MCIMX6X3CVO08AC

The MCIMX6X3CVO08AC is an NXP Semiconductors microprocessor in the i.MX 6X family that combines an ARM® Cortex®-A9 application core and an ARM® Cortex®-M4 real-time core in a heterogeneous dual-core architecture. The device is offered in a 400-ball MAPBGA (17×17 mm) package and is targeted at embedded markets requiring integrated multimedia, secure processing, and robust connectivity.

Documented operating points include an ARM® Cortex®-A9 at 800 MHz alongside an ARM® Cortex®-M4 at 200 MHz, supporting graphically rich user interfaces, real-time control, and industrial-grade deployment scenarios such as advanced industrial and medical applications.

Key Features

• Dual-Core Processing — ARM® Cortex®-A9 and ARM® Cortex®-M4 cores provide a heterogeneous architecture for separating application-level processing from real-time tasks; device-level speeds include 800 MHz (A9) and 200 MHz (M4) as documented.
• Multimedia and DSP — Integrated multimedia capabilities with NEON™ MPE and graphics acceleration to support 2D/3D operations and rich user interfaces.
• Memory Flexibility — Supports LPDDR2, LVDDR3 and DDR3 memory controllers for a range of memory performance and capacity configurations.
• Display and Audio — Display interface controllers including LCD and keypad support, plus AC'97 interface for legacy audio connectivity.
• High-Speed Connectivity — Dual 10/100/1000 Mbps Ethernet ports and USB 2.0 connectivity (one USB 2.0 + PHY and two USB 2.0 OTG + PHY) for extensive wired I/O and peripheral integration.
• Security and Debug — Integrated security features including A-HAB, ARM TrustZone, CAAM, CSU, SNVS, System JTAG and TVDECODE for secure boot, cryptography and system integrity.
• Industrial Qualification & Temperature Range — Industrial-qualified device with an operating temperature range of −40 °C to 105 °C suitable for demanding embedded environments.
• Package & Mounting — Available in 400-MAPBGA (17×17) supplier package and 400-LFBGA package case; surface mount mounting type for board-level integration.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Industrial HMI and Control — Drives graphically rich and responsive operator interfaces while handling real-time control tasks in industrial automation systems.
• Medical Devices — Supports advanced medical and diagnostic equipment that require secure processing, display capabilities, and industrial temperature operation.
• Multimedia and Imaging — Enables systems that interface with displays and camera sensors for imaging, visualization and multimedia processing.
• Networking and Connectivity Gateways — Dual gigabit Ethernet and multiple USB interfaces allow implementation of connectivity gateways and embedded network appliances.

Unique Advantages

• Heterogeneous Dual-Core Architecture: Separates application and real-time workloads using ARM® Cortex®-A9 and Cortex®-M4 cores for responsive UIs and deterministic control.
• Integrated Multimedia and Graphics: NEON™ MPE and graphics acceleration enable 2D/3D operations and rich visual interfaces without extensive external processing.
• Comprehensive Connectivity: Dual gigabit Ethernet and multiple USB 2.0 ports with PHYs simplify high-throughput wired I/O designs.
• Broad Memory Support: LPDDR2, LVDDR3 and DDR3 controller support gives designers flexibility to match performance and cost targets.
• Industrial-Grade Reliability: Industrial qualification and −40 °C to 105 °C operating range support deployment in harsh embedded environments.
• Built-in Security Stack: On-chip security primitives and secure boot features help protect system integrity and sensitive data.

Why Choose MCIMX6X3CVO08AC?

The MCIMX6X3CVO08AC positions itself as a versatile embedded microprocessor for designs that require a balance of application performance, real-time responsiveness, multimedia capability, and industrial robustness. With a dual-core ARM® architecture, comprehensive connectivity options, flexible memory interfaces and integrated security, it addresses the needs of industrial and medical applications that demand reliable operation across a wide temperature range.

Backed by NXP Semiconductors' i.MX documentation and family-level technical detail, this device is suitable for engineers developing compact, secure, and connected embedded systems where integration and deterministic behavior are key design drivers.

Request a quote or submit an inquiry to receive pricing, availability, and additional technical support for MCIMX6X3CVO08AC.