MCIMX6X4CVM08AB

IC MPU I.MX6SX 800MHZ 529MAPBGA
Part Description

ARM® Cortex®-A9, ARM® Cortex®-M4 Microprocessor IC i.MX6SX 2 Core, 32-Bit 200MHz, 800MHz 529-MAPBGA (19x19)

Quantity 1,574 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6X
ManufacturerNXP USA Inc.
Manufacturing StatusNot For New Designs
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A9, ARM® Cortex®-M4Device Package529-MAPBGA (19x19)
Display & Interface ControllersKeypad, LCD, LVDSECCN5A992CEthernet10/100/1000Mbps (2)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TA)Package / Case529-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesA-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Speed200MHz, 800MHzSupplier Device Package529-MAPBGA (19×19)USBUSB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.15V

Overview of MCIMX6X4CVM08AB – ARM Cortex‑A9 + Cortex‑M4 MPU, 800 MHz / 200 MHz, 529‑MAPBGA

The MCIMX6X4CVM08AB is an NXP i.MX 6X series microprocessor IC combining ARM® Cortex®-A9 and ARM® Cortex®-M4 architectures in a dual‑core, 32‑bit device. It is supplied in a 529‑MAPBGA (19×19) surface‑mount package and qualified for industrial applications.

Designed for embedded systems requiring integrated connectivity, multimedia and security, the device provides multiple Ethernet and USB interfaces, graphics acceleration, a broad set of display controllers and a suite of hardware security features—delivering performance and system integration for industrial and embedded designs.

Key Features

  • Dual‑Core Processing  ARM® Cortex®-A9 and ARM® Cortex®-M4 dual‑core architecture; device data lists operating frequencies of 800 MHz and 200 MHz and a 32‑bit, 2‑core configuration.
  • Memory Support  Integrated memory controllers for LPDDR2, LVDDR3 and DDR3, enabling flexible memory choices for performance and power tradeoffs.
  • Connectivity  Two 10/100/1000 Mbps Ethernet interfaces provide dual Gigabit Ethernet capability for high‑speed wired networking.
  • USB  Multiple USB 2.0 interfaces with integrated PHYs: one USB 2.0 + PHY and two USB 2.0 OTG + PHY, supporting host/OTG configurations.
  • Display and Graphics  Graphics acceleration with display interface controllers for keypad, LCD and LVDS, supporting rich HMI and multimedia displays.
  • Security  Comprehensive hardware security features including A‑HAB, ARM TrustZone (ARM TZ), CAAM, CSU, SNVS, System JTAG and TVDECODE for secure boot, crypto and system protection.
  • Co‑Processing and Multimedia  Multimedia co‑processors and NEON™ MPE support for media and signal processing acceleration.
  • Package & Temperature  529‑MAPBGA (19×19) / 529‑LFBGA package, surface mount; industrial operating temperature range from −40 °C to 105 °C.
  • Additional Interfaces  Legacy audio interface support including AC'97 for audio subsystem integration.

Typical Applications

  • High‑performance tablets and media devices  Leverage the dual‑core architecture, graphics acceleration and multimedia co‑processors for responsive user interfaces and media playback.
  • Industrial HMI and embedded monitors  Industrial qualification and wide temperature range make the device suitable for human‑machine interfaces and industrial displays.
  • IPTV and set‑top boxes  Integrated graphics, display controllers and multimedia processing support video‑centric consumer and professional set‑top applications.
  • Smart meters and dedicated embedded terminals  Flexible memory support, security features and multiple network interfaces enable secure, connected embedded endpoints.

Unique Advantages

  • Heterogeneous dual‑core architecture: Combines ARM Cortex‑A9 and Cortex‑M4 cores for partitioning application and real‑time tasks without additional MCU components.
  • Broad connectivity set: Dual Gigabit Ethernet and multiple USB 2.0 controllers with integrated PHYs reduce external interface complexity and BOM count.
  • Integrated multimedia and graphics acceleration: On‑chip graphics acceleration and display controllers streamline HMI and video design integration.
  • Comprehensive hardware security: A suite of security blocks (A‑HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE) supports secure boot and cryptographic functions at the silicon level.
  • Industrial‑grade robustness: Qualification for industrial applications and an operating range of −40 °C to 105 °C support deployments in harsh environments.
  • Flexible memory options: Support for LPDDR2, LVDDR3 and DDR3 provides design flexibility for performance, capacity and power targets.

Why Choose MCIMX6X4CVM08AB?

The MCIMX6X4CVM08AB positions itself as a highly integrated embedded processor option within the i.MX 6X family—blending dual‑core processing, multimedia acceleration, rich I/O and a robust security feature set in a single 529‑MAPBGA package. Its industrial qualification and wide temperature range make it suitable for embedded systems that require both performance and environmental resilience.

Engineers designing connected HMIs, media devices, industrial terminals and smart embedded endpoints will benefit from the device’s connectivity options, flexible memory support and on‑chip security. Coupled with the i.MX 6 Series development ecosystem, this part supports scalable development and long‑term deployment in industrial and embedded product lines.

Request a quote or submit an RFQ for MCIMX6X4CVM08AB to receive pricing and availability information.

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