MCIMX6X3EVN10AB

The MCIMX6X3EVN10AB is a dual-core 32-bit microprocessor IC featuring ARM® Cortex®-A9 and ARM® Cortex®-M4 cores with documented operating points including 227 MHz and 1 GHz. It integrates multimedia acceleration, broad memory-controller support and a rich set of interfaces for connected embedded systems.

Designed for embedded applications that require integrated connectivity, security and graphics capability, this device delivers a balance of performance and system integration in a 400-MAPBGA (14×14) surface-mount package with an operating temperature range of −20 °C to 105 °C.

Key Features

• Core Architecture  ARM® Cortex®-A9 and ARM® Cortex®-M4 dual-core, 32-bit configuration with documented speeds at 227 MHz and 1 GHz to support mixed-control and application processing.
• Multimedia and DSP  Includes multimedia DSP capabilities and NEON™ MPE for compute acceleration of media and signal processing tasks.
• Memory Controllers  Supports DDR3, DDR3L and LPDDR2 memory interfaces to match common embedded memory choices.
• Display and Graphics  LCD and keypad display interface controllers plus graphics acceleration for GUI and display-driven applications.
• Connectivity  Dual 10/100/1000 Mbps Ethernet ports, one USB 2.0 with PHY and two USB 2.0 OTG ports with PHY; additional CANbus interface for in-vehicle or industrial networks.
• Security and Debug  Comprehensive security features include A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG and TVDECODE to support secure boot and system integrity.
• Package & Mounting  400-LFBGA / 400-MAPBGA (14×14) supplier package, surface-mount device optimized for compact embedded board layouts.
• Environmental Range  Rated for operation from −20 °C to 105 °C and RoHS compliant.

Typical Applications

• Industrial Automation  Leverages dual-core processing, Ethernet ports and CANbus for control, networking and sensor interfacing in machine and control systems.
• Human-Machine Interfaces (HMI)  Graphics acceleration and LCD/keypad controllers enable responsive user interfaces and display-driven panels.
• Connected Embedded Gateways  Dual Gigabit Ethernet and multiple USB ports support networked gateway functions and peripheral connectivity.

Unique Advantages

• Dual-core flexibility: Combines ARM Cortex-A9 and Cortex-M4 cores to separate application and real-time control tasks within a single device.
• Integrated multimedia acceleration: NEON™ MPE and multimedia DSP capabilities reduce external acceleration needs and simplify BOM for media-rich applications.
• Broad memory support: DDR3, DDR3L and LPDDR2 controller support lets designers choose the memory type that best fits power and cost targets.
• Robust connectivity suite: Multiple Ethernet ports, USB 2.0 with PHY and CANbus provide extensive on-board interface options for networked and peripheral-rich designs.
• Comprehensive security set: Built-in A-HAB, ARM TZ, CAAM and related modules support secure boot and system-level protection features.
• Thermal and packaging suitability: 400-MAPBGA (14×14) surface-mount package and −20 °C to 105 °C operating range accommodate compact, thermally constrained embedded boards.

Why Choose MCIMX6X3EVN10AB?

The MCIMX6X3EVN10AB positions itself as an integrated embedded processing option combining application and real-time cores, multimedia acceleration, extensive I/O and security features in a compact 400-MAPBGA package. It is suited for designers who need mixed-function processing, multiple wired network interfaces and hardware security primitives in a single IC.

With support for common memory technologies, graphics/display controllers and a wide operating temperature range, this microprocessor IC offers a practical platform for scalable embedded designs where connectivity, media capability and system integrity are required.

Request a quote or submit an inquiry to receive pricing and availability for the MCIMX6X3EVN10AB and see how it fits your next embedded design.