MCIMX6X3CVO08AB
| Part Description |
ARM® Cortex®-A9, ARM® Cortex®-M4 Microprocessor IC i.MX6SX 2 Core, 32-Bit 200MHz, 800MHz 400-MAPBGA (17x17) |
|---|---|
| Quantity | 500 Available (as of October 9, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6X |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Not For New Designs |
| Manufacturer Standard Lead Time | 15 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ MPE | Core Processor | ARM® Cortex®-A9, ARM® Cortex®-M4 | Device Package | 400-MAPBGA (17x17) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Keypad, LCD | ECCN | 5A992C | Ethernet | 10/100/1000Mbps (2) | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 105°C (TA) | Package / Case | 400-LFBGA | RAM Controllers | LPDDR2, LVDDR3, DDR3 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | ||
| Speed | 200MHz, 800MHz | Supplier Device Package | 400-MAPBGA (17×17) | USB | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | ||
| Voltage – I/O | 1.8V, 2.5V, 2.8V, 3.15V |
Overview of MCIMX6X3CVO08AB – IC MPU I.MX6SX 800MHZ 400MAPBGA
The MCIMX6X3CVO08AB is an NXP i.MX 6X series microprocessor IC integrating an ARM® Cortex®-A9 application core and an ARM® Cortex®-M4 companion core. The device combines an 800 MHz Cortex-A9 execution engine with a 200 MHz Cortex-M4 real-time controller to address embedded and industrial applications requiring concurrent application processing and deterministic control.
Designed for embedded and industrial markets, this package-level solution emphasizes system integration with multiple high‑speed interfaces, hardware multimedia acceleration and industrial temperature qualification for reliable operation from -40 °C to 105 °C.
Key Features
- Dual-Core Architecture ARM® Cortex®-A9 and ARM® Cortex®-M4 cores in a dual-core configuration; the product description specifies 800 MHz and 200 MHz operation respectively for each core.
- Core Capabilities 32-bit cores with multimedia DSP support including NEON™ MPE for enhanced media processing.
- Memory Controllers Integrated controllers supporting LPDDR2, LVDDR3 and DDR3 memory types for flexible system memory configurations.
- Display and HMI On-chip display interface controllers including LCD and keypad support; graphics acceleration is indicated for GUI and multimedia displays.
- Networking Two 10/100/1000 Mbps Ethernet controllers for gigabit networking and dual‑port connectivity.
- USB Connectivity Multiple USB options: USB 2.0 + PHY (1) and USB 2.0 OTG + PHY (2) for host, device and OTG use cases.
- Audio and Additional I/O Includes AC'97 interface support for legacy audio and codec connectivity.
- Security and System Features Hardware security and system management features listed include A‑HAB, ARM TrustZone, CAAM, CSU, SNVS, System JTAG and TVDECODE for secure boot and system integrity functions.
- Package and Mounting Supplied in a 400‑MAPBGA (17 × 17) package, surface mount; supplier package case noted as 400‑LFBGA.
- Industrial Qualification and Temperature Range Qualification: Industrial; operating temperature specified from -40 °C to 105 °C for industrial deployments.
- RoHS Compliance RoHS compliant for environmental and assembly compliance.
Typical Applications
- Industrial HMI and Control Panels Use the Cortex‑A9 core for graphical interfaces and the Cortex‑M4 for deterministic control tasks, while industrial temperature qualification supports factory environments.
- Embedded Networking Appliances Dual Gigabit Ethernet ports enable use in networked gateways, routers or edge devices that require high‑speed connectivity.
- Multimedia and Display Systems Graphics acceleration, LCD interface support and multimedia DSP capabilities make it suitable for media players, information displays and kiosks.
- USB‑Enabled Devices Multiple USB ports including OTG allow integration of host/device peripherals, storage, and connectivity modules.
Unique Advantages
- Heterogeneous Processing: Combination of an ARM® Cortex®‑A9 and Cortex®‑M4 enables separation of application and real‑time workloads without external microcontrollers.
- Integrated Connectivity: Built‑in Gigabit Ethernet and multiple USB PHYs reduce external component count for networked embedded systems.
- Security and System Integrity: On‑chip security engines and system management features support secure boot, cryptographic acceleration and runtime protection.
- Memory Flexibility: Support for LPDDR2, LVDDR3 and DDR3 memory types allows designers to optimize performance and cost for varied system requirements.
- Industrial Ready: Industrial qualification and wide operating temperature range support deployment in harsh and temperature‑sensitive environments.
Why Choose MCIMX6X3CVO08AB?
The MCIMX6X3CVO08AB positions itself as a highly integrated embedded processor option combining application-level performance with real‑time control in a single package. Its mix of connectivity, multimedia capability, hardware security and industrial temperature qualification makes it suitable for developers building robust embedded systems that require both GUI/media handling and deterministic I/O control.
Backed by the i.MX 6 series development ecosystem and NXP documentation, this device offers a path for scalable product development where integration, security and industrial reliability are priorities.
Request a quote or submit an inquiry to check pricing and availability for the MCIMX6X3CVO08AB for your next embedded or industrial design project.

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