MCIMX6X3CVO08AB

IC MPU I.MX6SX 800MHZ 400MAPBGA
Part Description

ARM® Cortex®-A9, ARM® Cortex®-M4 Microprocessor IC i.MX6SX 2 Core, 32-Bit 200MHz, 800MHz 400-MAPBGA (17x17)

Quantity 500 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6X
ManufacturerNXP USA Inc.
Manufacturing StatusNot For New Designs
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A9, ARM® Cortex®-M4Device Package400-MAPBGA (17x17)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (2)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TA)Package / Case400-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesA-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Speed200MHz, 800MHzSupplier Device Package400-MAPBGA (17×17)USBUSB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.15V

Overview of MCIMX6X3CVO08AB – IC MPU I.MX6SX 800MHZ 400MAPBGA

The MCIMX6X3CVO08AB is an NXP i.MX 6X series microprocessor IC integrating an ARM® Cortex®-A9 application core and an ARM® Cortex®-M4 companion core. The device combines an 800 MHz Cortex-A9 execution engine with a 200 MHz Cortex-M4 real-time controller to address embedded and industrial applications requiring concurrent application processing and deterministic control.

Designed for embedded and industrial markets, this package-level solution emphasizes system integration with multiple high‑speed interfaces, hardware multimedia acceleration and industrial temperature qualification for reliable operation from -40 °C to 105 °C.

Key Features

  • Dual-Core Architecture  ARM® Cortex®-A9 and ARM® Cortex®-M4 cores in a dual-core configuration; the product description specifies 800 MHz and 200 MHz operation respectively for each core.
  • Core Capabilities  32-bit cores with multimedia DSP support including NEON™ MPE for enhanced media processing.
  • Memory Controllers  Integrated controllers supporting LPDDR2, LVDDR3 and DDR3 memory types for flexible system memory configurations.
  • Display and HMI  On-chip display interface controllers including LCD and keypad support; graphics acceleration is indicated for GUI and multimedia displays.
  • Networking  Two 10/100/1000 Mbps Ethernet controllers for gigabit networking and dual‑port connectivity.
  • USB Connectivity  Multiple USB options: USB 2.0 + PHY (1) and USB 2.0 OTG + PHY (2) for host, device and OTG use cases.
  • Audio and Additional I/O  Includes AC'97 interface support for legacy audio and codec connectivity.
  • Security and System Features  Hardware security and system management features listed include A‑HAB, ARM TrustZone, CAAM, CSU, SNVS, System JTAG and TVDECODE for secure boot and system integrity functions.
  • Package and Mounting  Supplied in a 400‑MAPBGA (17 × 17) package, surface mount; supplier package case noted as 400‑LFBGA.
  • Industrial Qualification and Temperature Range  Qualification: Industrial; operating temperature specified from -40 °C to 105 °C for industrial deployments.
  • RoHS Compliance  RoHS compliant for environmental and assembly compliance.

Typical Applications

  • Industrial HMI and Control Panels  Use the Cortex‑A9 core for graphical interfaces and the Cortex‑M4 for deterministic control tasks, while industrial temperature qualification supports factory environments.
  • Embedded Networking Appliances  Dual Gigabit Ethernet ports enable use in networked gateways, routers or edge devices that require high‑speed connectivity.
  • Multimedia and Display Systems  Graphics acceleration, LCD interface support and multimedia DSP capabilities make it suitable for media players, information displays and kiosks.
  • USB‑Enabled Devices  Multiple USB ports including OTG allow integration of host/device peripherals, storage, and connectivity modules.

Unique Advantages

  • Heterogeneous Processing:  Combination of an ARM® Cortex®‑A9 and Cortex®‑M4 enables separation of application and real‑time workloads without external microcontrollers.
  • Integrated Connectivity:  Built‑in Gigabit Ethernet and multiple USB PHYs reduce external component count for networked embedded systems.
  • Security and System Integrity:  On‑chip security engines and system management features support secure boot, cryptographic acceleration and runtime protection.
  • Memory Flexibility:  Support for LPDDR2, LVDDR3 and DDR3 memory types allows designers to optimize performance and cost for varied system requirements.
  • Industrial Ready:  Industrial qualification and wide operating temperature range support deployment in harsh and temperature‑sensitive environments.

Why Choose MCIMX6X3CVO08AB?

The MCIMX6X3CVO08AB positions itself as a highly integrated embedded processor option combining application-level performance with real‑time control in a single package. Its mix of connectivity, multimedia capability, hardware security and industrial temperature qualification makes it suitable for developers building robust embedded systems that require both GUI/media handling and deterministic I/O control.

Backed by the i.MX 6 series development ecosystem and NXP documentation, this device offers a path for scalable product development where integration, security and industrial reliability are priorities.

Request a quote or submit an inquiry to check pricing and availability for the MCIMX6X3CVO08AB for your next embedded or industrial design project.

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