Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MCIMX6U6AVM08ADMCIMX6U6AVM08ADNXP SemiconductorsIC MPU I.MX6DL 800MHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
936
MCIMX6U6AVM08ADRMCIMX6U6AVM08ADRNXP SemiconductorsIC MPU I.MX6DL 800MHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
1,316
MCIMX6U6AVM10ACMCIMX6U6AVM10ACNXP SemiconductorsIC MPU I.MX6DL 1GHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
588
MCIMX6U6AVM10ACRMCIMX6U6AVM10ACRNXP SemiconductorsIC MPU I.MX6DL 1GHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
683
MCIMX6U6AVM10ADMCIMX6U6AVM10ADNXP SemiconductorsIC MPU I.MX6DL 1GHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
118
N/AMCIMX6U6AVM10ADRNXP SemiconductorsI.MX 6 SERIES 32-BIT MPU, DUAL AMicroprocessors624-MAPBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ MPE
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI, Keypad, LCD, LVDS, MIPI
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
526
MCIMX6U7CVM08ABMCIMX6U7CVM08ABNXP SemiconductorsIC MPU I.MX6DL 800MHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
442
MCIMX6U7CVM08ACMCIMX6U7CVM08ACNXP SemiconductorsIC MPU I.MX6DL 800MHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
954
MCIMX6U7CVM08ADMCIMX6U7CVM08ADNXP SemiconductorsIC MPU I.MX6DL 800MHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
1,449
MCIMX6U8DVM10ABMCIMX6U8DVM10ABNXP SemiconductorsIC MPU I.MX6DL 1.0GHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
481
MCIMX6U8DVM10ACMCIMX6U8DVM10ACNXP SemiconductorsIC MPU I.MX6DL 1.0GHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
823
MCIMX6U8DVM10ADMCIMX6U8DVM10ADNXP SemiconductorsIC MPU I.MX6DL 1.0GHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
1,645
MCIMX6V2CVM08ABMCIMX6V2CVM08ABNXP SemiconductorsIC MPU I.MX6SLL 800MHZ 400MAPBGAMicroprocessors400-MAPBGA (14x14)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
EPDC, LCD
USB:
USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.2V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
A-HAB, ARM TZ, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (14×14)
905
MCIMX6V7DVN10ABMCIMX6V7DVN10ABNXP SemiconductorsIC MPU I.MX6SLL 1GHZ 432MAPBGAMicroprocessors432-MAPBGA (13x13)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
EPDC, LCD
USB:
USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.2V, 1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
A-HAB, ARM TZ, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
432-TFBGA
Supplier Device Package:
432-MAPBGA (13×13)
1,231
MCIMX6X1AVK08ABMCIMX6X1AVK08ABNXP SemiconductorsIC MPU I.MX6SX 800MHZ 400MAPBGAMicroprocessors400-MAPBGA (14x14)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
200MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (14×14)
79
MCIMX6X1AVK08ACMCIMX6X1AVK08ACNXP SemiconductorsIC MPU I.MX6SX 800MHZ 400MAPBGAMicroprocessors400-MAPBGA (14x14)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
200MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (14×14)
570
MCIMX6X1AVO08ABMCIMX6X1AVO08ABNXP SemiconductorsIC MPU I.MX6SX 800MHZ 400MAPBGAMicroprocessors400-MAPBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
200MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (17×17)
410
N/AMCIMX6X1AVO08ACNXP SemiconductorsIC MPU I.MX6SX 800MHZ 400MAPBGAMicroprocessors400-MAPBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
200MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (17×17)
627
N/AMCIMX6X1AVO08ACRNXP SemiconductorsIC MPU I.MX6SX 800MHZ 400MAPBGAMicroprocessors400-MAPBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
200MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (17×17)
343
MCIMX6X1CVK08ABMCIMX6X1CVK08ABNXP SemiconductorsIC MPU I.MX6SX 800MHZ 400MAPBGAMicroprocessors400-MAPBGA (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
200MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (14×14)
279

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