MCIMX6X4EVM10AB

IC MPU I.MX6SX 1GHZ 529MAPBGA
Part Description

ARM® Cortex®-A9, ARM® Cortex®-M4 Microprocessor IC i.MX6SX 2 Core, 32-Bit 227MHz, 1GHz 529-MAPBGA (19x19)

Quantity 789 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6X
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A9, ARM® Cortex®-M4Device Package529-MAPBGA (19x19)
Display & Interface ControllersKeypad, LCD, LVDSECCN5A992CEthernet10/100/1000Mbps (2)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-20°C ~ 105°C (TJ)Package / Case529-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesA-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Speed227MHz, 1GHzSupplier Device Package529-MAPBGA (19×19)USBUSB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.15V

Overview of MCIMX6X4EVM10AB – IC MPU I.MX6SX 1GHZ 529MAPBGA

The MCIMX6X4EVM10AB is an NXP i.MX 6X family microprocessor integrating dual ARM cores—an ARM® Cortex®-A9 application core and an ARM® Cortex®-M4 MCU core—on a single device. It is designed for embedded multimedia and human‑machine interface applications that require heterogeneous processing, combining high-performance application processing with a real‑time microcontroller core.

Targeted use cases include multimedia‑rich systems and embedded HMI designs that benefit from integrated connectivity, display support and hardware security. The device emphasizes performance and system integration to simplify board design and accelerate time to market.

Key Features

  • Processing Cores  Dual-core architecture combining an ARM® Cortex®-A9 application processor (up to 1 GHz) and an ARM® Cortex®-M4 microcontroller (227 MHz) for heterogeneous task partitioning.
  • Memory Interfaces  Integrated memory controller support for LPDDR2, LVDDR3 and DDR3 memory types to match a range of system performance and cost targets.
  • Graphics & Multimedia  On-chip graphics acceleration and multimedia co-processors including NEON™ MPE for enhanced media processing and display handling.
  • Display & Audio Interfaces  Display controller support including LCD and LVDS plus keypad interface; additional AC'97 audio interface available for legacy audio paths.
  • High‑Speed Connectivity  Dual Gigabit Ethernet (10/100/1000 Mbps) and multiple USB 2.0 ports including USB 2.0 OTG with PHY for flexible peripheral and network connectivity.
  • Security & Debug  Hardware security features including A‑HAB, ARM TrustZone, CAAM, CSU, SNVS and System JTAG for secure boot, cryptography and system integrity.
  • Package & Thermal  Supplied in a 529‑MAPBGA (19 × 19 mm) surface‑mount package with an operating temperature range of −20 °C to 105 °C.
  • Compliance  RoHS compliant.

Typical Applications

  • High‑performance tablets  Leverages the dual‑core architecture and graphics acceleration to support multimedia playback and interactive user interfaces.
  • Embedded HMI and industrial control  Drives LCD/LVDS displays and interfaces with sensors and controls while offloading real‑time tasks to the Cortex‑M4 core.
  • Media boxes and set‑top devices  Integrates networking and multimedia acceleration for streaming and local media playback applications.
  • Connected devices and gateways  Dual Gigabit Ethernet and multiple USB ports provide flexible options for networked embedded systems and peripheral connectivity.

Unique Advantages

  • Heterogeneous processing  A combined Cortex‑A9 and Cortex‑M4 configuration lets designers separate high‑level OS tasks from real‑time control, improving responsiveness and determinism.
  • Broad memory support  Support for LPDDR2, LVDDR3 and DDR3 memory types enables designers to optimize cost versus performance for their target application.
  • Integrated connectivity  Dual Gigabit Ethernet and multiple USB 2.0 interfaces reduce external component count and simplify system routing.
  • Built‑in security primitives  Hardware features such as A‑HAB, TrustZone and CAAM provide a foundation for secure boot and cryptographic functions without adding external security ICs.
  • Compact BGA package  The 529‑MAPBGA package supports dense system integration in space‑constrained embedded designs.
  • Industrial temperature range  Rated from −20 °C to 105 °C to accommodate a wide range of embedded operating environments.

Why Choose MCIMX6X4EVM10AB?

MCIMX6X4EVM10AB positions itself as a versatile embedded MPU that combines application‑class performance with a real‑time microcontroller in a single device. Its integrated connectivity, display interfaces and hardware security features reduce bill‑of‑materials and simplify system design for multimedia and HMI‑centric products.

Designers building connected, display‑driven embedded systems will find the device suitable for projects that need a balance of application throughput, real‑time control and secure operation, backed by the i.MX 6 series ecosystem and software support documented for the family.

Request a quote or submit a request for pricing and availability to begin integrating the MCIMX6X4EVM10AB into your design.

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