MCIMX6X4EVM10AB
| Part Description |
ARM® Cortex®-A9, ARM® Cortex®-M4 Microprocessor IC i.MX6SX 2 Core, 32-Bit 227MHz, 1GHz 529-MAPBGA (19x19) |
|---|---|
| Quantity | 789 Available (as of October 9, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6X |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 15 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ MPE | Core Processor | ARM® Cortex®-A9, ARM® Cortex®-M4 | Device Package | 529-MAPBGA (19x19) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Keypad, LCD, LVDS | ECCN | 5A992C | Ethernet | 10/100/1000Mbps (2) | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 32-Bit | ||
| Operating Temperature | -20°C ~ 105°C (TJ) | Package / Case | 529-LFBGA | RAM Controllers | LPDDR2, LVDDR3, DDR3 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | ||
| Speed | 227MHz, 1GHz | Supplier Device Package | 529-MAPBGA (19×19) | USB | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | ||
| Voltage – I/O | 1.8V, 2.5V, 2.8V, 3.15V |
Overview of MCIMX6X4EVM10AB – IC MPU I.MX6SX 1GHZ 529MAPBGA
The MCIMX6X4EVM10AB is an NXP i.MX 6X family microprocessor integrating dual ARM cores—an ARM® Cortex®-A9 application core and an ARM® Cortex®-M4 MCU core—on a single device. It is designed for embedded multimedia and human‑machine interface applications that require heterogeneous processing, combining high-performance application processing with a real‑time microcontroller core.
Targeted use cases include multimedia‑rich systems and embedded HMI designs that benefit from integrated connectivity, display support and hardware security. The device emphasizes performance and system integration to simplify board design and accelerate time to market.
Key Features
- Processing Cores Dual-core architecture combining an ARM® Cortex®-A9 application processor (up to 1 GHz) and an ARM® Cortex®-M4 microcontroller (227 MHz) for heterogeneous task partitioning.
- Memory Interfaces Integrated memory controller support for LPDDR2, LVDDR3 and DDR3 memory types to match a range of system performance and cost targets.
- Graphics & Multimedia On-chip graphics acceleration and multimedia co-processors including NEON™ MPE for enhanced media processing and display handling.
- Display & Audio Interfaces Display controller support including LCD and LVDS plus keypad interface; additional AC'97 audio interface available for legacy audio paths.
- High‑Speed Connectivity Dual Gigabit Ethernet (10/100/1000 Mbps) and multiple USB 2.0 ports including USB 2.0 OTG with PHY for flexible peripheral and network connectivity.
- Security & Debug Hardware security features including A‑HAB, ARM TrustZone, CAAM, CSU, SNVS and System JTAG for secure boot, cryptography and system integrity.
- Package & Thermal Supplied in a 529‑MAPBGA (19 × 19 mm) surface‑mount package with an operating temperature range of −20 °C to 105 °C.
- Compliance RoHS compliant.
Typical Applications
- High‑performance tablets Leverages the dual‑core architecture and graphics acceleration to support multimedia playback and interactive user interfaces.
- Embedded HMI and industrial control Drives LCD/LVDS displays and interfaces with sensors and controls while offloading real‑time tasks to the Cortex‑M4 core.
- Media boxes and set‑top devices Integrates networking and multimedia acceleration for streaming and local media playback applications.
- Connected devices and gateways Dual Gigabit Ethernet and multiple USB ports provide flexible options for networked embedded systems and peripheral connectivity.
Unique Advantages
- Heterogeneous processing A combined Cortex‑A9 and Cortex‑M4 configuration lets designers separate high‑level OS tasks from real‑time control, improving responsiveness and determinism.
- Broad memory support Support for LPDDR2, LVDDR3 and DDR3 memory types enables designers to optimize cost versus performance for their target application.
- Integrated connectivity Dual Gigabit Ethernet and multiple USB 2.0 interfaces reduce external component count and simplify system routing.
- Built‑in security primitives Hardware features such as A‑HAB, TrustZone and CAAM provide a foundation for secure boot and cryptographic functions without adding external security ICs.
- Compact BGA package The 529‑MAPBGA package supports dense system integration in space‑constrained embedded designs.
- Industrial temperature range Rated from −20 °C to 105 °C to accommodate a wide range of embedded operating environments.
Why Choose MCIMX6X4EVM10AB?
MCIMX6X4EVM10AB positions itself as a versatile embedded MPU that combines application‑class performance with a real‑time microcontroller in a single device. Its integrated connectivity, display interfaces and hardware security features reduce bill‑of‑materials and simplify system design for multimedia and HMI‑centric products.
Designers building connected, display‑driven embedded systems will find the device suitable for projects that need a balance of application throughput, real‑time control and secure operation, backed by the i.MX 6 series ecosystem and software support documented for the family.
Request a quote or submit a request for pricing and availability to begin integrating the MCIMX6X4EVM10AB into your design.

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