory automation and machine control platforms.
- Networking and Communication Appliances Dual Gigabit Ethernet interfaces enable wired connectivity for routers, gateways and communication devices.
- Embedded Media Devices Integrated multimedia engines and display interfaces support media boxes, smart monitors and connected set‑top applications.
Unique Advantages
- Heterogeneous Processing in One Device: Consolidates application and real‑time control cores to reduce component count and simplify system architecture.
- Comprehensive Security Suite: Built‑in hardware security blocks (A‑HAB, TrustZone, CAAM, CSU, SNVS) enable secure boot and runtime protection strategies.
- Flexible Memory Options: Support for LPDDR2, LVDDR3 and DDR3 enables designers to choose memory configurations that match performance, cost and power targets.
- Rich I/O Integration: Multiple Ethernet ports, USB host/OTG, display and audio interfaces lower BOM complexity and accelerate integration.
- Industrial Temperature Rating: −40 °C to 105 °C operation suits deployments requiring wide temperature resilience.
- Compact, Surface‑Mount Package: 400‑MAPBGA (17×17 mm) package enables dense board layouts for space‑constrained systems.
Why Choose MCIMX6X3CVN08AB?
The MCIMX6X3CVN08AB positions itself as a scalable, integrated solution for embedded designs that require both application‑level performance and tightly coupled real‑time control. With dual ARM cores, broad memory compatibility, multiple high‑speed interfaces and a comprehensive hardware security feature set, it simplifies system design while addressing performance and reliability needs.
This device is well suited for developers building industrial, HMI, infotainment and networking products who need a compact, industrial‑qualified MPU platform with integrated multimedia, networking and security capabilities.
Request a quote or submit a pricing inquiry to get product availability, lead times and volume pricing for the MCIMX6X3CVN08AB. Our team will respond with the information needed to move your design forward.

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