MCIMX6X3CVK08ACR

IC MPU I.MX6SX 800MHZ 400MAPBGA
Part Description

ARM® Cortex®-A9, ARM® Cortex®-M4 Microprocessor IC i.MX6SX 2 Core, 32-Bit 200MHz, 800MHz 400-MAPBGA (14x14)

Quantity 331 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6X
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A9, ARM® Cortex®-M4Device Package400-MAPBGA (14x14)
Display & Interface ControllersKeypad, LCDECCNN/AEthernet10/100/1000Mbps (2)
Graphics AccelerationYesHTS CodeN/AMoisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TA)Package / Case400-LFBGARAM ControllersDDR3, LPDDR2, LVDDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesA-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Speed200MHz, 800MHzSupplier Device Package400-MAPBGA (14×14)USBUSB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.15V

Overview of MCIMX6X3CVK08ACR – i.MX 6SX Dual‑Core MPU, 800 MHz / Cortex‑M4

The MCIMX6X3CVK08ACR is an NXP i.MX 6SX microprocessor family device combining an ARM® Cortex®‑A9 application core and an ARM® Cortex®‑M4 real‑time core in a single package. The device targets industrial and medical embedded systems that require responsive user interfaces, multimedia acceleration and integrated connectivity.

With heterogeneous multi‑core architecture, on‑chip graphics support and extensive security features, this MPU delivers a balance of performance, integration and system‑level features for graphically rich, connected embedded designs.

Key Features

  • Cores and Performance — Heterogeneous architecture with an ARM® Cortex®‑A9 application processor (up to 800 MHz) plus an ARM® Cortex®‑M4 real‑time core (Cortex‑M4 operation noted in the series documentation up to 227 MHz), enabling split workloads between high‑level OS and deterministic tasks.
  • Memory Interfaces — Supports DDR3, LPDDR2 and LVDDR3 memory controllers for flexible system memory configurations and bandwidth scaling.
  • Multimedia and Graphics — Integrated GPU capable of supporting 2D and 3D operations and graphics acceleration for responsive, visually rich user interfaces.
  • Connectivity — Dual Gigabit Ethernet ports (10/100/1000 Mbps) and multiple USB controllers including USB 2.0 + PHY and USB 2.0 OTG + PHY provide robust wired I/O options.
  • Peripheral Interfaces — Display interface support (LCD, keypad), AC'97 audio interface and a broad set of peripheral connectivity to simplify system integration.
  • Security and Debug — Hardware security features including A‑HAB, ARM TrustZone, CAAM, CSU, SNVS, System JTAG and TVDECODE for secure boot, cryptography and secure system management.
  • System Integration — Integrated power management and on‑chip oscillators described in the series documentation streamline power tree design and board‑level implementation.
  • Package and Temperature — 400‑MAPBGA (14 × 14 mm) surface‑mount package; industrial operating temperature range −40 °C to 105 °C and RoHS compliant.

Typical Applications

  • Industrial HMI and Control — Drives graphically rich touchscreen interfaces and handles networked control with dual Gigabit Ethernet and multimedia acceleration.
  • Medical Devices — Supports responsive UI and secure processing for medical instrumentation requiring reliable operation across industrial temperature ranges.
  • Connected Embedded Systems — Provides wired connectivity, USB OTG and peripheral interfaces for routers, gateways and integrated appliances.
  • Secure Systems — Hardware security modules and secure boot features enable designs that require cryptographic processing and trusted execution.

Unique Advantages

  • Heterogeneous processing: Combination of Cortex‑A9 and Cortex‑M4 cores enables separation of application and real‑time tasks to optimize responsiveness and determinism.
  • High integration: On‑chip graphics, integrated power management and a wide set of interfaces reduce external component count and simplify BOM.
  • Comprehensive security: Multiple hardware security blocks support secure boot, cryptography and system isolation for protected applications.
  • Industrial readiness: Industrial temperature rating (−40 °C to 105 °C) and RoHS compliance support deployment in demanding environments.
  • Flexible memory support: DDR3/LPDDR2/LVDDR3 controller options allow designers to tailor memory type and performance to application needs.

Why Choose MCIMX6X3CVK08ACR?

The MCIMX6X3CVK08ACR positions itself as a versatile embedded MPU that blends application‑level processing and real‑time control with multimedia and security capabilities. Its dual‑core architecture, integrated graphics acceleration and broad connectivity options make it suitable for industrial and medical designs that require responsive UIs, deterministic peripheral control and secure operation.

Designed for engineers seeking a compact, highly integrated solution in a 400‑MAPBGA package, this i.MX 6SX device offers long‑term design value through flexible memory support, extensive I/O and hardware security features documented in the series technical data.

Request a quote or submit a product inquiry to receive pricing and availability for the MCIMX6X3CVK08ACR. Our team can provide order details and datasheet support to help integrate this MPU into your next embedded design.

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