MCIMX6X3EVN10AC

IC MPU I.MX6SX 1GHZ 400MAPBGA
Part Description

ARM® Cortex®-A9, ARM® Cortex®-M4 Microprocessor IC i.MX6SX 2 Core, 32-Bit 227MHz, 1GHz 400-MAPBGA (17x17)

Quantity 1,932 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6X
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A9, ARM® Cortex®-M4Device Package400-MAPBGA (17x17)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100/1000Mbps (2)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-20°C ~ 105°C (TJ)Package / Case400-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesA-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Speed227MHz, 1GHzSupplier Device Package400-MAPBGA (17×17)USBUSB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.15V

Overview of MCIMX6X3EVN10AC – IC MPU I.MX6SX 1GHZ 400MAPBGA

The MCIMX6X3EVN10AC is an NXP i.MX 6SX family microprocessor IC combining an ARM® Cortex®-A9 application core and an ARM® Cortex®-M4 real-time core in a heterogeneous, dual-core architecture. The device integrates high-performance application processing with a deterministic real-time controller, a GPU for 2D/3D acceleration, and extensive peripheral and security features.

Designed for connected and consumer-focused embedded systems, this device targets applications that require multimedia, display and connectivity integration while offering system-level security and flexible memory support.

Key Features

  • Heterogeneous CPU cores  ARM® Cortex‑A9 application core (up to 1 GHz) plus ARM® Cortex‑M4 real-time core (up to 227 MHz) for combined high-performance and real-time tasks.
  • Dual-core, 32‑bit architecture  Two 32‑bit cores enabling workload partitioning between application and control functions.
  • Multimedia and SIMD acceleration  Integrated multimedia co‑processor and NEON™ MPE for accelerated media and signal processing.
  • Memory controller support  Interfaces for LPDDR2, LVDDR3 and DDR3 memory types to match a range of system memory designs.
  • Graphics and display  GPU capable of supporting 2D and 3D operations plus display interface controllers for LCD and keypad integration.
  • High-speed connectivity  Dual Gigabit Ethernet (10/100/1000 Mbps) and multiple USB interfaces: one USB 2.0 + PHY and two USB 2.0 OTG + PHY ports.
  • Peripheral and audio interfaces  Additional interfaces include AC'97 for legacy audio connectivity and other general-purpose peripherals.
  • Robust security features  A-HAB secure boot, ARM TrustZone, CAAM, CSU, SNVS, System JTAG and TVDECODE for layered platform security.
  • Package and thermal range  Supplied in a 400‑MAPBGA (17 × 17 mm) surface‑mount package; operating temperature −20 °C to 105 °C.
  • Compliance  RoHS compliant.

Typical Applications

  • Connected Consumer Devices  Multimedia and display-enabled products that require integrated application processing with real-time control.
  • Human‑Machine Interfaces (HMI)  Touch and display controllers that benefit from GPU acceleration and LCD/keypad interface support.
  • Embedded Networking and Gateways  Networked products leveraging dual Gigabit Ethernet and multiple USB ports for wired connectivity and peripherals.
  • Sensor and Camera Systems  Systems that combine real-time control (Cortex‑M4) with application processing and multimedia acceleration for camera and sensor data handling.

Unique Advantages

  • Combined application and real‑time processing  The Cortex‑A9 and Cortex‑M4 pairing enables separation of complex OS‑level tasks from deterministic control functions.
  • Integrated multimedia and display support  On‑chip GPU and display controllers reduce external component count for graphics‑enabled designs.
  • Flexible memory interfacing  Support for LPDDR2, LVDDR3 and DDR3 allows designers to choose memory types that match performance and cost targets.
  • Comprehensive security suite  Multiple hardware security blocks provide layered protection for secure boot and run‑time security functions.
  • Extensive connectivity options  Dual Gigabit Ethernet and multiple USB PHYs make the device suitable for high‑bandwidth embedded networking applications.
  • Compact, production‑ready package  400‑MAPBGA (17 × 17 mm) surface‑mount packaging supports high‑density board designs and standard manufacturing processes.

Why Choose MCIMX6X3EVN10AC?

MCIMX6X3EVN10AC positions itself as a versatile embedded processor for designs that require a mix of application performance, real‑time responsiveness and multimedia capability. Its dual‑core Cortex architecture, GPU acceleration and broad peripheral set enable integrated designs for connected consumer and embedded systems.

Backed by the i.MX 6SoloX family documentation, the device offers a clear hardware foundation for projects that need scalable processing, deterministic control and platform security while maintaining a compact board footprint and a wide operating temperature range.

Request a quote or submit an inquiry to obtain pricing, availability and technical information for MCIMX6X3EVN10AC and to discuss how this device fits your design requirements.

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