MCIMX6X3EVK10ACR

The MCIMX6X3EVK10ACR is an NXP i.MX6SX-series microprocessor IC that combines an ARM® Cortex®-A9 application core and an ARM® Cortex®-M4 real-time core in a heterogeneous dual‑core architecture. The device couples a high‑performance Cortex‑A9 processing path (up to 1 GHz) with a Cortex‑M4 real‑time engine (227 MHz) to deliver responsive control and multimedia capability in embedded systems.

Designed for embedded, industrial and medical markets, the i.MX6SX integrates graphics acceleration, multiple memory interfaces and a broad set of connectivity and security features to support graphically rich user interfaces, networking and real‑time control in space‑constrained, surface‑mount designs.

Key Features

• Heterogeneous Dual Cores — ARM® Cortex®‑A9 and ARM® Cortex®‑M4 provide application processing and deterministic real‑time control in one device; listed core speeds include 1 GHz for the A9 path and 227 MHz for the M4.
• Memory Interfaces — Integrated controllers for LPDDR2, LVDDR3 and DDR3 memory types enable flexible system memory choices and support for DDR3/DDR3L/LPDDR2‑800 operation as described in technical documentation.
• Graphics and Display — On‑chip graphics acceleration with support for 2D and 3D operations plus display controllers including LCD and LVDS to enable rich human‑machine interfaces and high‑quality displays.
• High‑Speed Connectivity — Dual 10/100/1000 Mbps Ethernet ports and multiple USB interfaces (USB 2.0 + PHY and USB 2.0 OTG + PHY) support robust wired networking and USB connectivity.
• Peripheral and Audio Interfaces — Includes additional interfaces such as AC'97 and camera/display peripheral support for multimedia and sensor integrations.
• Security and System Integrity — Hardware security features including A‑HAB, ARM TrustZone, CAAM, CSU and SNVS, together with System JTAG and TVDECODE, address device authentication and secure operation requirements.
• Package and Mounting — Supplied in a 400‑MAPBGA package (14 × 14 mm, 400‑LFBGA footprint referenced) and designed for surface‑mount assembly to suit compact embedded designs.
• Operating Range — Rated for operation from −20 °C to 105 °C to cover a wide range of industrial temperature conditions.
• RoHS Compliant — Conforms to RoHS environmental requirements for lead‑free designs.
• Integrated Power and System Support — Series documentation describes integrated power management and on‑chip oscillators to simplify system design and power sequencing.

Typical Applications

• Industrial HMI and Control — Use the Cortex‑A9 graphics engine and LCD/LVDS display interfaces to drive advanced human‑machine interfaces while the Cortex‑M4 handles real‑time control tasks.
• Medical Devices — Combines deterministic real‑time processing with secure boot and cryptographic modules to support connected medical instrumentation and secure data handling.
• Embedded Networking Equipment — Dual Gigabit Ethernet and integrated USB interfaces enable high‑throughput networked devices and connected embedded controllers.
• Imaging and Sensor Gateways — Supported camera and multimedia interfaces, plus graphics acceleration, make the device suitable for imaging front‑ends, sensor fusion and display systems.

Unique Advantages

• Balanced Heterogeneous Architecture: Combines high‑performance application processing and deterministic real‑time control in a single silicon die to simplify board design and partitioning of tasks.
• Broad Memory Flexibility: Support for LPDDR2, LVDDR3 and DDR3 memory controllers enables designers to choose memory technologies that match performance and cost targets.
• Integrated Connectivity: Dual GigE and multiple USB interfaces reduce the need for external controllers and lower BOM complexity for connected devices.
• Hardware Security Building Blocks: On‑chip security modules such as A‑HAB, ARM TrustZone and CAAM provide foundations for secure boot, secure storage and authenticated operations.
• Compact Surface‑Mount Packaging: The 400‑MAPBGA (14 × 14 mm) package supports dense, space‑constrained designs while providing the IO density required for displays, Ethernet and multimedia peripherals.
• Industrial Temperature Support: Specified operation from −20 °C to 105 °C accommodates many industrial deployment environments.

Why Choose MCIMX6X3EVK10ACR?

MCIMX6X3EVK10ACR positions itself as a versatile embedded processor solution that merges application‑level performance with real‑time control and integrated multimedia features. Its combination of ARM® Cortex®‑A9 and Cortex®‑M4 cores, broad memory support, graphics acceleration and comprehensive connectivity makes it well suited for industrial, medical and advanced embedded systems that demand both responsive user interfaces and deterministic control.

Backed by NXP technical documentation for the i.MX6SX series, the part offers designers a scalable platform with on‑chip security, integrated power management and peripheral support that streamlines development, reduces external component count and supports long‑term product deployments.

Request a quote or submit an inquiry for MCIMX6X3EVK10ACR to obtain pricing, availability and additional purchasing information for your project.