MCIMX6X3CVN08AC
| Part Description |
ARM® Cortex®-A9, ARM® Cortex®-M4 Microprocessor IC i.MX6SX 2 Core, 32-Bit 200MHz, 800MHz 400-MAPBGA (17x17) |
|---|---|
| Quantity | 207 Available (as of October 9, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6X |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 15 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ MPE | Core Processor | ARM® Cortex®-A9, ARM® Cortex®-M4 | Device Package | 400-MAPBGA (17x17) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Keypad, LCD | ECCN | 5A992C | Ethernet | 10/100/1000Mbps (2) | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 105°C (TA) | Package / Case | 400-LFBGA | RAM Controllers | LPDDR2, LVDDR3, DDR3 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | ||
| Speed | 200MHz, 800MHz | Supplier Device Package | 400-MAPBGA (17×17) | USB | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | ||
| Voltage – I/O | 1.8V, 2.5V, 2.8V, 3.15V |
Overview of MCIMX6X3CVN08AC – ARM Cortex-A9 & Cortex-M4 Dual-Core MPU, 800 MHz / 200 MHz, 400‑MAPBGA
The MCIMX6X3CVN08AC is an i.MX 6SoloX family microprocessor integrating an ARM® Cortex®-A9 application core and an ARM® Cortex®-M4 real-time core in a single device. This heterogeneous dual‑core architecture pairs high‑performance application processing with real‑time responsiveness and integrated multimedia capabilities.
Designed for industrial and medical markets that require graphically rich, highly responsive user interfaces, the device delivers a combination of processing, connectivity and security features to support advanced embedded designs with display, audio and networked peripherals.
Key Features
- Dual-Core Architecture — ARM® Cortex®-A9 application core (up to 800 MHz) combined with an ARM® Cortex®-M4 real-time core (200 MHz) for mixed application and control tasks.
- Multimedia and SIMD Acceleration — Integrated multimedia co-processors with NEON™ MPE support to accelerate media and signal processing workloads.
- Memory Interfaces — Built-in controllers for LPDDR2, LVDDR3 and DDR3 memory, with a 32‑bit DDR interface to support system memory configurations.
- Graphics and Display — Graphics acceleration plus display interface support including LCD and keypad controllers for rich user interfaces.
- High‑Speed Networking — Dual Ethernet controllers supporting 10/100/1000 Mbps operation for robust wired networking.
- USB Connectivity — Multiple USB ports including USB 2.0 with PHY and USB 2.0 OTG with PHY for host and OTG device applications.
- Audio and Legacy Interfaces — AC'97 interface for legacy audio and codec connections.
- Industrial Qualification — Specified for industrial use with an operating temperature range of −40°C to 105°C.
- Security and Debug — Comprehensive security features including A‑HAB, ARM TrustZone, CAAM, CSU, SNVS, System JTAG and TVDECODE for secure boot, cryptography and system integrity.
- Package — 400‑MAPBGA package (17 × 17 mm) in a surface‑mount BGA format to support compact board designs.
- Regulatory — RoHS compliant.
- Integrated Power Management — On‑chip power management features described in the i.MX 6SoloX documentation to simplify system power design.
Typical Applications
- Industrial HMI and Control Panels — Drives graphically rich touchscreen displays and controls while handling deterministic I/O and real‑time tasks via the Cortex‑M4 core.
- Medical Devices — Supports user interfaces, imaging front‑ends and secure operation in medical equipment that requires industrial temperature operation.
- Connected Embedded Systems — Dual Gigabit Ethernet and multiple USB options enable networked devices, gateways and equipment requiring robust connectivity.
- Multimedia Terminals — Graphics acceleration and multimedia coprocessors enable responsive 2D/3D and video user interface functionality.
Unique Advantages
- Heterogeneous Processing: Combines an ARM Cortex‑A9 application core (up to 800 MHz) with a Cortex‑M4 real‑time core (200 MHz) to separate UI/compute workloads from deterministic control tasks.
- Broad Memory Support: LPDDR2, LVDDR3 and DDR3 controller support provides flexibility in selecting system memory to match performance and cost targets.
- Integrated Connectivity: Dual Gigabit Ethernet and multiple USB interfaces reduce external components and simplify system integration for networked designs.
- Industry‑Grade Reliability: Industrial qualification and a −40°C to 105°C operating temperature range make the device suitable for demanding environments.
- Comprehensive Security: Hardware security blocks (A‑HAB, ARM TrustZone, CAAM, CSU, SNVS) support secure boot, cryptography and system protection for sensitive applications.
- Compact, Production‑Ready Package: 400‑MAPBGA (17 × 17 mm) surface‑mount package supports compact board layouts while maintaining a high pin count for peripherals.
Why Choose MCIMX6X3CVN08AC?
The MCIMX6X3CVN08AC positions itself as an integrated MPU solution that balances application performance, real‑time control and multimedia capability. Its dual‑core architecture, industrial temperature rating and extensive I/O support make it well suited for embedded systems that demand responsive interfaces, secure operation and robust networking.
Designed as part of NXP’s i.MX 6SoloX family and supported by the corresponding technical documentation, this device is appropriate for engineers building industrial, medical and multimedia‑focused products who need a compact, secure and connectivity‑rich processor platform.
Request a quote or submit your requirements to receive pricing and availability information for the MCIMX6X3CVN08AC. Our team can assist with lead times, volume pricing and technical documentation to help integrate this device into your next embedded design.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
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